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Microstructure Characterization of Ni-V Splat Quenched Foils

Published online by Cambridge University Press:  02 July 2020

H. Sieber ,
D.R. Allen  and
J. Perepezko
H. Sieber
Affiliation:
University of Wisconsin - Madison, Department of Material Science and Engineering, 1509 University Avenue, Madison, Wi, 53706, USA
D.R. Allen
Affiliation:
University of Wisconsin - Madison, Department of Material Science and Engineering, 1509 University Avenue, Madison, Wi, 53706, USA
J. Perepezko
Affiliation:
University of Wisconsin - Madison, Department of Material Science and Engineering, 1509 University Avenue, Madison, Wi, 53706, USA
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Although the thickness of splat quenched (SQ) foils is normally less then 100 μm the solidified microstructure is usually not homogenous, but rather is determined by a cooling rate dependent nucleation and growth behavior of the different phases. The cooling rate and thus the microstructure changes significantly with distance from the edge to the middle of the SQ foils. Rapidly quenched nickel-vanadium (Ni-V) foils consist of three phases formed during solidification, a Ni-fcc, a V-bcc and a intermetallic σ phase [1-3]. To interpret the microstructure evolution in detail, a special TEM cross section sample preparation was applied. The SQ foil was ground to 30 μm, glued on a copper grid and ion-milled parallel to the foils (Fig.1a). In Ni-49V SQ foils seven typical microstructure regions (see Fig. 1 b) could be identified and were analyzed in detail by TEM investigations in plan view and cross section geometries. Furthermore, three solidification pathways were identified.

Type
Phase Transformations in Metals and Alloys
Information
Microscopy and Microanalysis , Volume 3 , Issue S2: Proceedings: Microscopy & Microanalysis '97, Microscopy Society of America 55th Annual Meeting, Microbeam Analysis Society 31st Annual Meeting, Histochemical Society 48th Annual Meeting, Cleveland, Ohio, August 10-14, 1997 , August 1997 , pp. 694 - 695
Copyright
Copyright © Microscopy Society of America 1997

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References

[1]Ruhl, R.C., Giessen, B.C., Cohen, M., and Grant, N.J., Mat. Sci. and Eng 2, (1967/68)314.10.1016/0025-5416(68)90050-5CrossRefGoogle Scholar
[2]Gudzenko, V.N. and Polesa, A.F., Fiz. Metal. Metalloved (Phys. Met. Metallog.) 41, (1976)1106.Google Scholar
[3]Allen, D.R., Sieber, H., and Perepezko, J.H., submitted to the 4th Dec. International Conference on Solidification Processing, SP’97, Sheffield/UK, July 7-10 (1997).Google Scholar
[4] The authors gratefully acknowledge the support of NASA (NAGW-2841 and NAG8-1278) and a NASA Graduate Student Researchers Program fellowship (for DRA).Google Scholar