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Large Area and Depth-Profiling Dislocation Imaging and Strain Analysis in Si/SiGe/Si Heterostructures

  • Xin Chen (a1) (a2) (a3), Daniel Zuo (a4), Seongwon Kim (a5), James Mabon (a2), Mauro Sardela (a2), Jianguo Wen (a2) (a6) and Jian-Min Zuo (a1) (a2)...

Abstract

We demonstrate the combined use of large area depth-profiling dislocation imaging and quantitative composition and strain measurement for a strained Si/SiGe/Si sample based on nondestructive techniques of electron beam-induced current (EBIC) and X-ray diffraction reciprocal space mapping (XRD RSM). Depth and improved spatial resolution is achieved for dislocation imaging in EBIC by using different electron beam energies at a low temperature of ~7 K. Images recorded clearly show dislocations distributed in three regions of the sample: deep dislocation networks concentrated in the “strained” SiGe region, shallow misfit dislocations at the top Si/SiGe interface, and threading dislocations connecting the two regions. Dislocation densities at the top of the sample can be measured directly from the EBIC results. XRD RSM reveals separated peaks, allowing a quantitative measurement of composition and strain corresponding to different layers of different composition ratios. High-resolution scanning transmission electron microscopy cross-section analysis clearly shows the individual composition layers and the dislocation lines in the layers, which supports the EBIC and XRD RSM results.

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Corresponding author

*Corresponding author. jianzuo@illinois.edu

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Large Area and Depth-Profiling Dislocation Imaging and Strain Analysis in Si/SiGe/Si Heterostructures

  • Xin Chen (a1) (a2) (a3), Daniel Zuo (a4), Seongwon Kim (a5), James Mabon (a2), Mauro Sardela (a2), Jianguo Wen (a2) (a6) and Jian-Min Zuo (a1) (a2)...

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