Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Coffey, Kevin R.
Barmak, Katayun
Sun, Tik
Warren, Andrew P.
and
Yao, Bo
2013.
Grain boundary and surface scattering in interconnect metals.
p.
1.
Liu, Xuan
Choi, Dooho
Beladi, Hossein
Nuhfer, Noel T.
Rohrer, Gregory S.
and
Barmak, Katayun
2013.
The five-parameter grain boundary character distribution of nanocrystalline tungsten.
Scripta Materialia,
Vol. 69,
Issue. 5,
p.
413.
Choi, Dooho
Liu, Xuan
Schelling, Patrick K.
Coffey, Kevin R.
and
Barmak, Katayun
2014.
Failure of semiclassical models to describe resistivity of nanometric, polycrystalline tungsten films.
Journal of Applied Physics,
Vol. 115,
Issue. 10,
Choi, Dooho
2014.
The electron scattering at grain boundaries in tungsten films.
Microelectronic Engineering,
Vol. 122,
Issue. ,
p.
5.
Rauch, E.F.
and
Véron, M.
2014.
Automated crystal orientation and phase mapping in TEM.
Materials Characterization,
Vol. 98,
Issue. ,
p.
1.
Brons, J. G.
and
Thompson, G. B.
2014.
Orientation Mapping via Precession-Enhanced Electron Diffraction and Its Applications in Materials Science.
JOM,
Vol. 66,
Issue. 1,
p.
165.
Liu, X.
Nuhfer, N.T.
Rollett, A.D.
Sinha, S.
Lee, S.-B.
Carpenter, J.S.
LeDonne, J.E.
Darbal, A.
and
Barmak, K.
2014.
Interfacial orientation and misorientation relationships in nanolamellar Cu/Nb composites using transmission-electron-microscope-based orientation and phase mapping.
Acta Materialia,
Vol. 64,
Issue. ,
p.
333.
Barmak, K.
2014.
Metallic Films for Electronic, Optical and Magnetic Applications.
p.
39.
Vetterick, G.
Baldwin, J. K.
Misra, A.
and
Taheri, M. L.
2014.
Texture evolution in nanocrystalline iron films deposited using biased magnetron sputtering.
Journal of Applied Physics,
Vol. 116,
Issue. 23,
Liu, Xuan
Warren, Andrew P.
Nuhfer, Noel T.
Rollett, Anthony D.
Coffey, Kevin R.
and
Barmak, Katayun
2014.
Comparison of crystal orientation mapping-based and image-based measurement of grain size and grain size distribution in a thin aluminum film.
Acta Materialia,
Vol. 79,
Issue. ,
p.
138.
Barmak, Katayun
Darbal, Amith
Ganesh, Kameswaran J.
Ferreira, Paulo J.
Rickman, Jeffrey M.
Sun, Tik
Yao, Bo
Warren, Andrew P.
and
Coffey, Kevin R.
2014.
Surface and grain boundary scattering in nanometric Cu thin films: A quantitative analysis including twin boundaries.
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films,
Vol. 32,
Issue. 6,
Aebersold, A. Brian
Alexander, Duncan T.L.
and
Hébert, Cécile
2015.
Height-resolved quantification of microstructure and texture in polycrystalline thin films using TEM orientation mapping.
Ultramicroscopy,
Vol. 159,
Issue. ,
p.
112.
Masiukiewicz, Maciej
and
Anweiler, Stanisław
2015.
Two-phase flow phenomena assessment in minichannels for compact heat exchangers using image analysis methods.
Energy Conversion and Management,
Vol. 104,
Issue. ,
p.
44.
Ruiz-Zepeda, Francisco
Arizpe-Zapata, J. Alejandro
Bahena, Daniel
Ponce, Arturo
and
Garcia-Gutierrez, Domingo I.
2015.
Advanced Transmission Electron Microscopy.
p.
31.
Liu, Xuan
Nuhfer, Noel T.
Warren, Andrew P.
Coffey, Kevin R.
Rohrer, Gregory S.
and
Barmak, Katayun
2015.
Grain size dependence of the twin length fraction in nanocrystalline Cu thin films via transmission electron microscopy based orientation mapping.
Journal of Materials Research,
Vol. 30,
Issue. 4,
p.
528.
Rutkowski, B.
Galanis, A.S.
Gil, A.
and
Czyrska-Filemonowicz, A.
2016.
A novel approach to the characterization of thin oxide layers.
Materials Letters,
Vol. 173,
Issue. ,
p.
235.
Meng, Yifei
and
Zuo, Jian-Min
2016.
Three-dimensional nanostructure determination from a large diffraction data set recorded using scanning electron nanodiffraction.
IUCrJ,
Vol. 3,
Issue. 5,
p.
300.
Barmak, Katayun
Liu, Xuan
Darbal, Amith
Nuhfer, N. Thomas
Choi, Dooho
Sun, Tik
Warren, Andrew P.
Coffey, Kevin R.
and
Toney, Michael F.
2016.
On twin density and resistivity of nanometric Cu thin films.
Journal of Applied Physics,
Vol. 120,
Issue. 6,
César, Mathieu
Gall, Daniel
and
Guo, Hong
2016.
Reducing Grain-Boundary Resistivity of Copper Nanowires by Doping.
Physical Review Applied,
Vol. 5,
Issue. 5,
Izadi, Ehsan
Darbal, Amith
Sarkar, Rohit
and
Rajagopalan, Jagannathan
2017.
Grain rotations in ultrafine-grained aluminum films studied using in situ TEM straining with automated crystal orientation mapping.
Materials & Design,
Vol. 113,
Issue. ,
p.
186.