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FIB sample preparation for X-ray microscopy and ROI target cross-sectioning

  • Ehrenfried Zschech (a1), Jürgen Gluch (a1), Rüdiger Rosenkranz (a1), Yvonne Standke (a1) and Sven Niese (a1) (a2)...
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References

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[1] Merkle, A. P. & Gelb, J. “Ascent of 3D X-ray Microscopy in the Laboratory”, Microscopy Today 21 (2013) 1015.
[2] Kong, L. W., Lloyd, J. R., Yeap, K. B., Zschech, E., Rudack, A., Liehr, M. & Diebold, A. “Applying X- ray Microscopy and Finite Element Modelling to Identify the Mechanism of Stress-Assisted Void Growth in Through Silicon Vias”. J. Appl. Phys 110 (2011) 053502.
[3] Knickerbocker, J. U., Kong, L. W., Niese, S., Diebold, A. & Zschech, E. “3D Interconnect Technology”. in “Advanced Interconnects for ULSI Technology” (Eds. M. Baklanov, P. S. Ho & E. Zschech, (John Wiley & Sons Chichester (2012). pp. 437502.
[4] Kwakman, L., Franz, G., Taklo, M., Klumpp, A. & Ramm, P. “Characterization and Failure Analysis of 3D Integrated Systems using a novel plasma-FIB system”. AIP Conf. Proc 1395 (2011) 269.
[5] Stegmann, H., Domer, H., Rosenkranz, R. & Zschech, E. “Efficient Target Preparation by Combined Pulsed Laser Ablation and FIB Milling”. Microscopy and Microanalysis 17 (2011) 658659.

FIB sample preparation for X-ray microscopy and ROI target cross-sectioning

  • Ehrenfried Zschech (a1), Jürgen Gluch (a1), Rüdiger Rosenkranz (a1), Yvonne Standke (a1) and Sven Niese (a1) (a2)...

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