Hostname: page-component-7bb8b95d7b-lvwk9 Total loading time: 0 Render date: 2024-09-21T08:44:00.380Z Has data issue: false hasContentIssue false
  • English
  • Français

Combining Emerging Sample Preparation Methods, SEM, and TEM Investigations for Microelectronics Device Characterization at Multiple Scales

Published online by Cambridge University Press:  05 August 2019

Pawel Nowakowski ,
Cecile Bonifacio ,
Mary Ray  and
Paul Fischione
Pawel Nowakowski*
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA.
Cecile Bonifacio
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA.
Mary Ray
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA.
Paul Fischione
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA, USA.
*
*Corresponding author: p_nowakowski@fischione.com

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Microscopy and Microanalysis for Real-World Problem Solving
Information
Microscopy and Microanalysis , Volume 25 , Supplement S2 , August 2019 , pp. 688 - 689
Copyright
Copyright © Microscopy Society of America 2019 

References

[1]Schaffer, M, Schaffer, B, and Ramasse, Q, Ultramicroscopy 114 (2012), p. 62.Google Scholar
[2]Simon-Najasek, M et al. , Microelectronics Reliability 54 (2014), p. 1785.Google Scholar
[3]Vieweg, BF et al. , Ultramicroscopy 113 (2012), p. 165.Google Scholar
[4]Šikula, M, Hrnčíř, T, and Gounet, P, Proceedings from the 43rd International Symposium for Testing and Failure Analysis (2017), p. 270.Google Scholar
[5]Hsu, H-C et al. , Proceedings from the 43rd International Symposium for Testing and Failure Analysis (2017), p. 256.Google Scholar