Hostname: page-component-78c5997874-v9fdk Total loading time: 0 Render date: 2024-11-17T14:36:41.273Z Has data issue: false hasContentIssue false
  • English
  • Français

Advancement of Heteroepitaxial III-V/Si Thin Films through Defect Characterization

Published online by Cambridge University Press:  25 July 2016

Julia I. Deitz ,
David W. McComb  and
Tyler J. Grassman
Julia I. Deitz
Affiliation:
Dept. of Materials Science & Engineering, The Ohio State University, Columbus, OH, 43210, USA
David W. McComb
Affiliation:
Dept. of Materials Science & Engineering, The Ohio State University, Columbus, OH, 43210, USA
Tyler J. Grassman
Affiliation:
Dept. of Materials Science & Engineering, The Ohio State University, Columbus, OH, 43210, USA Dept. of Electrical & Computer Engineering, The Ohio State University, Columbus, OH, 43210, USA

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 22 , Supplement S3: Proceedings of Microscopy & Microanalysis 2016 , July 2016 , pp. 1538 - 1539
Copyright
© Microscopy Society of America 2016 

References

[1] Grassman, T. J., Brenner, M. R., Rajagopalan, S., Unocic, R., Dehoff, R., Mills, M. J., Fraser, H. & Ringel, S. A. Appl. Phys. Lett 94, 232106 (2009).CrossRefGoogle Scholar
[2] Grassman, T. J., Carlin, J. A., Galiana, B., Yang, L. M., Yang, F., Mills, M. J. & Ringel, S. A. Appl. Phys. Lett 102, 142102 (2013).CrossRefGoogle Scholar
[3] Deitz, J. I., Carnevale, S., Ringel, S. A., McComb, D. W. & Grassman, T. J. J. Vis. Exp (52745R2 2015.Google Scholar
[4] Carnevale, S. D., Deitz, J. I., Grassman, T. J., Carlin, J. A., Picard, Y., De Graef, M. & Ringel, S. Appl. Phys. Lett 104(23), 232111 (2014).CrossRefGoogle Scholar
[5] Carnevale, S. D., Deitz, J. I., Grassman, T. J., Carlin, J. A., Picard, Y., De Graef, M. & Ringel, S. A. IEEE J. PV 5(2), 676 (2015).Google Scholar