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Polyallylamine as an Adhesion Promoter for SU-8 Photoresist

Published online by Cambridge University Press:  17 October 2016

Shiladitya Chatterjee
Department of Chemistry and Biochemistry, Brigham Young University, Provo, UT 84602, USA
George H. Major
Department of Chemistry and Biochemistry, Brigham Young University, Provo, UT 84602, USA
Barry M. Lunt
Department of Information Technology, Brigham Young University, Provo, UT 84602, USA
Massoud Kaykhaii
Department of Chemistry and Biochemistry, Brigham Young University, Provo, UT 84602, USA
Matthew R. Linford*
Department of Chemistry and Biochemistry, Brigham Young University, Provo, UT 84602, USA
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Resist lithography is an important microfabrication technique in the electronics industry. In this, patterns are transferred by irradiation onto a photosensitive polymer. SU-8 has emerged as a favorite photoresist for High Aspect Ratio (HAR) lithography, showing high chemical and mechanical stability and biocompatibility. Unfortunately, its poor adhesion to substrates is a drawback, with possible solutions being the use of low-viscosity SU-8, surface modification with a low molecular weight adsorbate like hexamethyldisilazane (HMDS), or a commercial adhesion promotion reagent. However, HMDS and the commercial reagent require surface dehydration and/or curing, and a modified form of SU-8 is not always desirable. Here, we demonstrate the use of a water-soluble, amine-containing polymer, polyallylamine (PAAm), which spontaneously adsorbs to silica surfaces, as a simple, easy-to-apply, and reactive adhesion promoter for SU-8. Conditions for the use of PAAm are explored, and the resulting materials are characterized by X-ray photoelectron spectroscopy (XPS), spectroscopic ellipsometry (SE), and wetting.

Instrumentation and Techniques Development
© Microscopy Society of America 2016 

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