This work discusses using the automated Electron BackScatter Pattern (EBSP) technique of electron diffraction in the Scanning Electron Microscope (SEM) for measuring grain size in polycrystalline materials. A quantitative analysis of 2-D grain size from a standard metallographic section can be made in less than one hour using an automated-EBSP system on a traditional SEM and dedicated analysis software. Thus, the automated EBSP technique provides a useful and cost-effective way to determine grain size. A common measure used to describe grain size is mean intercept length (MIL) and the present discussion will be limited to determining MIL using EBSP.

Grain size analysis using optical microscopy is strongly influenced by sample preparation, which involves etching of the polished section to reveal boundaries. Boundaries that are to be avoided in determining MIL, such as sub-grain boundaries and twin boundaries, may be revealed and mistaken for random high angle boundaries.