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Digital Image Correlation of Forescatter Detector Images for Simultaneous Strain and Orientation Mapping

Published online by Cambridge University Press:  06 July 2020

Derrik Adams
Affiliation:
Mechanical Engineering Department, Brigham Young University, Provo, UT, USA
Shamoon Irfan
Affiliation:
Mechanical Engineering Department, The NorthCap University, Gurugram, Haryana, India
Jeff Cramer
Affiliation:
Manufacturing Engineering Department, Brigham Young University, Provo, UT, USA
Michael P. Miles
Affiliation:
Manufacturing Engineering Department, Brigham Young University, Provo, UT, USA
Eric R. Homer
Affiliation:
Mechanical Engineering Department, Brigham Young University, Provo, UT, USA
Tyson Brown
Affiliation:
Research & Development Department, General Motors, Warren, MI, USA
Raj K. Mishra
Affiliation:
Research & Development Department, General Motors, Warren, MI, USA
David T. Fullwood
Affiliation:
Mechanical Engineering Department, Brigham Young University, Provo, UT, USA
Corresponding
E-mail address:

Abstract

Improved plasticity models require simultaneous experimental local strain and microstructural evolution data. Microscopy tools, such as electron backscatter diffraction (EBSD), that can monitor transformation at the relevant length-scale, are often incompatible with digital image correlation (DIC) techniques required to determine local deformation. In this paper, the viability of forescatter detector (FSD) images as the basis for the DIC study is investigated. Standard FSD and an integrated EBSD/FSD approach (Pattern Region of Interest Analysis System: PRIAS™) are analyzed. Simultaneous strain and microstructure maps are obtained for tensile deformation of Q&P 1180 steel up to ~14% strain. Tests on an undeformed sample that is simply shifted indicate a standard deviation of error in strain of around 0.4% without additional complications from a deformed surface. The method resolves strain bands at ~2 μm spacing but does not provide significant sub-grain strain resolution. Similar resolution was obtained for mechanically polished and electropolished samples, despite electropolished surfaces presenting a smoother, simpler topography. While the resolution of the PRIAS approach depends upon the EBSD step size, the 80 nm step size used provides seemingly similar resolution as 8,000× (22.7 nm) FSD images. Surface feature evolution prevents DIC analysis across large strain steps (>6% strain), but restarting DIC, using an FSD reference image from an interim strain step, allows reasonable DIC across the stress–strain curve. Furthermore, the data are obtained easily and provide complementary information for EBSD analysis.

Type
Software and Instrumentation
Copyright
Copyright © Microscopy Society of America 2020

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