Fundamental electronic modulations in strained wurtzite III-nitride, in particular InxGa1−xN, quantum wells (QWs) were treated to explore the reason why practical InGaN devices emit bright luminescences in spite of the large threading dislocation (TD) density. The emission mechanisms were shown to vary depending on the well thickness L and InN molar fraction x. The electric field across the QW plane, F, which is a sum of the fields due to spontaneous and piezoelectric polarization and the pn junction field, causes the redshift of the ground state resonance energy through the quantum confined Stark effect (QCSE). The absorption spectrum is modulated by QCSE, quantum-confined Franz-Keldysh effect (QCFK), and Franz-Keldysh (FK) effect from the barrires when, for the first approximation, potential drop across the well (FL) exceeds the valence band discontinuity, EV. Under large FL, holes are confined in the triangular potential well formed at one side of the well. This produces apparent Stokes-like shift in addition to the in-plane net Stokes shift on the absorption spectrum. The QCFK and FK further modulate the electronic structure of the wells with L greater than the three dimensional (3D) free exciton (FE) Bohr radius, aB. When FL exceeds EC, both electron (e) and hole (h) confined levels drop into the triangular potential wells at opposite sides of the wells, which reduces the wavefunction overlap. Doping of Si in the barriers partially screens the F resulting in a smaller Stokes-like shift, shorter recombination decay time, and higher emission efficiency. Finally, the use of InGaN was found to overcome the field-induced oscillator strength lowering due to the spontaneous and piezoelectric polarization. Effective in-plane localization of the QW excitons (confined excitons, or quantized excitons) in quantum disk (Q-disk) size potential minima, which are produced by nonrandom alloy potential fluctuation enhanced by the large bowing parameter and F, produces confined e-h pairs whose wavefunctions are still overlapped when L<aB. Their Coulomb interaction is more pronounced for FL<EV.

We report on the application of infrared spectroscopic ellipsometry (IR-SE) for wavenumbers from 333cm−1 to 1200cm−1 as a novel approach to non-destructive optical characterization of free-carrier and optical phonon properties of group III-nitride heterostructures. Undoped α-GaN, α-AlN, α-AlxGa1−xN (x = 0.17, 0.28, 0.5), and n-type silicon (Si) doped α-GaN layers were grown by metal-organic vapor phase epitaxy (MOVPE) on c-plane sapphire (α-Al2O3). The four-parameter semi-quantum (FPSQ) dielectric lattice-dispersion model and the Drude model for free-carrier response are employed for analysis of the IR-SE data. Model calculations for the ordinary (∈⊥) and extraordinary (∈||) dielectric functions of the heterostructure components provide sensitivity to IR-active phonon frequencies and free-carrier parameters. We observe that the α-AlxGa1−xN layers are unintentionally doped with a back ground free-carrier concentration of 1–4 1018cm−3. The ternary compounds reveal a two-mode behavior in ∈⊥, whereas a one-mode behavior is sufficient to explain the optical response for ∈||. We further provide a precise set of model parameters for calculation of the sapphire infrared dielectric functions which are prerequisites for analysis of infrared spectra of III-nitride heterostructures grown on α-Al2O3.

We report on the composition dependence of the band gap energy of strained hexagonal InxGa1−xN layers on GaN with x≤0.15, grown by metal-organic chemical vapor deposition on sapphire substrates. The composition of the (InGa)N was determined by secondary ion mass spectroscopy. High-resolution X-ray diffraction measurements confirmed that the (InGa)N layers with typical thicknesses of 30 nm are pseudomorphically strained to the in-plane lattice parameter of the underlying GaN. Room-temperature photoreflection spectroscopy and spectroscopic ellipsometry were used to determine the (InGa)N band gap energy. The composition dependence of the band gap energy of the strained (InGa)N layers was found to be given by EG(x)=3.43−3.28 × (eV) for x≤0.15. When correcting for the strain induced shift of the fundamental energy gap, a bowing parameter of 3.2 eV was obtained for the composition dependence of the gap energy of unstrained (InGa)N.

The presence of piezoelectric fields within p-i-n GaN/InGaN multiple quantum well structures is discussed. Time integrated and time-resolved photoluminescence measurements and theoretical calculations of the effect of these fields is presented. Furthermore, a description of how these fields influence the carrier dynamics and a discussion of how the piezoelectric field effects the design of GaN/InGaN devices is presented.

We propose the use of a buffer sublayer made of materials with crystal structure of cubic syngony to eliminate 30° in-plane rotation of (0001) heteroepitaxial wurtzite type AIIIBV nitride films with respect to the (0001) or (110) working surface of the sapphire substrate. In these cases, the lattice parameter mismatch between the sapphire substrate surface and the semiconductor film is much smaller, and the cleavage planes of the sapphire and the semiconductor films with wurtzite structure forming the active region of a heterolaser are parallel. It is shown experimentally that using, for instance, Nb on (0001) Al2O3 or NbN on (110) Al2O3, allows the elimination of the 30° in-plane rotation of the (0001)AlN film with respect to the (0001) or (110) working surface of the sapphire substrate.

The compositional fluctuations of the In content were found in InGaN/GaN quantum wells and it caused the localized states by the potential fluctuation. We have evaluated the optical gain of GaN based quantum well structures with localized states. The localized states are treated as the subband states of the quantum disk-like dots in the well. It was found that the inhomogeneous broadening played an important role in the optical gain and that it should be reduced to use the benefit of the localized states for laser oscillations.

We have studied epitaxial GaN layers grown by hydride vapour phase epitaxy (HVPE) on porous GaN sublayers formed on SiC substrates. It was shown that these layers can be grown with good surface morphology and high crystalline quality. X-ray, Raman and photoluminescent (PL) measurements showed that the stress in the layers grown on porous GaN was reduced to 0.1-0.2 GPa, while the stress in the layers grown directly on 6H-SiC substrates remains at its usual level of about 1 GPa. Thus, we have shown that growth on porous GaN sublayer is a promising method for fabrication of high quality epitaxial layers of GaN with low strain values.

Ambient gas effect on the epitaxial lateral overgrowth (ELO) of GaN via metalorganic vapor-phase epitaxy (MOVPE) on a MOVPE-grown GaN (0001) / sapphire (0001) substrate with a SiO2 stripe mask has been studied by means of field-emission scanning electron microscopy (SEM) and highresolution X-ray diffraction (XRD) analysis. Different ambient gases of nitrogen, hydrogen and their mixture (mixture ratio, hydrogen : nitrogen = 1 : 1) affect the lateral overgrowth rate, the surface morphology and the crystalline tilting of ELO-GaN layers. XRD revealed that the ELO-GaN layer on the SiO2 mask aligned along the <100> direction exhibited anisotropic crystalline tilting toward <110>. For ELO-GaN growth in nitrogen ambient, the growth rate of the (0001) facet decreases, the lateral overgrowth rate increases and the tilting of the ELO-GaN layer increases, while no smooth surface is obtained, in comparison with ELO-GaN growth in hydrogen ambient. For the mixture ambient, a smooth surface with a fast lateral overgrowth rate is achieved and the dislocation density is not more than 107 cm−2, which is comparable to that in hydrogen ambient.

Pendeo-epitaxy of individual GaN and AlxGa12−xN films and single- and multi-layer heterostructures of these materials have been achieved on a columnar GaN seed layer using metallorganic vapor phase epitaxy. These structures have been characterized using scanning electron microscopy and atomic force microscopy. The RMS roughness value of the grown side wall plane (110) of these structures was 0.099 nm.

Optical spectroscopy, including low and room temperature photoluminescence (PL), reflectance, PL measurements in high magnetic fields up to 12 T, and resonantly-enhanced electronic Raman scattering (RERS) in zero and high magnetic field, has been used to investigate exciton and impurity states and surface recombination in high quality heteroepitaxial GaN grown on sapphire and SiC. Theoretical finite-difference calculations of the donor states as a function of magnetic field have been carried out for comparison, including the effects of anisotropy in the effective mass and dielectric constant. Up to six residual donor species are observed in material grown by hydride vapor phase epitaxy (HVPE) and metalorganic chemical vapor deposition (MOCVD) from their n=2 and n=3 two-electron satellites observed in PL and by RERS. The donor-related nature of the relevant transitions is confirmed from their magnetic field dependence, and the spectral resolution is improved at high fields. The Si donor level is determined to have a binding energy of about 21 meV from observation of its two-electron satellite in lightly Si-doped HVPE material. The free exciton binding energy is shown to be about 26.4 meV, independent of strain, based on observations of the n=2 free exciton. The room temperature band-edge PL peak is confirmed to be free excitonic in nature, based on its linewidth and on comparison with simple reflectance measurements. Reflectance from the edge of a thick HVPE layer shows clear evidence of A, B, and C excitons obeying the relevant selection rules at both low and room temperature. Surface chemical treatments are shown to have substantial effects on room temperature PL efficiency. Passivation with ammonium or sodium sulfide solutions, in particular, yields increases in PL efficiency by a factor of five to seven over air-exposed surfaces. The passivation effect is stable in air, lasting at least one month.

Piezoelectric effects in GaN/AlGaN multiple quantum wells (MQWs) have been directly probed by picosecond time-resolved photoluminescence (PL) spectroscopy. The time-resolved PL spectra of the 40 Å well MQWs reveal that the PL transition peak position is in fact blueshifted at early delay times due to the collective effects of quantum confinement of carriers, piezoelectric field, and Coulomb screening. However, the spectral peak position shifts toward lower energies as the delay time increases and becomes redshifted at longer delay times. By comparing experimental and calculation results, we have obtained a low limit of the piezoelectric field strength to be about 560 kV/cm in the 40 Å well GaN/Al0.15Ga0.85N MQWs.

We present a study of the radiative recombination in In0.15Ga0.85N/GaN multiple quantum well samples, where the conditions of growth of the InGaN quantum layers were varied in terms of growth temperature (< 800 °C) and donor doping. The photoluminescence peak position varies strongly (over a range as large as 0.3 eV) with delay time after pulsed excitation, but also with donor doping and with excitation intensity. The peak position is mainly determined by the Stark effect induced by the piezoelectric field. In addition potential fluctuations, originating from segregation effects in the InGaN material, from interface roughness, and the strain fluctuations related to these phenomena, play an important role, and largely determine the width of the emission. These potential fluctuations may be as large as 0.2 eV in the present samples, and appear to be important for all studied growth temperatures for the InGaN layers. Screening effects from donor electrons and excited electron-hole pairs are important, and account for a large part of the spectral shift with donor doping (an upward shift of the photoluminescence peak up to 0.2 eV is observed for a Si donor density of 2 × 1018 cm−3 in the well), with excitation intensity and with delay time after pulsed excitation (also shifts up to 0.2 eV). We suggest a two-dimensional model for electron- and donor screening in this case, which is in reasonable agreement with the observed data, if rather strong localization potentials of short range (of the order 100 Å) are present. The possibility that excitons as well as shallow donors are impact ionized by electrons in the rather strong lateral potential fluctuations present at this In composition is discussed

Auger electron spectroscopy (AES) was used to investigate the processes taking place during the initial stages of nitridation of GaAs (001) surface. The analysis of the AES results combined with that of RHEED show that the processes taking place during nitridation greatly differ depending on the nitridation temperature. At low temperatures (≤ 200°C) nitridation is hindered by kinetic restrictions on atomic migration, whereas at high temperatures (≥ 500°C) the process of nitridation takes place simultaneously with the etching of the surface. However, for intermediate temperatures (300°C ∼ 400°C) the results indicate that a complete monolayer of N atoms may be formed on the substrate during the initial stage of nitridation. The post-nitridation annealing of the samples nitrided at the intermediate temperatures results in the formation of a crystalline GaN layer, the line shape of the AES signals from which is identical to that for a GaN reference sample.

AlN thin films were deposited at various substrate temperatures via Plasma Source Molecular Beam Epitaxy. The films were grown on 6H-SiC (0001) substrates. Reflection High Energy Electron Diffraction and Atomic Force Microscopy showed a dramatic change in the surface morphology of the film grown at 640°C. This is attributed to a change in the growth mechanism from pseudomorphic at lower temperatures to three-dimensional at higher than 640°C temperatures. Photoreflectance measurements showed an absorption shift toward 200 nm as the deposition temperature increases which is attributed to the change in the growth mechanism at higher temperatures. X-Ray Diffraction was unable to conclusively determine the AlN (0002) peak due to a significant diffuse intensity from the SiC (0002) peak. A MIS structure was created by depositing Pt contacts on the film grown at 500°C. I-V measurements showed that the Pt/AlN contact is Schottky.

A new nitride semiconductor, single crystalline ZnGeN2 has been successfully grown by MOCVD for the first time. The epitaxial ZnGeN2 is found to be of hexagonal wurtzite lattice without ordering of the zinc and germanium atoms in the pseudomorphic Group III sublattice. Lattice constants of the ZnGeN2 are a = 3.186 ± 0.007 A, c = 5.174 ± 0.012 A, which gives c/a = 1.624.

We have investigated the growth conditions of cubic GaN (β-GaN) layers on very thin SiC-covered Si(001) by using gas-source molecular beam epitaxy as functions of SiC layer thickness, Ga-cell temperature and substrate temperature. Under the present SiC formation conditions on Si substrates by carbonization using C2H2 gas, the SiC layers with the thickness between 2.5 and 4 nm result in the epitaxial growth of β-GaN on thus SiC-formed Si substrates. At the highest GaN growth rate of 110 nm/h ( a Ga-cell temperature of 950 °C), β-GaN layers grown at a substrate temperature of 700 °C show a nearly flat surface morphology and the fraction of included hexagonal GaN becomes negligible when compared to the results of β-GaN layers grown under other conditions of Ga-cell and substrate temperatures. Thus obtained β-GaN films have good performance in photoluminescence intensity although the FWHM of band-edge recombination peak is still wider (137 meV) than the reported values for the β-GaN on 3C-SiC and GaAs.

The operating regimes of two rf-plasma sources, an Oxford CARS-25 and an EPI Unibulb, have been extensively characterized. By changing the exit aperture configuration and using an electrostatic deflector, the Oxford source could produce either primarily atomic nitrogen, atomic nitrogen mixed with low energy ions, or a large flux of higher energy ions (>65 eV) as the active species in a background of neutral molecular nitrogen. The EPI source produced a significant flux of metastable molecular nitrogen as the active species with a smaller atomic nitrogen component. Nitridation of sapphire using each source under the various operating conditions indicate that the reactivity was different for each type of active nitrogen. Boron contamination originating from the pyrolytic boron nitride plasma cell liner was observed.

Transmission electron microscope (TEM) and transmission electron diffraction (TED) examination has been performed to investigate microstructural properties of gas source molecular beam epitaxial GaN(As,P) layers grown on (0001) GaN/sapphire at temperatures in the range 500 – 760 °C. As for the GaNAs, we report the observation of ordering with a space group P3m1 in the layer grown at 730 °C. The layers grown at temperatures below 600 °C are polycrystalline, whist the 730°C GaNAs layer has epitaxial relation to the GaN substrate. It is also shown that the GaNAs layers experience a structural change from a zinc-blende phase to a wurtzite phase, as the growth temperature increases. As for the GaNP, it is shown that the layers grown at temperatures ≤ 600 °C experience phase separation resulting in a mixture of GaN-rich and GaP-rich GaNP with zinc-blende structure. However, the layers grown at temperatures ≥ 730 °C are found to be binary zinc-blende GaN(P) single crystalline materials. The layers grown at temperatures ≥ 730 °C consist of two types of micro-domains, i.e., GaN(P)I and GaN(P)II; the former having twin relation to the latter.

Cubic and hexagonal GaN layers have been grown on GaAs (001) and α-Al2O3 (0001) substrates, respectively, by remote plasma metalorganic chemical vapor deposition (RP-MOCVD). In situ spectroscopic ellipsometry is used to monitor in real time the chemistry and kinetics of the GaN growth. The subtrate/GaN interface formation is highlighted and the effect of the substrate plasma nitridation on the initial growth stage is discussed.

Selective lateral growth of GaN is a promising technique for producing high quality material for microelectronic and optoelectronic devices. Single-crystal GaN/AlN layers have been grown on Si(111) substrates and subsequently used as the seeding layer for selective lateral overgrowth. GaN pyramids are formed above holes patterned in a Si3N4 mask. Transmission electron microscopy (TEM, which also denotes the microscope) of these structures shows that the GaN pyramid, GaN seed layer, and AlN buffer layer in the samples have the following epitactic relationship with respect to the Si substrate: and (0001)GaN ∥ (0001)AlN ∥ (111)Si. In the core of the pyramid (at or above the seed windows), dislocations thread through the pyramid perpendicular to the interface plane with very high density. Some of these threading dislocations, which originate from the GaN/AlN seed layer, form 90° bends and half loops at the edge of the pyramid core. In the lateral growth part of the GaN pyramid, the dislocation density is relatively low. The majority of dislocations thread through the pyramid parallel to the interface plane. Planar defects, usually parallel to the interface plane, were observed near the interface. The defect density decreases with the distance away from the interface, so that the top several microns of material maybe completely defect free. The mechanism of the growth of GaN pyramids is discussed and related to this defect structure.