Skip to main content Accessibility help
×
Home

A Method Integrating Optimal Algorithm and FEM on CMOS Residual Stress

  • W. C. Chuang (a1), David T. W. Lin (a2), Y.-C. Hu (a3), H.-L. Lee (a4), C.-H. Cheng (a5), P.-Z. Chang (a6) and N. B. Quyen (a7)...

Abstract

Residual stress in MEMS is of inherent importance in various respects. This study proposes a specific method using ANSYS including the birth and death method and combined with the optimal method (SCGM) to reduce the residual stresses during the CMOS fabrication process. The suitable cooling temperature for decreasing the residual stress is proposed and available. It demonstrates that the suitable parameter on the fabrication can reduce the residual stress in MEMS devices without any extra manufacturing process or external apparatus. The proposed method can expand to simulate the realistic MEMS model effectively.

Copyright

Corresponding author

References

Hide All
1.Fujiwara, H., Abe, T. and Tanaka, K., Residual stresses III, Elsevier Applied Science, London (1992).
2.Kusaka, K., Hanabusa, T., Nishida, M. and Inoko, F., “Residual Stress and In-Situ Thermal Stress Measurement of Aluminum Film Deposited on Silicon Wafer,” Thin Solid Films, 290–291, pp. 248253 (1996).
3.Rai, J. K. and Xirouchakis, P., “Finite Element Method Based Machining Simulation Environment for Analyzing Part Errors Induced During Milling of Thin-Walled Components,” International Journal of Machine Tools & Manufacture, 48, pp. 629643 (2008).
4.Capriccioli, A. and Frosi, P., “Multipurpose ANSYS FE Procedure for Welding Processes Simulation,” Fusion Engineering and Design, 84, pp. 546553 (2009).
5.Cheng, C. H. and Chang, M. H., “A Simplified Conjugate-Gradient Method for Shape Identification Based on Thermal Data,” Numerical Heat Transfer Part B-Fundamentals, 43, pp. 489507 (2003).
6.Pawlowski, L., The Science and Engineering of Thermal Spray Coatings, Wiley, Chichester (1995).
7.ITRI, The Design of High Sensitivity CMOS Compatible Acoustic Sensing Devices, Industrial Technology Research Institute / MicroSystems Technology Center (2008).
8.Chuang, W. C., Lee, H. L., Hu, Y. C., Shih, W. P. and Chang, P. Z., “Electromechanical Coupling of CMOS-MEMS Testkey for Extracting Material Properties,” The First IFToMM Asian Conference on Mechanism and Machine Science, Taipei (2010).
9.Conrad, H., Klose, T., Sandner, T., Jung, D., Schenk, H. and Lakner, H., “Modeling the Thermally Induced Curvature of Multilayer Coatings with COMSOL Multiphysics,” COMSOL Conference 2008, Hannover (2008).
10.Hsieh, J.-C., Lin, David T. W. and Cheng, C.-H., “Optimization of Thermal Management by Integration of an SCGM, a Finite-Element Method, and an Experiment on a High-Power LED Array,” IEEE Transactions on Electron Devices, 58, pp. 11411148 (2011).

Keywords

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed