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The use of reliability factors in analyzing powder patterns in Pt–Si sputtering targets and subsequent films
Published online by Cambridge University Press: 31 January 2011
Abstract
X-ray powder diffraction was used to characterize a Pt–Si sputtering target and subsequent films. The powder patterns of each sample indicated lines due to diffraction from different phases. We have initiated a preliminary study through which we have analyzed and characterized these films. The results presented for these samples corroborate with results observed for this system in the planar configuration.
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