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Thin Film Microstructure Control Using Glancing Angle Deposition by Sputtering

Published online by Cambridge University Press:  31 January 2011

J. C. Sit ,
D. Vick ,
K. Robbie  and
M. J. Brett
J. C. Sit
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G7 and Alberta Microelectronic Corporation, Edmonton, Alberta, Canada T6G 2T9
D. Vick
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G7 and Alberta Microelectronic Corporation, Edmonton, Alberta, Canada T6G 2T9
K. Robbie
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G7 and Alberta Microelectronic Corporation, Edmonton, Alberta, Canada T6G 2T9
M. J. Brett
Affiliation:
Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G7 and Alberta Microelectronic Corporation, Edmonton, Alberta, Canada T6G 2T9
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Abstract

Thin films with microstructures controlled on a nanometer scale have been fabricated using a recently developed process called glancing angle deposition (GLAD) which combines oblique angle evaporation with controlled substrate motion. Critical to the production of GLAD thin films is the requirement for a narrow angular flux distribution centered at an oblique incidence angle. We report here recent work with low-pressure, long-throw sputter deposition with which we have succeeded in fabricating porous titanium thin films possessing “zig-zag,” helical, and “pillar” microstructures, demonstrating microstructural control on a level consistent with evaporated GLAD. The use of sputtering for GLAD simplifies process control and should enable deposition of a broader range of thin film materials.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 4 , April 1999 , pp. 1197 - 1199
Copyright
Copyright © Materials Research Society 1999

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References

REFERENCES

1.Konig, H. and Helwig, G., Optik (Stuttgart) 6, 111 (1950).Google Scholar
2.van Kranenburg, H. and Lodder, J. C., Mater. Sci. Eng. R. Rep. 11, 293 (1994).Google Scholar
3.Abelmann, L. and Lodder, C., Thin Solid Films 305, 1 (1997).CrossRefGoogle Scholar
4.Robbie, K. and Brett, M. J., J. Vac. Sci. Technol. A 15, 1460 (1997).CrossRefGoogle Scholar
5.Robbie, K., Brett, M. J., and Lakhtakia, A., Nature (London) 384, 616 (1996).CrossRefGoogle Scholar
6.Rovira, P. I., Yarussi, R. A., Collins, R. W., Messier, R., Venugopal, V. C., Lakhtakia, A., Robbie, K., and Brett, M. J., Appl. Phys. Lett. 71, 1180–1183 (1997).CrossRefGoogle Scholar
7.Robbie, K., Friedrich, L. J., Dew, S. K., Smy, T., and Brett, M. J., J. Vac Sci. Technol. A 13, 1032 (1995).CrossRefGoogle Scholar
8.Messier, R., Gehrke, T., Frankel, C., Venugopal, V. C., Otaño, W., and Lakhtakia, A., J. Vac. Sci. Technol. A 15, 2148 (1997).CrossRefGoogle Scholar
9.Robbie, K., Sit, J. C., and Brett, M. J., J. Vac. Sci. Technol. B 16, 1115 (1998).CrossRefGoogle Scholar
10.Robbie, K., Hnatiw, A. J. P., Brett, M. J., MacDonald, R. I., and McMullin, J. N., Electron. Lett. 33, 1213 (1997).CrossRefGoogle Scholar
11.Tait, R. N., Smy, T., and Brett, M. J., Thin Solid Films 226, 196 (1993).CrossRefGoogle Scholar
12.Tait, R. N., Dew, S. K., Tsai, W., Hodul, D., Smy, T., and Brett, M. J., J. Vac. Sci. Technol. B 14, 679 (1996).CrossRefGoogle Scholar
13.Rossnagel, S. M., Mikalsen, D., Kinoshita, H., and Cuomo, J. J., J. Vac. Sci. Technol. A 9, 261 (1991).CrossRefGoogle Scholar
14.Rossnagel, S. M. and Hopwood, J., Appl. Phys. Lett. 63, 3285 (1993).CrossRefGoogle Scholar
15.Broughton, J. N., Brett, M. J., Dew, S. K., and Este, G., IEEE Trans. Semicon. Manufact. 9, 122 (1996).CrossRefGoogle Scholar
16.Robbie, K., Brett, M. J., and Lakhtakia, , J. Vac. Sci. Technol. A 13, 2991 (1995).CrossRefGoogle Scholar
17.Dew, S. K., Smy, T., and Brett, M. J., Jpn. J. Appl. Phys. 33, 1140 (1994).Google Scholar