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Stress analysis of microwedge indentation-induced delamination

Published online by Cambridge University Press:  31 January 2011

MingHao Zhao ,
LiPan Yao  and
Tong-Yi Zhang
MingHao Zhao*
Affiliation:
Department of Engineering Mechanics, Zhengzhou University, Zhengzhou, Henan 450001, China
LiPan Yao
Affiliation:
Department of Engineering Mechanics, Zhengzhou University, Zhengzhou, Henan 450001, China
Tong-Yi Zhang
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong, China
*
a) Address all correspondence to this author. e-mail: memhzhao@zzu.edu.cn;memhzhao@sina.com.
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Abstract

The indentation stress is the key and fundamental parameter in indentation delamination tests, which are widely used in characterization of the interfacial fracture toughness (or adhesion) between a thin film and its substrate. The indentation stress was analyzed in the present work by using the finite element method for microwedge indenters of different wedge angles and with various other geometrical and mechanical parameters including the penetration depth, film thickness, delamination size, Young's modulus, and yield strength of the indented film. The analysis exhibited the stress field under an indentation load and the stress field after unloading caused by plastic deformation, which resulted in the loading indentation stress and the unloading indentation stress, respectively, expressed by empirical formula in terms of the indenter geometry, the indentation depth, and the film thickness and mechanical properties. The energy release rate was also calculated for the indentation-induced interfacial crack.

Keywords

AdhesionFilmFracture
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 6 , June 2009 , pp. 1943 - 1949
Copyright
Copyright © Materials Research Society 2009

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