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The Spreading Kinetics of Ag–28Cu(L) on Nickel(S): Part II. Area of Spread on Surfaces Plated with Electrolytic Ni

Published online by Cambridge University Press:  31 January 2011

Douglas A. Weirauch Jr  and
Stephen F. Horvath
Douglas A. Weirauch Jr
Affiliation:
Ceramics Technology Center, Alcoa Technical Center, Alcoa Center, Pennsylvania 15069
Stephen F. Horvath
Affiliation:
Alcoa Electronic Packaging, San Diego, California
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Abstract

Furnace brazing is commonly used in the electronic industry to attach I/O pins, lid-seal rings, and heat spreaders to cofired multilayer ceramic packages. Despite the widespread industry usage of electrolytic and electroless Ni coatings to render base metal surfaces wettable by braze fillers, there is no fundamental treatment of “brazeability” in the published literature that can be used by the materials technologist to design coatings for a given application. In this study, dynamic hot stage microscopy is used to establish the parameters that control the spreading of eutectic Ag–Cu braze on surfaces plated with electrolytic Ni. The effects of plating thickness, substrate type, plating annealing, and the braze thermal cycle are considered. A braze spreading mechanism developed for polycrystalline Ni foil in Part I of this study is linked to Ni-plated surfaces through consideration of differences in microstructure. Eventual extension of this improved understanding to surfaces plated with electroless Ni–B and Ni–P deposits will result in shortened product design time and improved manufacturing process control.

Type
Articles
Information
Journal of Materials Research , Volume 12 , Issue 4 , April 1997 , pp. 953 - 964
Copyright
Copyright © Materials Research Society 1997

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