- Cited by 73
Yoon, Jeong-Won and Jung, Seung-Boo 2005. Interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction. Journal of Alloys and Compounds, Vol. 396, Issue. 1-2, p. 122.
Koo, Ja-Myeong and Jung, Seung-Boo 2005. Reliability of In-48Sn solder/Au/Ni/Cu BGA packages during reflow process. Journal of Electronic Materials, Vol. 34, Issue. 12, p. 1565.
Sohn, Yoon-Chul and Yu, Jin 2005. Correlation Between Chemical Reaction and Brittle Fracture Found in Electroless Ni(P)/immersion gold–solder Interconnection. Journal of Materials Research, Vol. 20, Issue. 08, p. 1931.
Yoon-Chul Sohn Jin Yu Kang, S.K. Da-Yuan Shih and Taek-Yeong Lee 2005. Effect of Intermetallics Spalling on the Mechanical Behavior of Electroless Ni(P)/Pb-Free Solder Interconnection. Vol. 2, Issue. , p. 83.
Lee, Jung-Sub Chu, Kun-Mo and Jeon, Duk Young 2005. Shear Strength of Sn–3.5Ag Solder Bumps Formed on Ni/Au and Organic Solderability Preservative Surface-Finished Bond Pads After Multiple Reflow Steps. Journal of Materials Research, Vol. 20, Issue. 11, p. 3088.
Lin, Yung-Chi Duh, Jenq-Gong and Chiou, Bi-Shiou 2006. Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder. Journal of Electronic Materials, Vol. 35, Issue. 1, p. 7.
Huang, M. L. Loeher, T. Manessis, D. Boettcher, L. Ostmann, A. and Reichl, H. 2006. Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders. Journal of Electronic Materials, Vol. 35, Issue. 1, p. 181.
Lin, Yung-Chi and Duh, Jenq-Gong 2006. Optimal phosphorous content selection for the soldering reaction of Ni-P under bump metallization with Sn-Ag-Cu solder. Journal of Electronic Materials, Vol. 35, Issue. 8, p. 1665.
Lin, Yung-Chi and Duh, Jenq-Gong 2006. Phase transformation of the phosphorus-rich layer in SnAgCu/Ni–P solder joints. Scripta Materialia, Vol. 54, Issue. 9, p. 1661.
Jee, Y. K. Sohn, Y. C. Yu, Jin Lee, Taek-Yeong Seo, Ho-Seong Kim, Ki-Hyun Ahn, June-Hyeon and Lee, Young-Min 2006. A comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag Solders. p. 1.
Chen, Zhong Kumar, Aditya and Mona, M. 2006. Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows. Journal of Electronic Materials, Vol. 35, Issue. 12, p. 2126.
Jee, Y.K. Ko, Y.H. and Yu, Jin 2007. Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad. Journal of Materials Research, Vol. 22, Issue. 07, p. 1879.
Lin, Yung-Chi and Duh, Jenq-Gong 2007. Effect of surfactant on electrodeposited Ni–P layer as an under bump metallization. Journal of Alloys and Compounds, Vol. 439, Issue. 1-2, p. 74.
Jee, Y. K. Ko, Y. H. Yu, Jin Lee, T. Y. Cho, M. K. and Lee, H. M. 2007. Comparative Study of Drop Reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn Solders. p. 957.
Wu, Albert T. and Hua, F. 2007. Interfacial stability of eutectic SnPb solder and composite 60Pb40Sn solder on Cu/Ni(V)/Ti under-bump metallization. Journal of Materials Research, Vol. 22, Issue. 03, p. 735.
Lin, Yung-Chi Shih, Toung-Yi Tien, Shih-Kang and Duh, Jenq-Gong 2007. Suppressing Ni–Sn–P growth in SnAgCu/Ni–P solder joints. Scripta Materialia, Vol. 56, Issue. 1, p. 49.
Mona Kumar, Aditya and Chen, Zhong 2007. Influence of Phosphorus Content on the Interfacial Microstructure Between Sn–3.5Ag Solder and Electroless Ni–P Metallization on Cu Substrate. IEEE Transactions on Advanced Packaging, Vol. 30, Issue. 1, p. 68.
Lin, Yung-Chi Shih, Toung-Yi Tien, Shih-Kang and Duh, Jenq-Gong 2007. Morphological and Microstructural Evolution of Phosphorous-Rich Layer in SnAgCu/Ni-P UBM Solder Joint. Journal of Electronic Materials, Vol. 36, Issue. 11, p. 1469.
Yu, Jin and Kim, J.Y. 2008. Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints. Acta Materialia, Vol. 56, Issue. 19, p. 5514.
Jang, D. M. and Yu, Jin 2008. Effect of alloying W in Ni(5P) metallization of solder joints. p. 141.
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Intermetallic compound (IMC) spalling from electroless Ni-P film was investigated with lead-free solders in terms of solder-deposition methods (electroplating, solder paste, and thin foil), P content in the Ni-P film (4.6, 9, and 13 wt% P), and solder thickness (120 versus .200 μm). The reaction of Ni-P with Sn3.5Ag paste easily led to IMC spalling after 2-min reflow at 250 °C while IMCs adhered to the Ni-P layer after 10-min reflow with electroplated Sn or Sn3.5Ag. It has been shown that not only the solder composition but also the deposition method is important for IMC spalling from the Ni-P layer. The spalling increased with P content as well as with solder volume. Ni3Sn4 intermetallics formed as a needle-shaped morphology at an early stage and changed into a chunk-shape. Needle-shaped compounds exhibited a higher propensity for spalling than chunk-shaped compounds because many channels among the needle-shaped IMCs facilitated Sn penetration. A reaction between the penetrated Sn and the Ni3P layer formed a Ni3SnP layer and Ni3Sn4 IMCs spalled off the Ni3SnP surface. Dewetting of solder from the Ni3SnP layer, however, did not occur even after spalling of most IMCs.
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- ISSN: 0884-2914
- EISSN: 2044-5326
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