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Slow crack growth of CVD diamond

  • M.D. Drory (a1) and C.F. Gardinier (a1)

Abstract

Slow crack growth in CVD diamond has been observed from indentation experiments. Diamond films of 400 μm thickness were prepared by plasma-enhanced CVD on a silicon substrate, subsequently removed from the substrate, and polished for indentation testing. A microhardness tester was used to produce Vickers indentations under low load. Crack length measurements over time revealed susceptibility to slow crack growth in ambient testing conditions. The stress-corrosion susceptibility coefficient, N, was measured as 9.3.

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Slow crack growth of CVD diamond

  • M.D. Drory (a1) and C.F. Gardinier (a1)

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