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Sintering of screen-printed platinum thick films for electrode applications

Published online by Cambridge University Press:  31 January 2011

J. B. Véchembre  and
G. R. Fox
J. B. Véchembre
Affiliation:
Laboratoire de Céramique, Ecole Polytechnique Fédérale de Lausanne, Lausanne, Switzerland CH-1015
G. R. Fox
Affiliation:
Laboratoire de Céramique, Ecole Polytechnique Fédérale de Lausanne, Lausanne, Switzerland CH-1015
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Abstract

Pt electrodes with a 6–8-μm thickness were produced on alumina substrates by a double-print Pt screen-printing process that included a sequential heat treatment at 600 °C and 1300 °C. This process improved the final sintered double-print film because the first printed layer acted as a sintering template for the second printed layer. The sintered Pt films have a 95% coverage of the alumina surface, 92% density, 0.73-μm average surface roughness, and 16.10−5 Ω cm resistivity. The sintering behavior of Pt films exhibited three stages of densification: Stage I (T °C < 700 °C), exhibiting neck growth, and Stage II (700 < T °C < 1300 °C), exhibiting grain growth, have activation energies of 64 kJ/mol and 125 kJ/mol, respectively. Stage III exhibits a decrease in shrinkage due to Pt coalescence and island formation. The transition temperature, 700 °C, between Stages I and II corresponds to an anomalous increase in surface roughness and resistivity. The thickness of Pt films was a critical parameter for achieving alumina surface coverage. Uniaxial pressing of dried Pt films increased densification and reduced the surface roughness of double-print Pt films.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 4 , April 2001 , pp. 922 - 931
Copyright
Copyright © Materials Research Society 2001

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