Hostname: page-component-8448b6f56d-c47g7 Total loading time: 0 Render date: 2024-04-25T01:32:00.259Z Has data issue: false hasContentIssue false
  • English
  • Français

Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W

Published online by Cambridge University Press:  31 January 2011

Michael D. Kriese ,
William W. Gerberich  and
Neville R. Moody
Michael D. Kriese
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota 55455
William W. Gerberich
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota 55455
Neville R. Moody
Affiliation:
Sandia National Laboratories, Livermore, California 94551
Get access

Abstract

Sputtered copper and tungsten thin films both with and without tungsten and chromium superlayers were tested by using nanoindentation probing to initiate and drive delamination. The adhesion energies of the films were calculated from the induced delaminations using the analysis presented in “Quantitative adhesion measures of multilayer films: Part I. Indentation mechanics.” Copper films ranging in thickness from 150 to 1500 nm in the as-sputtered condition had measured adhesion energies ranging from 0.2 to 2 J/m2, commensurate with the thermodynamic work of adhesion. Tungsten films ranging in thickness from 500 to 1000 nm in the as-sputtered condition had measured adhesion energies ranging from 5 to 15 J/m2. The superlayer was shown to induce radial cracking when under residual tension, resulting in underestimation of the adhesion energy when the film was well adhered. Under conditions of weak adherence or residual compression, the superlayer provided an excellent means to induce a delamination and allowed an accurate and reasonably precise quantitative measure of thin film adhesion.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 7 , July 1999 , pp. 3019 - 3026
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Marshall, D.B. and Evans, A.G., J. Appl. Phys. 56, 2632 (1984).CrossRefGoogle Scholar
2.Bao, G., Ho, S., Fan, B., and Suo, Z., Int. J. Sol. Struc. 29, 1105 (1990).CrossRefGoogle Scholar
3.Suo, Z., J. Appl. Mech. 57, 627 (1990).CrossRefGoogle Scholar
4.Suo, Z. and Hutchinson, J.W., Mater. Sci. Eng. A107, 135 (1989).CrossRefGoogle Scholar
5.Wang, J.S. and Suo, Z., Acta Metall. 38, 1279 (1990).CrossRefGoogle Scholar
6.Becker, T.L. Jr, McNaney, J.M., Cannon, R.M., and Ritchie, R.O., Mech. Mater. 25, 291 (1997).CrossRefGoogle Scholar
7.Bagchi, A., Lucas, G.E., Suo, Z., and Evans, A.G., J. Mater. Res. 9, 1734 (1994).CrossRefGoogle Scholar
8.deBoer, M.P. and Gerberich, W.W., Acta Metall. 44, 3169 (1996).Google Scholar
9.deBoer, M.P. and Gerberich, W.W., Acta Metall. 44, 3177 (1996).Google Scholar
10.deBoer, M.P., Kriese, M.D., and Gerberich, W.W., J. Mater. Res. 12, 2673 (1997).CrossRefGoogle Scholar
11.Kriese, M.D., Moody, N.R., and Gerberich, W.W., in Boundaries and Interfaces in Materials: The David A. Smith Symposium, edited by Pond, R.C., Clark, W.A.T., and King, A.H. (TMS, Warrendale, PA, 1998), p. 113.Google Scholar
12.Kriese, M.D., Moody, N.R., and Gerberich, W.W., in Thin Films—Stresses and Mechanical Properties VII, edited by Cammarata, R.C., Nastasi, M., Busso, E.P., and Oliver, W.C. (Mater. Res. Soc. Symp. Proc. 505, Warrendale, PA, 1998), p. 363.Google Scholar
13.Russell, S.W., Rafalski, S.A., Spreitzer, R.L., Li, J., Moinpour, M., Moghadam, F., and Alford, T.L., Thin Solid Films 262, 154 (1995).CrossRefGoogle Scholar
14.Stoney, G.C., Proc. R. Soc. Lond. A82, 172 (1909).Google Scholar
15.Nix, W.D., Metall. Trans. A 20A, 2217 (1988).Google Scholar
16.deBoer, M., Ph.D. dissertation, University of Minnesota (1996).Google Scholar
17.Ohring, M., The Materials Science of Thin Films (Academic Press, New York, 1992).Google Scholar
18.Wu, T.W., J. Mater. Res. 6, 407 (1991).CrossRefGoogle Scholar
19.Tsui, T.Y., Ross, C.A., and Pharr, G.M., in Materials Reliability in Microelectronics VII, edited by Clement, J.J., Keller, R.R., Krisch, K.S., Sanchez, J.J.E., and Suo, Z. (Mater. Res. Soc. Symp. Proc. 473, Pittsburgh, PA, 1997), pp. 57–62.Google Scholar
20.CRC Handbook of Chemistry and Physics, edited by Lide, D.R. (CRC Press, New York, 1993).Google Scholar
21.Kingery, W.D., Bowen, H.K., and Uhlmann, D.R., Introduction to Ceramics (John Wiley & Sons, Inc., New York, 1976).Google Scholar
22.Evans, A.G., Rühle, M., Dalgleish, B.J., and Charalambides, P.G., Mater. Sci. Eng. A126, 53 (1990).CrossRefGoogle Scholar
23.Hong, T., Smith, J.R., and Srolovitz, D.J., Acta Metall. 43, 2721 (1995).CrossRefGoogle Scholar
24.Bagchi, A. and Evans, A.G., Thin Solid Films 286, 203 (1996).CrossRefGoogle Scholar
25.Hutchinson, J.W. and Suo, Z., in Advances in Applied Mechanics, edited by Hutchinson, J.W. and Hu, T.Y. (Academic Press, Inc., New York, 1992), pp. 63–169.Google Scholar
26.Tvergaard, V. and Hutchinson, J.W., J. Mech. Phys. Sol. 41, 1119 (1993).CrossRefGoogle Scholar
27.Evans, A.G. and Hutchinson, J.W., Acta Metall. 37, 909 (1989).CrossRefGoogle Scholar
28.Oliver, W.C. and Pharr, G.M., J. Mater. Res. 7, 564 (1992).CrossRefGoogle Scholar
29.Jensen, H.M., Eng. Frac. Mech. 40, 475 (1991).CrossRefGoogle Scholar
30.Gioia, G. and Ortiz, M., in Advances in Applied Mechanics, edited by Hutchinson, J.W. and Hu, T.Y. (Academic Press, Inc., New York, 1997), pp. 120–192.Google Scholar