Skip to main content Accessibility help
×
Home

A new solder wetting layer for Pb-free solders

  • Chang Yul Oh, Hee-Ra Roh, Young Min Kim, Jin Soo Lee, Hae Young Cho and Young-Ho Kim (a1)...

Abstract

We developed a new Cu–Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn–Ag–Cu (SAC) solder interfaces was delayed. Cu3Sn intermetallic compounds and microvoids were not observed in the SAC/Cu–Zn interfaces after aging. The drop reliability of the SAC solder/Cu–Zn joints was excellent.

Copyright

Corresponding author

a) Address all correspondence to this author. e-mail: kimyh@hanyang.ac.kr

References

Hide All
1.Wu, C.M.L., Yu, D.Q., Law, C.M.T., Wang, L.: Properties of lead-free solder alloy with rare earth element additions. Mater. Sci. Eng., R 44, 1 (2004)
2.Laurila, T., Vuorinen, V., Kivilahti, J.K.: Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Rep. 49, 1 (2005)
3.Anderson, I.E., Foley, J.C., Cook, B.A., Harringa, J., Terpstra, R.L., Unal, O.: Alloying effect in near-eutectic Sn–Ag–Cu solder alloys for improved microstructural stability. J. Electron. Mater. 30, 1050 (2001)
4.Tsay, L-W., Lin, C-L., Ou, J-L., Shiue, R-K.: A study of Sn–Bi–Ag–(In) lead-free solder. J. Mater. Sci. 38, 1269 (2003)
5.Lee, T.Y., Choi, W.J., Tu, K.N.: Morphology, kinetics and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu. J. Mater. Res. 17, 291 (2002)
6.Xu, L., Pang, J.H.L.: Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free solder BGA solder joint, in Proc. 56th Electronic Component and Technology ConferenceSan Diego, CA 2006)275
7.Choi, W.K., Lee, H.M.: Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn–3.5Ag solder alloy and Cu substrate. J. Electron. Mater. 29, 1207 (2000)
8.Zeng, K., Tu, K.N.: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng., R 38, 55 (2002)
9.Kang, S.K., Choi, W.K., Shih, D-Y., Henderson, D.W., Gosselin, T., Sarkhel, A., Goldsmith, C., Puttlitz, K.J.: Formation of Ag3Sn plates in Sn–Ag–Cu alloys and optimization of their alloy composition, in Proc. 53rd Electronic Component on Technology ConferenceNew Orleans, LA 2003)64
10.Kang, S.K., Leonard, D., Shih, D-Y., Gignac, L., Henderson, D.W., Cho, S., Yu, J.: Interfacial reactions of Sn–Ag–Cu solders modified by minor Zn alloying addition. J. Electron. Mater. 35, 479 (2006)
11.Kang, S.K., Shih, D-Y., Leonard, D., Henderson, D.W., Gosselin, T., Cho, S., Yu, J., Choi, W.K.: Controlling Ag3Sn plate formation in near-ternary-eutectic Sn–Ag–Cu solder by minor Zn alloying. JOM 56, 34 (2004)
12.Wang, F., Ma, X., Qian, Y.: Improvement of microstructure and interface structure of eutectic Sn–0.7Cu solder with small amount Zn addition. Scr. Mater. 53, 699 (2005)
13.Zeng, K., Stierman, R., Chiu, T-C., Edward, D., Ano, K., Tu, K.N.: Kirkendall void formation in eutectic Sn–Pb solder joint on bare Cu and its effect on joint reliability. J. Appl. Phys. 97, 024508 (2005)
14.Vianco, P.T., Rejent, J.A., Hlava, P.F.: Solid-state intermetallic compound layer growth between copper and 95.5Sn–3.9Ag–0.6Cu solder. J. Electron. Mater. 33, 991 (2004)
15.de Souas, I., Henderson, D.W., Patry, L., Kang, S.K., Shih, D-Y.: The influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structure, in Proc. 56th Electronic Component and Technology ConferenceSan Diego, CA 2006)1454
16.Kim, T.H., Kim, Y-H.: Sn–Ag–Cu and Sn–Cu solder: Interfacial reactions with platinum. JOM 56, 45 (2004)
17.Choi, W.K., Sohn, Y.C., Moon, C.Y., Roh, H.R., Oh, C.Y., Kim, Y-H.: Intermetallic compound formation at the interface between Sn–3.0Ag–0.5Cu solder alloy and Cu-Zn alloy substrate, in Proc. 2007 International Conference on Electronic PackagingTokyo 2007)
18.Feng, W., Wang, C., Morinaga, M.: Electronic structure mechanism for the wettability of Sn-based solder alloys. J. Electron. Mater. 31, 185 (2002)
19.Jee, Y.K., Ko, Y-H., Yu, J.: Effect of Zn on the intermetallic formation and reliability of Sn–3.5Ag solder on a Cu pad. J. Mater. Res. 22, (7), 1879 (2007)
20.Oh, C.Y., Roh, H.R., Kim, Y-H.: Formation and growth of intermetallic compounds at the interface between Pb-free solder and Cu–Zn UBM, in Proc. 40th International Microelectronic and Packaging SocietySan Jose, CA 2007)48

Keywords

Metrics

Altmetric attention score

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed