- Cited by 18
Kim, Young Min Oh, Chang-Yul Roh, Hee-Ra and Kim, Young-Ho 2009. A new Cu-Zn solder wetting layer for improved impact reliability. p. 1008.
Yu, Chi-Yang and Duh, Jenq-Gong 2010. Microstructural Variation and Phase Evolution in the Reaction of Sn-xAg-Cu Solders and Cu-yZn Substrates During Reflow. Journal of Electronic Materials, Vol. 39, Issue. 12, p. 2627.
Cho, Hae-Young Kim, Tae-Jin Kim, Young Min Kim, Sun-Chul Park, Jin-Young and Kim, Young-Ho 2010. A new Ni-Zn under bump metallurgy for Pb-free solder bump flip chip application. p. 151.
Kim, Young Min Roh, Hee-Ra Kim, Sungtae and Kim, Young-Ho 2010. Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates. Journal of Electronic Materials, Vol. 39, Issue. 12, p. 2504.
Tseng, Chien-Fu Wang, Kai-Jheng and Duh, Jenq-Gong 2010. Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging. Journal of Electronic Materials, Vol. 39, Issue. 12, p. 2522.
Yu, Chi-Yang Wang, Kai-Jheng and Duh, Jenq-Gong 2010. Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging. Journal of Electronic Materials, Vol. 39, Issue. 2, p. 230.
Yu, Chi-Yang and Duh, Jenq-Gong 2011. Stabilization of hexagonal Cu6(Sn,Zn)5 by minor Zn doping of Sn-based solder joints. Scripta Materialia, Vol. 65, Issue. 9, p. 783.
Zou, H. F. Zhang, Q. K. and Zhang, Z. F. 2011. Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples. Journal of Electronic Materials, Vol. 40, Issue. 7, p. 1542.
Yu, Chi-Yang Chen, Wei-Yu and Duh, Jenq-Gong 2012. Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging. Intermetallics, Vol. 26, Issue. , p. 11.
Yu, Chi-Yang and Duh, Jenq-Gong 2012. Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging. Journal of Materials Science, Vol. 47, Issue. 17, p. 6467.
Kim, Young Min Kim, Tae Jin Choi, Min Young and Kim, Young-Ho 2013. Interfacial reactions between Sn–3.0Ag–0.5Cu solder and Cu–xZn (x=0–35wt%) or Cu–xZn–yNi (x=20 and 25wt%, y=15 and 10wt%) substrates. Journal of Alloys and Compounds, Vol. 575, Issue. , p. 350.
Lee, Ji Hyun Kim, Young Min Hwang, Ji Hwan and Kim, Young-Ho 2013. Wetting characteristics of Cu–xZn layers for Sn–3.0Ag–0.5Cu solders. Journal of Alloys and Compounds, Vol. 567, Issue. , p. 10.
Kim, Young Min Kim, Sun-Chul and Kim, Young-Ho 2013. An eco-friendly Cu-Zn wetting layer for highly reliable solder joints. p. 755.
Chen, Wei-Yu Yu, Chi-Yang and Duh, Jenq-Gong 2014. Improving the shear strength of Sn–Ag–Cu–Ni/Cu–Zn solder joints via modifying the microstructure and phase stability of Cu–Sn intermetallic compounds. Intermetallics, Vol. 54, Issue. , p. 181.
Park, Jae-Yong Kim, Young Min and Kim, Young-Ho 2015. Improved drop reliability of Sn–Ag–Cu solder joints by Zn addition to a Cu wetting layer. Journal of Materials Science: Materials in Electronics, Vol. 26, Issue. 8, p. 5852.
Park, Jae-Yong Kim, Young Min and Kim, Young-Ho 2016. Effect of Zn concentration on the interfacial reactions between Sn–3.0Ag–0.5Cu solder and electroplated Cu–xZn wetting layers (x = 0–43 wt%). Journal of Materials Science: Materials in Electronics, Vol. 27, Issue. 6, p. 5916.
Yen, Yee-Wen Chen, Pei-Yu and Chen, Guan-Da 2017. Interfacial reactions between lead-free solders and Cu-40Zn alloys. p. 549.
Yen, Yee-Wen Yu, William Wang, Chu-Hsuan Chen, Chih-Ming Li, Yu-Chun Chen, Pei-Yu and Chen, Guan-Da 2019. Study of Interfacial Reactions Between Lead-Free Solders and Cu-xZn Alloys. Journal of Electronic Materials, Vol. 48, Issue. 1, p. 170.
Check if you have access via personal or institutional login
We developed a new Cu–Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn–Ag–Cu (SAC) solder interfaces was delayed. Cu3Sn intermetallic compounds and microvoids were not observed in the SAC/Cu–Zn interfaces after aging. The drop reliability of the SAC solder/Cu–Zn joints was excellent.
Hide All1.Wu, C.M.L., Yu, D.Q., Law, C.M.T., Wang, L.: Properties of lead-free solder alloy with rare earth element additions. Mater. Sci. Eng., R 44, 1 (2004)2.Laurila, T., Vuorinen, V., Kivilahti, J.K.: Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Rep. 49, 1 (2005)3.Anderson, I.E., Foley, J.C., Cook, B.A., Harringa, J., Terpstra, R.L., Unal, O.: Alloying effect in near-eutectic Sn–Ag–Cu solder alloys for improved microstructural stability. J. Electron. Mater. 30, 1050 (2001)4.Tsay, L-W., Lin, C-L., Ou, J-L., Shiue, R-K.: A study of Sn–Bi–Ag–(In) lead-free solder. J. Mater. Sci. 38, 1269 (2003)5.Lee, T.Y., Choi, W.J., Tu, K.N.: Morphology, kinetics and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu. J. Mater. Res. 17, 291 (2002)6.Xu, L., Pang, J.H.L.: Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free solder BGA solder joint, in Proc. 56th Electronic Component and Technology ConferenceSan Diego, CA 2006)2757.Choi, W.K., Lee, H.M.: Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn–3.5Ag solder alloy and Cu substrate. J. Electron. Mater. 29, 1207 (2000)8.Zeng, K., Tu, K.N.: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng., R 38, 55 (2002)9.Kang, S.K., Choi, W.K., Shih, D-Y., Henderson, D.W., Gosselin, T., Sarkhel, A., Goldsmith, C., Puttlitz, K.J.: Formation of Ag3Sn plates in Sn–Ag–Cu alloys and optimization of their alloy composition, in Proc. 53rd Electronic Component on Technology ConferenceNew Orleans, LA 2003)6410.Kang, S.K., Leonard, D., Shih, D-Y., Gignac, L., Henderson, D.W., Cho, S., Yu, J.: Interfacial reactions of Sn–Ag–Cu solders modified by minor Zn alloying addition. J. Electron. Mater. 35, 479 (2006)11.Kang, S.K., Shih, D-Y., Leonard, D., Henderson, D.W., Gosselin, T., Cho, S., Yu, J., Choi, W.K.: Controlling Ag3Sn plate formation in near-ternary-eutectic Sn–Ag–Cu solder by minor Zn alloying. JOM 56, 34 (2004)12.Wang, F., Ma, X., Qian, Y.: Improvement of microstructure and interface structure of eutectic Sn–0.7Cu solder with small amount Zn addition. Scr. Mater. 53, 699 (2005)13.Zeng, K., Stierman, R., Chiu, T-C., Edward, D., Ano, K., Tu, K.N.: Kirkendall void formation in eutectic Sn–Pb solder joint on bare Cu and its effect on joint reliability. J. Appl. Phys. 97, 024508 (2005)14.Vianco, P.T., Rejent, J.A., Hlava, P.F.: Solid-state intermetallic compound layer growth between copper and 95.5Sn–3.9Ag–0.6Cu solder. J. Electron. Mater. 33, 991 (2004)15.de Souas, I., Henderson, D.W., Patry, L., Kang, S.K., Shih, D-Y.: The influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structure, in Proc. 56th Electronic Component and Technology ConferenceSan Diego, CA 2006)145416.Kim, T.H., Kim, Y-H.: Sn–Ag–Cu and Sn–Cu solder: Interfacial reactions with platinum. JOM 56, 45 (2004)17.Choi, W.K., Sohn, Y.C., Moon, C.Y., Roh, H.R., Oh, C.Y., Kim, Y-H.: Intermetallic compound formation at the interface between Sn–3.0Ag–0.5Cu solder alloy and Cu-Zn alloy substrate, in Proc. 2007 International Conference on Electronic PackagingTokyo 2007)18.Feng, W., Wang, C., Morinaga, M.: Electronic structure mechanism for the wettability of Sn-based solder alloys. J. Electron. Mater. 31, 185 (2002)19.Jee, Y.K., Ko, Y-H., Yu, J.: Effect of Zn on the intermetallic formation and reliability of Sn–3.5Ag solder on a Cu pad. J. Mater. Res. 22, (7), 1879 (2007)20.Oh, C.Y., Roh, H.R., Kim, Y-H.: Formation and growth of intermetallic compounds at the interface between Pb-free solder and Cu–Zn UBM, in Proc. 40th International Microelectronic and Packaging SocietySan Jose, CA 2007)48
Email your librarian or administrator to recommend adding this journal to your organisation's collection.
- ISSN: 0884-2914
- EISSN: 2044-5326
- URL: /core/journals/journal-of-materials-research
Altmetric attention score
* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.
Usage data cannot currently be displayed