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Mechanical, tribological, and stress analyses of ion-beam-deposited boron-rich boron nitride films with increasing N content

Published online by Cambridge University Press:  31 January 2011

K. F. Chan
Affiliation:
Department of Applied Physics and Materials Research Center, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, People's Republic of China
C. W. Ong
Affiliation:
Department of Applied Physics and Materials Research Center, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, People's Republic of China
C. L. Choy
Affiliation:
Department of Applied Physics and Materials Research Center, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, People's Republic of China
R. W. M. Kwok
Affiliation:
Department of Chemistry, The Chinese University of Hong Kong, Shatin, Hong Kong, People's Republic of China
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Abstract

Boron (B) films and B-rich BNx films with different N contents (4.1–40.3 at.%.) were deposited by dual ion-beam deposition. The films consist of a B-rich phase constructed of icosahedral atomic clusters and a graphitelike boron nitride phase. The films with N content ≤20.3 at.% is dominated by the B-rich phase. Their hardness rises with increasing N content to reach a maximum value of 18.8 GPa. The hardness-to-elastic modulus ratio (H/E) and the critical load of the films also increase, showing stronger wear resistance of the films. These results can be explained if some N–B–N chains are formed at the interstitial sites in the network of the B-rich phase, which cross-link different icosahedral atomic clusters in the B-rich phase and strengthen the rigidity of the structure. For the films with higher N contents, the volume fraction of the graphitelike boron nitride phase becomes higher, and the hardness drops as a consequence. However, the change in the H/E ratio is rather mild. This implies that the wear resistance of the films is not altered and explains why the critical load of the films remains almost unchanged. In addition, the friction coefficient μ of all the films depends on the normal load L in the form of μ = aLy, where a and y are numerical parameters and are insensitive to the change in the N content. Furthermore, compressive stress was found to increase from about 0.12 to 1.7 GPa when the N content increased from 4.1 to 40.3 at.%.

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Articles
Copyright
Copyright © Materials Research Society 1999

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References

REFERENCES

1.Golikova, O.A., Phys. Status Solidi A 101, 277 (1987).CrossRefGoogle Scholar
2.Riedel, R., Adv. Mater. 6, 549 (1994).CrossRefGoogle Scholar
3.Lundström, T. and Andreev, Y.G., Mater. Sci. Eng. A 209, 16 (1996).CrossRefGoogle Scholar
4.Aselage, T.L. and Tissot, R.G., J. Am. Ceram. Soc. 75, 2207 (1992).CrossRefGoogle Scholar
5.Hubert, H., Garvie, L.A.J, Devouard, B., Buseck, P.R., Petuskey, W.T., and McMillan, P.F., Chem. Mater. 10, 1530 (1998).CrossRefGoogle Scholar
6.Saitoh, H., Yoshida, K., and Yarbrough, W.A., J. Mater. Res. 8, 8 (1993).CrossRefGoogle Scholar
7.Zhao, X-A., Ong, C.W., Chan, K.F., Ng, Y.M., Tsang, Y.C., Choy, C.L., and Chan, P.W., J. Vac. Sci. Technol. A. 15, 2297 (1997).CrossRefGoogle Scholar
8.Shirley, D.A., Phys. Rev. B 5, 4709 (1972).CrossRefGoogle Scholar
9.Witvrouw, A. and Spaepen, F., in Thin Films: Stresses and Mechanical Properties II, edited by Doerner, M.F., Oliver, W.C., Pharr, G.M., and Brotzen, F.R. (Mater. Res. Soc. Symp. Proc. 188, Pittsburgh, PA, 1990), p. 147.Google Scholar
10.Stoney, G.G., Proc. R. Soc. London, Ser. A 8, 172 (1909).Google Scholar
11.Brantley, W.A., J. Appl. Phys. 44, 534 (1973).CrossRefGoogle Scholar
12.Ong, C.W., Chik, K.P., and Wong, H.K., J. Appl. Phys. 74, 6094 (1993).CrossRefGoogle Scholar
13.Friedmann, T.A., McCarty, K.F., Klaus, E.J., Barbour, J.C., Clift, W.M., Johnsen, H.A., Medlin, D.L., and Ottesen, D.K., Thin Solid Films 237, 48 (1994).CrossRefGoogle Scholar
14.Golikova, O.A., Zhubanov, M., and Mirlin, D.N., Sov. Phys. Solid State 11, 1341 (1969).Google Scholar
15.Ong, C.W., Chik, K.P., and Wong, H.K., J. Non-Cryst. Solids 114, 783 (1989).CrossRefGoogle Scholar
16.Dworschak, W., Jung, K., and Ehrhardt, H., Thin Solid Films 254, 65 (1995).CrossRefGoogle Scholar
17.Mirkarimi, P.B., McCarty, K.F., Medlin, D.L., Wolfer, W.G., Friedmann, T.A., Klaus, E.J., Cardinale, G.F., and Howitt, D.G., J. Mater. Res. 9, 2925 (1994).CrossRefGoogle Scholar
18.Moulder, J.F., Stickle, W.F., Sobol, P.E., and Bomben, K.D., Handbook of X-ray Photoelectron Spectroscopy (Perkin-Elmer Corporation, Eden Prairie, MN, 1992), p. 215.Google Scholar
19.Rother, B., Weissmantel, C., and Leonhardt, G., Phys. Status Solidi A 100, 553 (1987).CrossRefGoogle Scholar
20.Okamoto, M., Utsumi, Y., and Osaka, Y., Jpn. J. Appl. Phys. 29, L1004 (1990).CrossRefGoogle Scholar
21.Watanabe, M.O., Itoh, S., and Mizushima, K., Appl. Phys. Lett. 68, 2962 (1996).CrossRefGoogle Scholar
22.Doughty, C., Gorbatkin, S.M., Tsui, T.Y., Pharr, G.M., and Medlin, D.L., J. Vac. Sci. Technol., A 15, 2623 (1997).CrossRefGoogle Scholar
23.Tsui, T.Y., Pharr, G.M., Oliver, W.C., Chung, Y.W., Cutiongco, E.C., Bhatia, C.S., White, R.L., Rhoades, R.L., and Gorbatkin, S.M., in Thin Films: Stresses and Mechanical Properties V, edited by Baker, S.P., Ross, C.A., Townsend, P.H., Volkert, C.A., and Børgesen, P. (Mater. Res. Soc. Symp. Proc. 356, Pittsburgh, PA, 1995), p. 767.Google Scholar
24.Miyoshi, K., Surf. Coat. Technol. 36, 487 (1988).CrossRefGoogle Scholar