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Kinetics of intermetallic compound layers and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field

Published online by Cambridge University Press:  31 January 2011

Cong-qian Cheng ,
Jie Zhao  and
Yang Xu
Yang Xu
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China
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Abstract

The kinetics of intermetallic compound (IMC) layer and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field was experimentally examined. It is found that the IMC layer growth is controlled by flux-driven ripening process. The high magnetic field promotes the growth of IMC layer, retards the dissolution of Cu substrate, and decreases the content of Cu solute at the liquid–IMC interface front. Based on the experimental results, it is considered that the magnetization induced by magnetic field promotes the ripening process for IMC layer growth. The Lorentz force dampening the convection and magnetization decreasing the Cu solubility limit can retard the Cu dissolution and change the solute distribution at the liquid–IMC interface front.

Keywords

CompoundKineticsMagnetic
Type
Articles
Information
Journal of Materials Research , Volume 25 , Issue 2 , February 2010 , pp. 359 - 367
Copyright
Copyright © Materials Research Society 2010

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