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Investigation on crack propagation in single crystal Ag with temperature dependence

Published online by Cambridge University Press:  16 November 2015

Xue Feng Liu
Affiliation:
Architecture and Civil Engineering Research Centre, Shenzhen Research Institute, City University of Hong Kong, Shenzhen 518057, China
Jin Bao Wang
Affiliation:
School of Shipping, Port & Civil Engineering, Zhejiang Ocean University, Zhoushan 316022, China
Li Gang Sun
Affiliation:
Department of Architecture and Civil Engineering, City University of Hong Kong, Hong Kong, China
Ying Yan Zhang
Affiliation:
School of Computing, Engineering and Mathematics, Western Sydney University, Penrith, NSW 2751, Australia
Mei Ling Tian
Affiliation:
School of Shipping, Port & Civil Engineering, Zhejiang Ocean University, Zhoushan 316022, China
Xiao Qiao He*
Affiliation:
Department of Architecture and Civil Engineering, City University of Hong Kong, Hong Kong, China
*
a)Address all correspondence to this author. e-mail: bcxqhe@cityu.edu.hk
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Abstract

Crack propagation behaviors in a precracked single crystal Ag under mode I loading at different temperatures are studied by molecular dynamics simulation. The simulation results show that the crack propagation behaviors are sensitive to external temperature. At 0 K, the crack propagates in a brittle manner. Crack tip blunting and void generation are first observed followed by void growth and linkage with the main crack, which lead to the propagation of the main crack and brittle failure immediately without any microstructure evolution. As the temperature gets higher, more void nucleations and dislocation emissions occur in the crack propagation process. The deformation of the single crystal Ag can be considered as plastic deformation due to dislocation emissions. The crack propagation dynamics characterizing the microstructure evolution of atoms around the crack tip is also shown. Finally, it is shown that the stress of the single crystal Ag changes with the crack length synchronously.

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Articles
Copyright
Copyright © Materials Research Society 2015 

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References

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