- Cited by 79
Lee, Chang-Yong Yoon, Jeong-Won Kim, Young-Jig and Jung, Seung-Boo 2005. Interfacial reactions and joint reliability of Sn–9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate. Microelectronic Engineering, Vol. 82, Issue. 3-4, p. 561.
Anderson, Iver E. 2006. Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications. Journal of Materials Science: Materials in Electronics, Vol. 18, Issue. 1-3, p. 55.
Shih, Po-Cheng and Lin, Kwang-Lung 2006. Interfacial microstructure and shear behavior of Sn–Ag–Cu solder balls joined with Sn–Zn–Bi paste. Journal of Alloys and Compounds, Vol. 422, Issue. 1-2, p. 153.
Chang, Shih-Chang Lin, Sheng-Chih and Hsieh, Ker-Chang 2006. The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-Al solder with Ni/Au surface finish bond pad. Journal of Electronic Materials, Vol. 35, Issue. 3, p. 399.
Chen, Sinn-Wen Wang, Chao-Hong Lin, Shih-Kang and Chiu, Chen-Nan 2006. Phase Diagrams of Pb-Free Solders and their Related Materials Systems. Journal of Materials Science: Materials in Electronics, Vol. 18, Issue. 1-3, p. 19.
Lee, C. S. and Shieu, F. S. 2006. Growth of intermetallic compounds in the Sn-9Zn/Cu joint. Journal of Electronic Materials, Vol. 35, Issue. 8, p. 1660.
Chou, Chin-yi and Chen, Sinn-wen 2006. Phase equilibria of the Sn–Zn–Cu ternary system. Acta Materialia, Vol. 54, Issue. 9, p. 2393.
Chen, Kang-I Cheng, Shou-Chang Wu, Sean and Lin, Kwang-Lung 2006. Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn–9Zn eutectic alloy. Journal of Alloys and Compounds, Vol. 416, Issue. 1-2, p. 98.
Jee, Y. K. Sohn, Y. C. Yu, Jin Lee, Taek-Yeong Seo, Ho-Seong Kim, Ki-Hyun Ahn, June-Hyeon and Lee, Young-Min 2006. A comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag Solders. p. 1.
Anderson, I. E. and Harringa, J. L. 2006. Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints. Journal of Electronic Materials, Vol. 35, Issue. 1, p. 94.
Yang, Ching-Feng Chen, Sinn-Wen Wu, Kuan-Hsien and Chin, Tsung-Shune 2007. Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates. Journal of Electronic Materials, Vol. 36, Issue. 11, p. 1524.
Sharif, Ahmed and Chan, Y.C. 2007. Effect of substrate metallization on interfacial reactions and reliability of Sn–Zn–Bi solder joints. Microelectronic Engineering, Vol. 84, Issue. 2, p. 328.
Kuo, Shih-Ming and Lin, Kwang-Lung 2007. Microstructure evolution during electromigration between Sn–9Zn solder and Cu. Journal of Materials Research, Vol. 22, Issue. 05, p. 1240.
Ching-Tsung Lin Chi-Shiung Hsi Tao-Chih Chang and Ming-Kann Liang 2007. Solder joint strengths and interfacial reactions in various Pb-free solder joints. p. 58.
Jee, Y.K. Ko, Y.H. and Yu, Jin 2007. Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad. Journal of Materials Research, Vol. 22, Issue. 07, p. 1879.
Chang, Shih-Chang Lin, Sheng-Chih and Hsieh, Ker-Chang 2007. Phase reaction in Sn–9Zn solder with Ni/Au surface finish bond-pad at 175°C ageing. Journal of Alloys and Compounds, Vol. 428, Issue. 1-2, p. 179.
Chen, Chih-ming and Chen, Chih-hao 2007. Interfacial Reactions between Eutectic SnZn Solder and Bulk or Thin-Film Cu Substrates. Journal of Electronic Materials, Vol. 36, Issue. 10, p. 1363.
Yoon, Jeong-Won and Jung, Seung-Boo 2007. Solder joint reliability evaluation of Sn–Zn/Au/Ni/Cu ball-grid-array package during aging. Materials Science and Engineering: A, Vol. 452-453, Issue. , p. 46.
Sharif, Ahmed and Chan, Y.C. 2007. Investigation of interfacial reactions between Sn–Zn solder with electrolytic Ni and electroless Ni(P) metallization. Journal of Alloys and Compounds, Vol. 440, Issue. 1-2, p. 117.
Liu, Nai-Shuo and Lin, Kwang-Lung 2008. Evolution of interfacial morphology of Sn–8.5Zn–0.5Ag–0.1Al–xGa/Cu system during isothermal aging. Journal of Alloys and Compounds, Vol. 456, Issue. 1-2, p. 466.
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Sn–9Zn and Sn–8Zn–3Bi solder balls were bonded to Cu or electroless Au/Ni(P)pads, and the effect of aging on joint reliability, including impact reliability, was investigated. For the purpose of quantitatively evaluating the impact toughness ofthe solder joints, a test similar to the classic Charpy impact test was performed.The interfacial compounds formed in the solder/Cu joint during soldering wereCu–Zn intermetallic compounds (IMCs), not Cu–Sn IMCs. One of the Cu–Zn IMCs, γ–Cu5Zn8, thickened remarkably with aging, and eventually its morphology changed from layer-type into discontinuous. The rapid growth of the γ–Cu5Zn8 and void formation at the bond interface led to the significant degradation of the joint reliability due to a ductile-to-brittle transition of the joint. Meanwhile, the compound formed in the solder/Au/Ni(P) joint during soldering was a Au–Zn IMC, above which Zn redeposited during aging. Both the dissolution and diffusion of Ni into the solders were extremely slow, which contributes to negligible void formation at the bond interface. As a result, the solder bumps on the Au/Ni(P) pads were able to maintain the high joint strength and impact toughness even after prolonged aging.
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