- Cited by 73
Hwang, Chi-Won Suganuma, Katsuaki Kiso, Masayuki and Hashimoto, Shigeo 2004. Influence of Cu addition to interface microstructure between Sn-Ag solder and Au/Ni-6P plating. Journal of Electronic Materials, Vol. 33, Issue. 10, p. 1200.
Sohn, Y.C. Yu, Jin Kang, S.K. Shih, D.Y. and Lee, T.Y. 2004. Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization. Journal of Materials Research, Vol. 19, Issue. 08, p. 2428.
Chen, Zhong He, Min and Qi, Guojun 2004. Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization. Journal of Electronic Materials, Vol. 33, Issue. 12, p. 1465.
Yoon-Chul Sohn Jin Yu Kang, S.K. Da-Yuan Shih and Taek-Yeong Lee 2004. Study of spalling behavior of intermetallic compounds during the reaction between electroless Ni-P metallization and lead-free solders. p. 75.
Yoon-Chul Sohn Jin Yu Kang, S.K. Da-Yuan Shih and Taek-Yeong Lee 2004. Spalling behaviors of intermetallic compounds during the wetting reaction of Sn(3.5Ag) on electroless Ni-P metallization. p. 177.
Hwang, Chi-Won and Suganuma, Katsuaki 2004. Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni. MATERIALS TRANSACTIONS, Vol. 45, Issue. 3, p. 714.
Kim, Dae-Gon Kim, Jong-Woong Lee, Jung-Goo Mori, Hirotaro Quesnel, David J. and Jung, Seung-Boo 2005. Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application. Journal of Alloys and Compounds, Vol. 395, Issue. 1-2, p. 80.
Laurila, T. Vuorinen, V. and Kivilahti, J.K. 2005. Interfacial reactions between lead-free solders and common base materials. Materials Science and Engineering: R: Reports, Vol. 49, Issue. 1-2, p. 1.
He, Min Chen, Zhong and Qi, Guojun 2005. Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints. Metallurgical and Materials Transactions A, Vol. 36, Issue. 1, p. 65.
Yoon, Jeong-Won and Jung, Seung-Boo 2005. Interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction. Journal of Alloys and Compounds, Vol. 396, Issue. 1-2, p. 122.
Kim, Dae-Gon and Jung, Seung-Boo 2005. Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method. MATERIALS TRANSACTIONS, Vol. 46, Issue. 11, p. 2366.
Kim, Dae-Gon Jang, Hyung-Sun Kim, Jong-Woong and Jung, Seung-Boo 2005. Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal aging. Journal of Materials Science: Materials in Electronics, Vol. 16, Issue. 9, p. 603.
Kumar, Aditya He, Min and Chen, Zhong 2005. Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder. Surface and Coatings Technology, Vol. 198, Issue. 1-3, p. 283.
Kim, Dae-Gon and Jung, Seung-Boo 2005. Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn–3.0Ag–0.5Cu Solder and Ni–P under Bump Metallurgy. MATERIALS TRANSACTIONS, Vol. 46, Issue. 6, p. 1295.
Kumamoto, Seishi Sakurai, Hitoshi Ikeda, Kazuki and Suganuma, Katsuaki 2005. Joints Soldered on Electroless Ni–Au Surfaces Using Cu-Containing Flux: Strength, Microstructure and Mechanism of Improvement. MATERIALS TRANSACTIONS, Vol. 46, Issue. 11, p. 2380.
Kim, Dae-Gon Kim, Jong-Woong and Jung, Seung-Boo 2005. Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn–3.0Ag–0.5Cu solder and Ni–P UBM. Materials Science and Engineering: B, Vol. 121, Issue. 3, p. 204.
Yoon-Chul Sohn Jin Yu Kang, S.K. Da-Yuan Shih and Taek-Yeong Lee 2005. Effect of Intermetallics Spalling on the Mechanical Behavior of Electroless Ni(P)/Pb-Free Solder Interconnection. Vol. 2, Issue. , p. 83.
Sohn, Yoon-Chul and Yu, Jin 2005. Correlation Between Chemical Reaction and Brittle Fracture Found in Electroless Ni(P)/immersion gold–solder Interconnection. Journal of Materials Research, Vol. 20, Issue. 08, p. 1931.
Zeng, Kejun Stierman, Roger Abbott, Don and Murtuza, Masood 2006. The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating. JOM, Vol. 58, Issue. 6, p. 75.
Ho, C. E. Yang, S. C. and Kao, C. R. 2006. Interfacial reaction issues for lead-free electronic solders. Journal of Materials Science: Materials in Electronics, Vol. 18, Issue. 1-3, p. 155.
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The interface microstructures of Sn-Ag and Sn-Ag-Cu solders with Au/Ni-6P plating were studied primarily using transmission electron microscopy. During soldering at 230°C, Au dissolved into molten solder, and double reaction layers of Ni3Sn4/η–Ni3SnP formed between Sn-3.5Ag solder and Ni-6P layer. P content increases in the surface region of the Ni-6P layer due to the depletion of Ni diffused into molten solder, resulting in the formation of Ni3P+Ni layer. For Sn-3.5Ag-0.7Cu solder, an η-(Ni,Cu)3Sn2 single layer, containing Cu of about 50 at.%, formed as a reaction layer.
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- ISSN: 0884-2914
- EISSN: 2044-5326
- URL: /core/journals/journal-of-materials-research
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