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Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders

  • Chi-Won Hwang (a1), Katsuaki Suganuma (a1), Masayuki Kiso (a2) and Shigeo Hashimoto (a2)

Abstract

The interface microstructures of Sn-Ag and Sn-Ag-Cu solders with Au/Ni-6P plating were studied primarily using transmission electron microscopy. During soldering at 230°C, Au dissolved into molten solder, and double reaction layers of Ni3Sn4/η–Ni3SnP formed between Sn-3.5Ag solder and Ni-6P layer. P content increases in the surface region of the Ni-6P layer due to the depletion of Ni diffused into molten solder, resulting in the formation of Ni3P+Ni layer. For Sn-3.5Ag-0.7Cu solder, an η-(Ni,Cu)3Sn2 single layer, containing Cu of about 50 at.%, formed as a reaction layer.

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Corresponding author

a)Address all correspondence to this author. e-mail: hwang12@sanken.osaka-u.ac.jp

References

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1.Glazer, J., J. Electron. Mater. 23, 693 (1994).
2.Suganuma, K., Current Opinion Solid State Mater. Sci 5, 55 (2001).
3.Kim, K.S., Huh, S.H., and Suganuma, K., Mater. Sci. Eng. A 333, 106 (2002).
4.Guo, F., Lucas, J.P., and Subramanian, K.N., J. Mater. Sci.: Mater. Electron. 12, 27 (2001).
5.Kang, S.K. and Sarkhel, A.K., J. Electron. Mater. 23, 701 (1994).
6.Ho, C.E., Tsai, R.Y., Lin, Y.L., and Kao, C.R., J. Electron. 31, 584 (2002).
7.Uenishi, K., Kohara, Y., Sakatani, S., and Kobayashi, K.F., in Proc. of the 9th Symposium on Microjoining and Assembly Technology in Electronics, edited by Nakata, S. (Yokohama, Japan, 2003), pp. 289294.
8.Liu, P.L. and Shang, J.K., Metall. Mater. Trans. A 31A, 2857 (2000).
9.Jang, J.W., Kim, P.G., and Tu, K.N., J. Appl. Phis. 85, 8456 (1999).
10.Ho, C.E., Shiau, L.C., and Kao, C.R., J. Electron. Mater. 31, 1264 (2002).
11.Villars, P., Pearson's Handbook of Crystallographic Data for Intermetallic Phases (ASM International, Materials Park, OH, 1997), pp. 2514.
12.Hwang, C.W., Suganuma, K., Lee, J.G., and Mori, H., J. Electron. Mater. 32, 52 (2003).
13.Massalski, T.B., Okamoto, H., Subramanian, P.R., and Kacprzak, L., Binary Alloy Phase Diagram, 2nd ed. (ASM International, Materials Park, OH, 1990), pp. 1481-1483, 28632864.

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