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Indentation plastic displacement field: Part I. The case of soft films on hard substrates

Published online by Cambridge University Press:  31 January 2011

T. Y. Tsui ,
Joost Vlassak  and
William D. Nix
T. Y. Tsui*
Affiliation:
Advanced Micro Devices, One AMD Place, Sunnyvale, California 94088
Joost Vlassak
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305
William D. Nix
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305
*
a)Address all correspondence to this author. e-mail: ttsui@svcam.amd.com
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Abstract

The plastic deformation behavior of Knoop indentations made in a soft, porous titanium/aluminum multilayered thin film on a hard silicon substrate is studied through use of the focused-ion-beam milling and imaging technique. Pileup is observed for indentations with depths larger than 30% of the total film thickness. Analysis of the indentation cross sections shows that plastic deformation around the indentation is partly accommodated by the closing of the pores within the multilayers. This densification process reduces the amount of pileup formed below that predicted by finite element simulations. Experimental results show that the pileup is formed by an increase of the titanium layer thickness near the edges of the indentation. The thickness increase is largest near the film/substrate interface and decreases toward the surface of the multilayered film. The amount of normal compression near the center of the indenter is characterized, and it is demonstrated that the deformation becomes more nonuniform with increasing indentation depth.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 6 , June 1999 , pp. 2196 - 2203
Copyright
Copyright © Materials Research Society 1999

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