Hostname: page-component-8448b6f56d-dnltx Total loading time: 0 Render date: 2024-04-24T18:16:21.023Z Has data issue: false hasContentIssue false

In situ observation of stress evolution in pure tin strip under electromigration using synchrotron radiation x-ray

Published online by Cambridge University Press:  31 January 2011

Ciou-Nan Siao
Affiliation:
Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan
Hsin-Yi Lee
Affiliation:
National Synchrotron Radiation Research Center, Hsinchu 300, Taiwan
Get access

Abstract

This investigation elucidates stress evolution in situ in tin strips under electromigration using synchrotron radiation x-ray. Minute variations in stress are determined precisely using intense x-rays. Back stresses gradient with the values of 5.5 and 16.5 MPa/cm, which are induced by the current densities of 1 × 103 and 5 × 103 A/cm2, respectively, are measured directly. The effective diffusivities that include both grain and lattice diffusion at various current densities are determined. The Joule heating is observed, ranging from 5 to 15 °C, according to various current densities passed through the stripes. Results of this study suggest that the protective oxide layer on the surfaces significantly influences the kinetics of stress evolution.

Type
Articles
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Hu, C.K., Harper, J.M.E.Copper interconnections and reliability. Mater. Chem. Phys. 52, 5 (1998)CrossRefGoogle Scholar
2.Ho, P.S., Kwok, T.Electromigration in metals. Rep. Prog. Phys. 52, 301 (1989)CrossRefGoogle Scholar
3.Tu, K.N.Recent advances on electromigration in very-large-scale-integration of interconnects. J. Appl. Phys. 94, 5451 (2003)CrossRefGoogle Scholar
4.Blech, I.A., Herring, C.Stress generation by electromigration. Appl. Phys. Lett. 29, 131 (1976)CrossRefGoogle Scholar
5.Wang, P.C., Cargill, G.S. III, Noyan, I.C., Hu, C.K.Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction. Appl. Phys. Lett. 72, 1296 (1998)CrossRefGoogle Scholar
6.Kao, H.K., Cargill, G.S. III, Giuliani, F., Hu, C.K.Relationship between copper concentration and stress during electromigration in an Al(0.25 at.% Cu) conductor line. J. Appl. Phys. 93, 2516 (2003)CrossRefGoogle Scholar
7.Korhonen, M.A., Børgesen, P., Tu, K.N., Li, C.Y.Stress evolution due to electromigration in confined metal lines. J. Appl. Phys. 73, 3790 (1993)CrossRefGoogle Scholar
8.Shatzkes, M., Lloyd, J.R.A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2. J. Appl. Phys. 59, 3890 (1986)CrossRefGoogle Scholar
9.Clement, J.J., Thompson, C.V.Modeling electromigration-induced stress evolution in confined metal lines. J. Appl. Phys. 78, 900 (1995)CrossRefGoogle Scholar
10.Tamura, N., Celestre, R.S., MacDowell, A.A., Padmore, H.A., Spolenak, R., Valek, B.C., Meier Chang, N., Manceau, A., Patel, J.R.Submicron x-ray diffraction and its applications to problems in materials and environmental science. Rev. Sci. Instrum. 73, 1369 (2002)CrossRefGoogle Scholar
11.Suo, Z.Electromigration-induced dislocation climb and multiplication in conducting lines. Acta Metall. Mater. 42, 3581 (1994)CrossRefGoogle Scholar
12.Kirchheim, R.Stress and electromigration in Al-lines of integrated circuits. Acta Metall. Mater. 40, 309 (1992)CrossRefGoogle Scholar
13.Hu, C.K., Rodbell, K.P., Sullivan, T.D., Lee, K.Y., Bouldin, D.P.Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM J. Res. Develop. 39, 465 (1995)CrossRefGoogle Scholar
14.Wu, A.T., Tu, K.N., Lloyd, J.R., Tamura, N., Valek, B.C., Kao, C.R.Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction. Appl. Phys. Lett. 85, 2490 (2004)CrossRefGoogle Scholar
15.Lee, A., Liu, W., Ho, C.E., Subramanian, K.N.Synchrotron x-ray microscopy studies on electromigration of a two-phase material. J. Appl. Phys. 102, 053507 (2007)CrossRefGoogle Scholar
16.Tu, K.N.Solder Joint Technology (Springer, New York 2007) Chap. 9CrossRefGoogle Scholar