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In situ investigation of the interfacial reaction in Sn/Cu system by synchrotron radiation

Published online by Cambridge University Press:  31 January 2011

Kai-Jheng Wang ,
Yung-Chi Lin ,
Jenq-Gong Duh ,
Ching-Yuan Cheng  and
Jey-Jau Lee
Jenq-Gong Duh*
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
Jey-Jau Lee
Affiliation:
National Synchrotron Radiation Research Center, Hsinchu 30076, Taiwan
*
a)Address all correspondence to this author. e-mail: jgd@mx.nthu.edu.tw
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Abstract

In situ investigation of the interfacial reaction in the Sn/Cu thin film during aging, and reflow was carried out by synchrotron radiation with high intensity and high resolution of x-ray. With this technique, the phase transformation and evolution of the Sn/Cu thin film during heat treatment can be directly and continuously investigated. Moreover, the information for coefficient of thermal expansion in intermetallic compounds was also evaluated by this approach.

Keywords

SolderingPhase transformationX-ray diffraction (XRD)
Type
Articles
Information
Journal of Materials Research , Volume 25 , Issue 5 , May 2010 , pp. 972 - 975
Copyright
Copyright © Materials Research Society 2010

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References

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