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In situ characterization of fracture toughness and dynamics of nanocrystalline titanium nitride films

Published online by Cambridge University Press:  12 February 2016

Yang Hu ,
Jia-Hong Huang  and
Jian-Min Zuo
Yang Hu
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
Jia-Hong Huang
Affiliation:
Department of Engineering and System Science, National Tsing Hua University, Hsinchu 30013, Taiwan
Jian-Min Zuo*
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
*
a) Address all correspondence to this author. e-mail: jianzuo@illinois.edu
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Abstract

We designed a clamped beam bending test using a nanoindentation holder with help of transmission electron microscopy (TEM) and focused ion beam specimen fabrication. The microstructure evolution and crack propagation in nanocrystalline TiN were studied by electron imaging and load–displacement measurements during mechanical loading. By measuring the loads under which the crack starts and stops propagating and the time, we obtained the film's fracture toughness using the finite element method and crack propagation speed. Among these, we identified three types of crack propagation pathways, namely bridging, intergranular and a mixed mode of transgranular and intergranular fracture, and the associated microstructure changes. The measured fracture toughness is in agreement with the reported values. Thus, our in situ TEM bending test provides the first direct measurement of fracture toughness in a TEM and a correlation of fracture toughness with fracture toughening mechanisms in nanocrystalline TiN. The method is general and can be applied to other nanocrystalline materials.

Keywords

fracturetransmission electron microscope (TEM)toughness
Type
Articles
Information
Journal of Materials Research , Volume 31 , Issue 3 , 15 February 2016 , pp. 370 - 379
Copyright
Copyright © Materials Research Society 2016 

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Footnotes

Contributing Editor: George M. Pharr

References

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