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The growth of strained Si1−xGex alloys on 〈001〉 silicon using solid phase epitaxy

Published online by Cambridge University Press:  31 January 2011

D.C. Paine
Affiliation:
Brown University, Division of Engineering, Providence, Rhode Island 02912
D.J. Howard
Affiliation:
Brown University, Division of Engineering, Providence, Rhode Island 02912
N.G. Stoffel
Affiliation:
Bellcore, Red Bank, New Jersey 07701
J.A. Horton
Affiliation:
Oak Ridge National Laboratory, Metals and Ceramics Division, Oak Ridge, Tennessee 37830
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Abstract

In this paper we report on the growth of pseudomorphically strained Si1−xGex alloys on 〈001〉 Si by solid phase epitaxy. One set of amorphous alloys was formed by high dose ion implantation 74Gc implanted at an energy of 200 kcV to a fluence of 9.6 ⊠ 1020/m2). Our TEM observations show that regrowth of these Si1−xGex(xmax = 0.14) films at ≍590°C results in a high density of planar defects and that these defects are associated with faceting of the amorphous/crystalline interface during annealing. These results were compared with the solid phase regrowth of MBE-grown Si0.7Ge0.3 amorphized with 170 keV 28Si ions which exhibited identical defects and faceting during regrowth. Attendant with this faceting was a decrease in the regrowth velocity, a result of a change from a planar {001} growth morphology to a multi-faceted growth surface containing many <50 nm deep pyramidal impressions. The regrowth rate was quantified, at a particular temperature, by the use of Si homoepitaxy for calibration of in situ TEM experiments. It was shown that the regrowth rate at 594°C in pure Si was 51 nm/min, whereas in the Si0.7Ge0.3 the regrowth rate decreased, as a result of {111} faceting, to 21 nm/min. RBS was used to characterize Ge concentrations and lattice resolution TEM was used to study the development of the faceted interface and associated planar defects during regrowth.

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Articles
Copyright
Copyright © Materials Research Society 1990

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References

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