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Finite element analysis of residual stress and interlayer in hard coating/interlayer/soft substrate system during nanoindentation

Published online by Cambridge University Press:  31 January 2011

Liuhe Li ,
Lan Yin  and
Paul K. Chu
Liuhe Li*
Affiliation:
School of Physics and Materials Science, City University of Hong Kong, Kowloon, Hong Kong, People’s Republic of China; and School of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100083, China
Lan Yin
Affiliation:
School of Physics and Materials Science, City University of Hong Kong, Kowloon, Hong Kong, People’s Republic of China; and School of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100083, China
Paul K. Chu*
Affiliation:
School of Physics and Materials Science, City University of Hong Kong, Kowloon, Hong Kong, People’s Republic of China
*
a)e-mail: liliuhe@buaaa.edu.cn
b)e-mail: paul.chu@cityu.edu.hk
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Abstract

The mechanical properties of thin films are frequently evaluated using nanoindentation. The finite element method (FEM) is very effective for investigating the stress and strain fields of the film–substrate system during nanoindentation. However, the role of residual stress and the thin interlayer between the film and substrate is not well known, especially when the hard coating/interlayer/soft substrate are considered together. In this work, the FEM is used to investigate the load-displacement behavior of the hardness of the hard coating/interlayer/soft substrate system. The load–displacement process is simulated, and the effects of different residual stresses and interlayer thicknesses are discussed.

Keywords

CoatingStress/strain relationship
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 5 , May 2008 , pp. 1358 - 1363
Copyright
Copyright © Materials Research Society 2008

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References

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