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Fatigue failure in Pb–Sn–Ag alloy during plastic deformation: A 3D-SIMS imaging study

Published online by Cambridge University Press:  31 January 2011

Antonino Scandurra ,
Antonino Licciardello ,
Alberto Torrisi ,
Antonio La Mantia  and
Orazio Puglisi
Antonino Scandurra
Affiliation:
CNR–Istituto di Metodologie e Tecnologie per la Microelettronica, viale A. Doria 6, Catania, Italy
Antonino Licciardello
Affiliation:
Consorzio Catania Ricerche, viale A. Doria 6, Catania, Italy
Alberto Torrisi
Affiliation:
Dipartimento di Scienze Chimiche dell' Università, viale A. Doria 6, Catania 95125, Italy
Antonio La Mantia
Affiliation:
SGS–Thomson Microelectronics, Stradale Primosole 50, Catania, Italy
Orazio Puglisi
Affiliation:
Dipartimento di Scienze Chimiche dell' Università, viale A. Doria 6, Catania 95125, Italy
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Abstract

Three-dimensional chemical maps by Secondary Ion Mass Spectrometry (3D-SIMS), XPS spectroscopy, and SEM-EDAX microscopy were employed in order to investigate the effects of accelerated fatigue tests on crack formation in 95.5% Pb–2% Sn–2.5% Ag and 95% Pb–5% Sn solder joints. These alloys are used in the die bonding of electronic power device assemblies. The results show that cracks form by Sn-depletion from the inner regions of the soldered joint. Simultaneously, there is a recrystallization of the Pb-rich phase in the same regions of the joint. The crack occurs at a critical number of cycles when a Sn-depleted region is formed, yielding weaker inner layers with lower shear strength. A possible explanation of the Sn-depletion is also discussed.

Type
Articles
Information
Journal of Materials Research , Volume 7 , Issue 9 , September 1992 , pp. 2395 - 2402
Copyright
Copyright © Materials Research Society 1992

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