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Epitaxical nucleation of polycrystalline silicon carbide during chemical vapor deposition

Published online by Cambridge University Press:  03 March 2011

Brian W. Sheldon
Affiliation:
Division of Engineering, Brown University, Providence, Rhode Island 02912, and Oak Ridge Associated Universities, Oak Ridge, Tennessee 37831
Theodore M. Besmann
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
Karren L. More
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
Thomas S. Moss
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831

Extract

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Polycrystalline silicon carbide was deposited from methyltrichlorosilane in cold-walled and hot-walled reactors, on (100) SiC surface layers that were formed on (100) Si wafers. The initial stages of the process were studied by electron microscopy after relatively short deposition times. Submicron surface features nucleated with a specific crystallographic orientation with respect to the substrate, where {111} planes in the β–SiC substrate coincided with {0001} planes in the α–SiC features. These α–SiC features occurred only at twins on {111} planes of the β–SiC substrate. This demonstrates that nucleation under these conditions is controlled by defects in the substrate. Surface contamination and the reactor configuration also had substantial effects on nucleation.

Type
Erratum
Copyright
Copyright © Materials Research Society 1993