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Enhanced tensile ductility in an electrodeposited nanocrystalline copper

  • Guoyong Wang (a1), Zhonghao Jiang (a1), Hanzhuo Zhang (a1) and Jianshe Lian (a1)


A fully dense nanocrystalline (nc) Cu with mean grain size of 72 nm and a broad grain size distribution was synthesized by electrodeposition. Uniaxial tensile tests were done at different strain rates and room temperature. A very high strength of 1.04 G was obtained at strain rate of 0.1 s−1. The nearly perfect plasticity with a large strain of close to 20% was displayed at specific low strain rates of 4 × 10−5 to 10−4 s−1. With increasing strain rate, the nearly perfect plasticity disappeared. Strain rate sensitivity and activation volume of the nc Cu were estimated from the flow stress at a fixed strain of 1% and a strain rate change (jump) test. It was deduced from the high strain rate sensitivity exponent of 0.08 and small activation volume of 12b3 that both dislocation and grain boundary activities would take place in this nc Cu, which explained the nearly perfect plasticity observed in the tensile test.


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1Herzberg, R.W.: Deformation and Fracture Mechanics of Engineering Materials 3rd ed.John Wiley and Sons New York 1989 392
2Youssef, M.K., Scattergood, R.O., Murty, K.L., Horton, J.A., Koch, C.C.: Ultrahigh strength and high ductility of bulk nanocrystalline copper. Appl. Phys. Lett. 87, 091904 2005
3Gu, C., Lian, J., Jiang, Q., Jiang, Z.: Ductile-brittle-ductile transition in an electrodeposited 13 nanometer grain sized Ni–8.6 wt% Co alloy. Mater. Sci. Eng., A 459, 75 2007
4Koch, C.C.: Optimization of strength and ductility in nanocrystalline and ultrafine grained metals. Scr. Mater. 49, 657 2003
5Ma, E.: Instabilities and ductility of nanocrystalline and ultrafine-grained metals. Scr. Mater. 49, 663 2003
6Wang, Y.M., Wang, K., Pan, D., Lu, K., Hemker, K.J., Ma, E.: Microsample tensile testing of nanocrystalline copper. Scr. Mater. 48, 1581 2003
7Wang, Y., Chen, M., Zhou, F., Ma, E.: High tensile ductility in a nanostructured metal. Nature 419, 912 2002
8Zhang, H., Jiang, Z., Lian, J., Jiang, Q.: Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size. Mater. Sci. Eng., A 479, 136 2008
9Shen, X., Lian, J., Jiang, Z., Jiang, Q.: High strength and high ductility of electrodeposited nanocrystalline Ni with a broad grain size distribution. Mater. Sci. Eng., A 487, 410 2008
10Jiang, Z., Liu, X., Li, G., Jiang, Q., Lian, J.: Strain rate sensitivity of a nanocrystalline Cu synthesized by electric brush plating. Appl. Phys. Lett. 88, 143115 2006
11Chen, J., Lu, L., Lu, K.: Hardness and strain rate sensitivity of nanocrystalline Cu. Scr. Mater. 54, 1913 2006
12Guduru, R.K., Murty, K. Linga, Youssef, M.K., Scattergood, R.O., Koch, C.C.: Mechanical behavior of nanocrystalline copper. Mater. Sci. Eng., A 463, 14 2007
13Dao, M., Lu, L., Asaro, R.J., De Hosson, J.T.M., Ma, E.: Toward a quantitative understanding of mechanical behavior of nanocrystalline metals. Acta Mater. 55, 4041 2007
14Klug, H.P., Alexander, L.E.: X-ray Diffraction Procedures 2nd ed.Wiley New York 1974 505
15Wei, H., Hibbard, G.D., Palumbo, G., Erb, U.: The effect of gauge volume on the tensile properties of nanocrystalline electrodeposits. Scr. Mater. 57, 996 2007
16Torre, F. Dalla, Van Swygenhoven, H., Victoria, M.: Nanocrystalline electrodeposited Ni: Microstructure and tensile properties. Acta Mater. 50, 3957 2002
17Gu, C., Lian, J., Jiang, Z., Jiang, Q.: Enhanced tensile ductility in an electrodeposited nanocrystalline Ni. Scr. Mater. 54, 579 2006
18Sabirov, I., Estrin, Y., Barnett, M.R., Timokhina, I., Hodgson, P.D.: Enhanced tensile ductility of an ultra-fine-grained aluminum alloy. Scr. Mater. 58, 163 2008
19Cheng, S., Ma, E., Wang, Y.M., Kecskes, L.J., Youssef, K.M., Koch, C.C., Trociewitz, U.P., Han, K.: Tensile properties of in situ consolidated nanocrystalline Cu. Acta Mater. 53, 1521 2005
20Asaro, R.J., Suresh, S.: Mechanistic models for the activation volume and rate sensitivity in metals with nanocrystalline grains and nano-scale twins. Acta Mater. 53, 3369 2005
21Lu, L., Schwarger, R., Shan, Z.W., Dao, M., Lu, K., Suresh, S.: Nano-sized twins induce high rate sensitivity of flow stress in pure copper. Acta Mater. 53, 2169 2005
22Wei, Q., Cheng, S., Ramesh, K.T., Ma, E.: Effect of nanocrystalline and ultrafine grain sizes on the strain rate sensitivity and activation volume: fcc versus bcc metals. Mater. Sci. Eng., A 381, 71 2004
23Lian, J., Gu, C., Jing, Q., Jiang, Z.: Strain rate sensitivity of face-centered-cubic nanocrystalline materials based on dislocation deformation. J. Appl. Phys. 99, 076103 2006
24Ma, E.: Eight routes to improve the tensile ductility of bulk nanostructured metals and alloys. JOM 58, 49 2006
25Wang, Y.M., Hamza, A.V., Ma, E.: Temperature-dependent strain rate sensitivity and activation volume of nanocrystalline Ni. Acta Mater. 54, 2715 2006
26Wang, Y.M., Ma, E.: Temperature and strain rate effects on the strength and ductility of nanostructured copper. Appl. Phys. Lett. 83, 3165 2003
27Wang, Y.M., Ma, E.: Three strategies to achieve uniform tensile deformation in a nanostructured metal. Acta Mater. 52, 1699 2004
28Li, H., Ebrahimi, F.: Ductile-to-brittle transition in nanocrystalline metals. Adv. Mater. 17, 1969 2005
29Li, H., Ebrahimi, F.: Tensile behavior of a nanocrystalline Ni-Fe alloy. Acta Mater. 54, 2877 2006
30Gu, C.D., Lian, J.S., Jiang, Q., Zheng, W.T.: Experimental and modeling investigations on strain rate sensitivity of an electrodeposited 20 nm grain sized Ni. J. Phys. D: Appl. Phys. 40, 7440 2007
31Kumar, K.S., Suresh, S., Chisholm, M.F., Horton, J.A., Wang, P.: Deformation of electrodeposited nanocrystalline nickel. Acta Mater. 51, 387 2003
32Ma, E., Wang, Y.M., Lu, Q.H., Sui, M.L., Lu, L., Lu, K.: Strain hardening and large tensile elongation in ultrahigh-strength nano-twinned copper. Appl. Phys. Lett. 85, 4932 2004
33Chanmpaion, Y., Langlois, C., Guérin-Mailly, S., Langlois, P., Bonnentien, J-L., Hÿtch, M.J.: Near-perfect elastoplasticity in pure nanocrystalline copper. Science 300, 310 2003
34Wang, Y.M., Ma, E.: On the origin of ultrahigh cryogenic strength of nanocrystalline metals. Appl. Phys. Lett. 85, 2750 2004
35Brandl, C., Bitzek, E., Derlet, P.M., Van Swygenhoven, H.: Slip transfer through a general high angle grain boundary in nanocrystalline aluminum. Appl. Phys. Lett. 91, 111914 2007
36Ovid’ko, I.A.: Review on the fracture processes in nanocrystalline materials. J. Mater. Sci. 42, 1694 2007


Enhanced tensile ductility in an electrodeposited nanocrystalline copper

  • Guoyong Wang (a1), Zhonghao Jiang (a1), Hanzhuo Zhang (a1) and Jianshe Lian (a1)


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