Hostname: page-component-7c8c6479df-5xszh Total loading time: 0 Render date: 2024-03-29T15:21:31.268Z Has data issue: false hasContentIssue false

Electron field emission from Ar+ ion-treated thick-film carbon paste

Published online by Cambridge University Press:  31 January 2011

Gillian A. M. Reynolds
Affiliation:
DuPont Central Research and Development, Wilmington, Delaware 19880
Lap-Tak Cheng
Affiliation:
DuPont Central Research and Development, Wilmington, Delaware 19880
Robert Bouchard
Affiliation:
DuPont Central Research and Development, Wilmington, Delaware 19880
Paul Moffett
Affiliation:
DuPont Central Research and Development, Wilmington, Delaware 19880
Howard Jones
Affiliation:
DuPont Central Research and Development, Wilmington, Delaware 19880
Linda F. Robinson
Affiliation:
DuPont Central Research and Development, Wilmington, Delaware 19880
S. Ismat Shah
Affiliation:
Department of Materials Science and Engineering and Department of Physics and Astronomy, University of Delaware, Newark, Delaware 19716
Daniel I. Amey
Affiliation:
DuPont Electronic Technologies, Research Triangle Park, North Carolina 27709
Get access

Abstract

Ion bombardment was used to produce electron-emitting microscale features on surfaces of thick films printed with carbon pastes. This technology can potentially enable the development of large-area field emission displays. Systematic investigations using microscopy and electron field emission experiments have demonstrated a close link among paste formulation, ion processing parameters, and the development of surface microstructures. These investigations were also useful in understanding the fundamentals of microstructure formation under ion bombardment and the field emission characteristics of the carbon-based emitters. Several device concepts aimed toward achieving a low-voltage switchable triode were also tested with varying degrees of success. In this paper, we discuss various technological issues related to the materials, processes, and devices.

Type
Articles
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Spindt, C.A., Brodie, I., Humphrey, L., and Westerberg, E.R., J. Appl. Phys. 47, 5248 (1976).CrossRefGoogle Scholar
2.Ito, F., Konuma, K., and Okamoto, A., J. Appl. Phys. 89, 8141 (2001).CrossRefGoogle Scholar
3.Heer, W.A. de, Chatelain, A., and Ugarte, D., Science 270, 1179 (1995).CrossRefGoogle Scholar
4.Merkulov, V.I., Lowndes, D.H., and Baylor, L.R., Appl. Phys. Lett. 75, 1228 (1999).CrossRefGoogle Scholar
5.Zhou, D., Krauss, A.R., Corrigan, T.D., McCauley, T.G., Chang, R.P.H., and Gruen, D.M., J. Electrochem. Soc. 144, 224 (1997).CrossRefGoogle Scholar
6.Wang, C., Garcia, A., Ingram, D.C., Lake, M., and Kordesh, M.E., Electron. Lett. 27, 1459 (1991).CrossRefGoogle Scholar
7.Zhu, W., Kochanaski, C.P., Jin, S., and Seibles, L., J. Appl. Phys. 78, 2707 (1995).CrossRefGoogle Scholar
8.Voevodin, A.A. and Donley, M.S., Surf. Coat. Technol. 82, 199 (1996).CrossRefGoogle Scholar
9.Visscher, G.T., Nesting, D.C., Badding, J.V., and Bianconi, P.A., Science 260, 1496 (1993).CrossRefGoogle Scholar
10.Collins, P.G. and Zettl, Z., Phys. Rev. B 55, 9391 (1997).CrossRefGoogle Scholar
11.Wehner, G.K., J. Vac. Sci. Technol., A 3(4), 1821 (1985).CrossRefGoogle Scholar
12.Floro, J.A., Rossnagel, S.M., and Robinson, R.S., J. Vac. Sci. Technol. A 1, 1398 (1983).CrossRefGoogle Scholar
13.Wang, Z., Zhu, F., Wang, W., Yu, G., and Ruan, M., Appl. Phys. A 71, 353 (2000).CrossRefGoogle Scholar
14.Vechten, J.A. Van, Solberg, W., Batson, P.E., Cuomo, J.J., and Rossnagel, S.M., J. Cryst. Growth 82, 289 (1987).CrossRefGoogle Scholar
15.Solberg, W.A. and Spain, I.L., J. Vac. Sci. Technol. A 8, 3907 (1990).CrossRefGoogle Scholar
16.Park, K.H., Lee, K.M., Choi, S., Lee, S., and Koh, K.H., J. Vac. Sci. Technol. B 19, 946 (2001).CrossRefGoogle Scholar
17.Nilsson, L., Groening, O., Groening, P., Kuettel, O., and Schlapbach, L., J. Appl. Phys. 90, 768 (2001).CrossRefGoogle Scholar
18.S. Ismat Shah, in Handbook of Thin Film Process Technology, edited by Shah, S. Ismat and Glocker, D. (IOP, Bristol, U.K., 1995).Google Scholar