Hostname: page-component-77c89778f8-vsgnj Total loading time: 0 Render date: 2024-07-19T02:03:16.989Z Has data issue: false hasContentIssue false

Electromagnetic interference shielding and mechanical properties of Si3N4–SiOC composites fabricated by 3D-printing combined with polymer infiltration and pyrolysis

Published online by Cambridge University Press:  02 May 2017

Wenyan Duan
Affiliation:
Science and Technology on Thermostructural Composite Materials Laboratory, Northwestern Polytechnical University, Xi’an 710072, China
Zhe Fan
Affiliation:
Science and Technology on Thermostructural Composite Materials Laboratory, Northwestern Polytechnical University, Xi’an 710072, China
Hui Wang
Affiliation:
Science and Technology on Thermostructural Composite Materials Laboratory, Northwestern Polytechnical University, Xi’an 710072, China
Jingyi Zhang
Affiliation:
Science and Technology on Thermostructural Composite Materials Laboratory, Northwestern Polytechnical University, Xi’an 710072, China
Tianlu Qiao
Affiliation:
Science and Technology on Thermostructural Composite Materials Laboratory, Northwestern Polytechnical University, Xi’an 710072, China
Xiaowei Yin*
Affiliation:
Science and Technology on Thermostructural Composite Materials Laboratory, Northwestern Polytechnical University, Xi’an 710072, China
*
a) Address all correspondence to this author. e-mail: yinxw@nwpu.edu.cn
Get access

Abstract

Twinned silicon carbide (SiC) nanowires (NWs) reinforced Si3N4–SiOC composites were successfully fabricated through a joint process of three-dimensional printing (3DP), direct nitridation, and polymer infiltration and pyrolysis (PIP). 3DP and PIP were both addictive manufacturing processes, enabling the near net shape fabrication and microstructure designing of Si3N4–SiOC. With the increase of the PIP cycle number, the pores of Si3N4 were mostly filled with polymer-derived ceramics-silicon oxycarbide (containing SiC NWs and free carbons), which led to the increase of electrical conductivity of Si3N4–SiOC composites. With the increase of SiOC ceramics, the electromagnetic interference shielding effectiveness of Si3N4–SiOC composites increased from 2 dB to 35 dB, in which the absorption shielding effectiveness increased to 27 dB. The flexural strength of Si3N4–SiOC composites reached 63 MPa when the content of SiOC ceramics was 50.1 wt%. It is indicated that Si3N4–SiOC ceramics are a promising electromagnetic shielding and structural material.

Type
Invited Articles
Copyright
Copyright © Materials Research Society 2017 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

Contributing Editor: Nahum Travitzky

b)

This author was an editor of this journal during the review and decision stage. For the JMR policy on review and publication of manuscripts authored by editors, please refer to http://www.mrs.org/editor-manuscripts/.

A previous error in this article has been corrected, see 10.1557/jmr.2017.245.

References

REFERENCES

Yin, X., Kong, L., Zhang, L., Cheng, L., Travitzky, N., and Greil, P.: Electromagnetic properties of SiCN based ceramics and composites. Int. Mater. Rev. 59(6), 326 (2014).Google Scholar
Cao, M.S., Song, W.L., Hou, Z.L., Wen, B., and Yuan, J.: The effects of temperature and frequency on the dielectric properties, electromagnetic interference shielding and microwave-absorption of short carbon fiber/silica composites. Carbon 48(3), 788 (2010).Google Scholar
Fugetsu, B., Sano, E., Sunada, M., Sambongi, Y., Shibuya, T., Wang, X., and Hiraki, T.: Electrical conductivity and electromagnetic interference shielding efficiency of carbon nanotube/cellulose composite paper. Carbon 46(9), 1256 (2008).Google Scholar
Micheli, D., Apollo, C., Pastore, R., and Marchetti, M.: X-Band microwave characterization of carbon-based nanocomposite material, absorption capability comparison and RAS design simulation. Compos. Sci. Technol. 70(2), 400 (2010).Google Scholar
Brosseau, C.: Modelling and simulation of dielectric heterostructures: A physical survey from an historical perspective. J. Phys. D: Appl. Phys. 39, 1277 (2006).CrossRefGoogle Scholar
Kong, L., Li, Z., Liu, L., Huang, R., Abshinova, M., Yang, Z., Tang, C., Tan, P., Deng, C., and Matitsine, S.: Recent progress in some composite materials and structures for specific electromagnetic applications. Int. Mater. Rev. 58(4), 203 (2013).Google Scholar
Shi, Z.C., Fan, R.H., Zhang, Z.D., Qian, L., Gao, M., Zhang, M., Zheng, L.T., Zhang, X.H., and Yin, L.W.: Random composites of nickel networks supported by porous alumina toward double negative materials. Adv. Mater. 24(17), 2349 (2012).Google Scholar
Sun, K., Fan, R., Zhang, Z., Yan, K., Zhang, X., Xie, P., Yu, M., and Pan, S.: The tunable negative permittivity and negative permeability of percolative Fe/Al2O3 composites in radio frequency range. Appl. Phys. Lett. 106(17), 172902 (2015).Google Scholar
Wang, Z., Wu, L., Zhou, J., Jiang, Z., and Shen, B.: Chemoselectivity-induced multiple interfaces in MWCNT/Fe3O4@ZnO heterotrimers for whole X-band microwave absorption. Nanoscale 6(21), 12298 (2014).Google Scholar
Liang, C., Gou, Y., Wu, L., Zhou, J., Kang, Z., Shen, B., and Wang, Z.: Nature of electromagnetic-transparent SiO2 shell in hybrid nanostructure enhancing electromagnetic attenuation. J. Phys. Chem. C 120(24), 12967 (2016).CrossRefGoogle Scholar
Riley, F.L.: Silicon nitride and related materials. J. Am. Ceram. Soc. 83(2), 245 (2000).Google Scholar
Chung, D.: Carbon materials for structural self-sensing, electromagnetic shielding and thermal interfacing. Carbon 50(9), 3342 (2012).Google Scholar
Moglie, F., Micheli, D., Laurenzi, S., Marchetti, M., and Primiani, V.M.: Electromagnetic shielding performance of carbon foams. Carbon 50(5), 1972 (2012).Google Scholar
Mu, Y., Zhou, W., Wang, C., Luo, F., Zhu, D., and Ding, D.: Mechanical and electromagnetic shielding properties of SiCf/SiC composites fabricated by combined CVI and PIP process. Ceram. Int. 40(7), 10037 (2014).Google Scholar
Ding, D., Shi, Y., Wu, Z., Zhou, W., Luo, F., and Chen, J.: Electromagnetic interference shielding and dielectric properties of SiCf/SiC composites containing pyrolytic carbon interphase. Carbon 60, 552 (2013).Google Scholar
Zhang, H., Xu, Y., Zhou, J., Jiao, J., Chen, Y., Wang, H., Liu, C., Jiang, Z., and Wang, Z.: Stacking fault and unoccupied densities of state dependence of electromagnetic wave absorption in SiC nanowires. J. Mater. Chem. C 3(17), 4416 (2015).Google Scholar
Cheng, C., Yan, K., Fan, R., Qian, L., Zhang, Z., Sun, K., and Chen, M.: Negative permittivity behavior in the carbon/silicon nitride composites prepared by impregnation-carbonization approach. Carbon 96, 678 (2016).Google Scholar
Xiang, C., Pan, Y., Liu, X., Sun, X., Shi, X., and Guo, J.: Microwave attenuation of multiwalled carbon nanotube-fused silica composites. Appl. Phys. Lett. 87(12), 123103 (2005).Google Scholar
Hao, X., Yin, X., Zhang, L., and Cheng, L.: Dielectric, electromagnetic interference shielding and absorption properties of Si3N4–PyC composite ceramics. J. Mater. Sci. Technol. 29(3), 249 (2013).Google Scholar
Chen, M., Yin, X., Li, M., Chen, L., Cheng, L., and Zhang, L.: Electromagnetic interference shielding properties of silicon nitride ceramics reinforced by in situ grown carbon nanotubes. Ceram. Int. 41(2), 2467 (2015).CrossRefGoogle Scholar
Li, X., Zhang, L., Yin, X., Feng, L., and Li, Q.: Effect of chemical vapor infiltration of SiC on the mechanical and electromagnetic properties of Si3N4–SiC ceramic. Scr. Mater. 63(6), 657 (2010).Google Scholar
Duan, W., Yin, X., Li, Q., Liu, X., Cheng, L., and Zhang, L.: Synthesis and microwave absorption properties of SiC nanowires reinforced SiOC ceramic. J. Eur. Ceram. Soc. 34(2), 257 (2014).Google Scholar
Colombo, P., Mera, G., Riedel, R., and Sorarù, G.D.: Polymer-derived ceramics: 40 years of research and innovation in advanced ceramics. J. Am. Ceram. Soc. 93(7), 1805 (2010).Google Scholar
Duan, W., Yin, X., Cao, F., Jia, Y., Xie, Y., Greil, P., and Travitzky, N.: Absorption properties of twinned SiC nanowires reinforced Si3N4 composites fabricated by 3d-prining. Mater. Lett. 159, 257 (2015).Google Scholar
Pavarajarn, V., Vongthavorn, T., and Praserthdam, P.: Enhancement of direct nitridation of silicon by common metals in silicon nitride processing. Ceram. Int. 33(4), 675 (2007).Google Scholar
Wu, R., Pan, Y., Yang, G., Gao, M., Wu, L., Chen, J., Zhai, R., and Lin, J.: Twinned SiC zigzag nanoneedles. J. Phys. Chem. C 111(17), 6233 (2007).Google Scholar
Lin, Z., Wang, L., Zhang, J., Guo, X.Y., Yang, W., Mao, H.K., and Zhao, Y.: Nanoscale twinning-induced elastic strengthening in silicon carbide nanowires. Scr. Mater. 63(10), 981 (2010).Google Scholar
Seong, H.K., Choi, H.J., Lee, S.K., Lee, J.I., and Choi, D.J.: Optical and electrical transport properties in silicon carbide nanowires. Appl. Phys. Lett. 85(7), 1256 (2004).Google Scholar
Celozzi, S., Lovat, G., and Araneo, R.: Electromagnetic shielding (Wiley, Hoboken, 2008).Google Scholar
Yin, X., Travitzky, N., and Greil, P.: Near-net-shape fabrication of Ti3AlC2-based composites. Int. J. Appl. Ceram. Technol. 4(2), 184 (2007).Google Scholar
Nan, B., Yin, X., Zhang, L., and Cheng, L.: Three-dimensional printing of Ti3AlC2-based ceramics. J. Am. Ceram. Soc. 94(4), 969 (2011).Google Scholar
Moon, J., Caballero, A.C., Hozer, L., Chiang, Y.M., and Cima, M.J.: Fabrication of functionally graded reaction infiltrated SiC–Si composite by three-dimensional printing (3DP™) process. Mater. Sci. Eng., A 298(1), 110 (2001).Google Scholar
Utela, B., Storti, D., Anderson, R., and Ganter, M.: A review of process development steps for new material systems in three dimensional printing (3DP). J. Manuf. Process. 10(2), 96 (2008).CrossRefGoogle Scholar
Fu, Z., Schlier, L., Travitzky, N., and Greil, P.: Three-dimensional printing of SiSiC lattice truss structures. Mater. Sci. Eng., A 560, 851 (2013).Google Scholar
Lu, K. and Reynolds, W.T.: 3DP process for fine mesh structure printing. Powder Technol. 187(1), 11 (2008).Google Scholar

A correction has been issued for this article: