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Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

Published online by Cambridge University Press:  03 March 2011

F. Guo ,
J.G. Lee ,
T. Hogan  and
K.N. Subramanian
F. Guo
Affiliation:
Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan 48824-1226
J.G. Lee
Affiliation:
Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan 48824-1226
T. Hogan
Affiliation:
Electrical and Computer Engineering Department, Michigan State University, East Lansing, Michigan 48824-1226
K.N. Subramanian*
Affiliation:
Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan 48824-1226
*
a) Address all correspondence to this author. e-mail: subraman@egr.msu.edu
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Abstract

Electrical conductivity of electronic interconnects made with Sn-based solders undergo a significant amount of deterioration during service. Several factors, such as anisotropy of Sn, coefficient of thermal expansion mismatches between the entities that make up the joint, and growth of intermetallic compounds present within the solder and solder/substrate interface, may contribute to the damage accumulation during thermal excursions and cause deterioration of properties. This study dealing with effects of aging and thermal shock on electrical conductivity, carried out with bulk Sn, and eutectic Sn–Ag in bulk and joint configurations, is aimed at evaluating the roles of the above factors on the deterioration of electrical conductivity from these thermal excursions.

Keywords

Electronic materialElectronic propertiesJoining
Type
Articles
Information
Journal of Materials Research , Volume 20 , Issue 2 , February 2005 , pp. 364 - 374
Copyright
Copyright © Materials Research Society 2005

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