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Effect of rotary-die equal channel angular pressing on the thermoelectric properties of a (Bi,Sb)2Te3 alloy

Published online by Cambridge University Press:  01 April 2005

Z.M. Sun*
Affiliation:
National Institute of Advanced Industrial Science and Technology, Nagoya 463-8560, Japan; and Department of Materials Science and Engineering, Drexel University, Philadelphia, Pennsylvania 19104
H. Hashimoto
Affiliation:
National Institute of Advanced Industrial Science and Technology, Nagoya 463-8560, Japan
N. Keawprak
Affiliation:
National Institute of Advanced Industrial Science and Technology, Nagoya 463-8560, Japan
A.B. Ma
Affiliation:
National Institute of Advanced Industrial Science and Technology, Nagoya 463-8560, Japan
L.F. Li
Affiliation:
Technical Institute of Physics and Chemistry, Chinese Academy of Sciences,Beijing, People's Republic of China
M.W. Barsoum
Affiliation:
Department of Materials Science and Engineering, Drexel University, Philadelphia, Pennsylvania 19104
*
a) Address all correspondence to this author.e-mail: z.m.sun@aist.go.jp
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Abstract

A (Bi,Sb)2Te3 alloy powder was sintered via a pulse discharge sintering process followed by a rotary-die equal channel angular pressing (ECAP) process. It was found by x-ray diffraction analysis that the as-sintered material shows preferentially orientated microstructure, which were considerably eliminated by following ECAP processes. Generally, the Seebeck coefficient of the material was reduced by ECAP processing, which was attributed to the increased carrier concentration after the severe plastic deformation. Electrical conductivity increases after ECAP, which was also originated from the increased carrier concentration. The figure of merit of the material in different conditions shows higher value in the transverse direction. In the transverse samples, those after ECAP processing showed increased figures of merit, which reached 3.85 × 10−3/K in the material after 4 passes of ECAP.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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References

REFERENCES

1. Horak, J., Cermak, K. and Koudelka, L.: Energy formation of antisite defects in doped Sb2Te3 and Bi2Te3 crystal. J. Phys. Chem. Solids 47, 805 (1986).10.1016/0022-3697(86)90010-7CrossRefGoogle Scholar
2. Uemura, K. and Nishida, I.: Thermoelectric Semiconductors and Their Applications (Nikkan-Kogyo Shinbun Press, Tokyo, Japan, 1988) p. 145.Google Scholar
3. Sherrer, H. and Scherrer, S.: Bismuth telluride, antimony telluride, and their solid. in CRC Handbook of Thermoelectrics, edited by Rowe, D.M. (CRC Press, Boca Raton, FL 1995), p. 211.Google Scholar
4. Oh, T.S., Hynn, D.B. and Kolomoets, N.V.: Thermoelectric properties of p -type (Bi2Te3) x (Sb2Te3)1−x prepared via bulk mechanical alloying and hot pressing. Scripta Mater. 42, 849 (2000).CrossRefGoogle Scholar
5. Im, J-T., Hartwig, K.T. and Sharp, J.: Microstructural refinement of cast p -type Bi2Te3–Sb2Te3 by equal channel angular extrusion. Acta Mater. 52, 49 (2004).10.1016/j.actamat.2003.08.025CrossRefGoogle Scholar
6. Miura, S., Sato, Y., Fukuda, K., Nishimura, K. and Ikeda, K.: Texture and thermoelectric properties of hot-extruded Bi2Te3 compound. Mater. Sci. Eng. A 277, 244 (2000).CrossRefGoogle Scholar
7. Hyun, D-B., Oh, T.S., Hwang, J-S. and Shim, J-D.: Effect of excess Te addition on the thermoelectric properties of the 20% Bi2Te3–80% Sb2Te3 single crystal and hot-pressed alloy. Scripta Mater. 44, 455 (2001).10.1016/S1359-6462(00)00631-XCrossRefGoogle Scholar
8. Yang, J., Aizawa, T., Yamamoto, A. and Ohta, T.: Thermoelectric properties of p-type (Bi2Te3) x (Sb2Te3)1−x prepared via bulk mechanical alloying and hot pressing. J. Alloys Compd. 309, 225 (2000).10.1016/S0925-8388(00)01063-XCrossRefGoogle Scholar
9. Kim, H.C., Oh, T.S. and Hyunb, D-B.: Thermoelectric properties of the p-type Bi2Te3–Sb2Te3–Sb2Se3 alloys fabricated by mechanical alloying and hot pressing. J. Phys. Chem. Solids 61, 743 (2000).10.1016/S0022-3697(99)00269-3CrossRefGoogle Scholar
10. Seo, J., Cho, D., Park, K. and Lee, C.: Fabrication and thermoelectric properties of p-type Bi0.5Sb1.5Te3 compounds by ingot extrusion. Mater. Res. Bull. 35, 2157 (2000).10.1016/S0025-5408(00)00425-6CrossRefGoogle Scholar
11. Nolas, G.S., Sharp, J. and Goldsmith, H.J.: Thermoelectrics: Basic Principles and New Materials Developments (Springer, New York, 2001).10.1007/978-3-662-04569-5CrossRefGoogle Scholar
12. Kim, T-S., Kim, I-S., Kim, T-K., Hong, S-J. and Chun, B-S.: Thermoelectric properties of p-type 25%Bi2Te3 + 75%Sb2Te3 alloys manufactured by rapid solidification and hot pressing. Mater. Sci. Eng. B 90, 42 (2002).CrossRefGoogle Scholar
13. Liu, X.D. and Park, Y.H.: Fabrication of TiAl alloys by MA-PDS process and the mechanical properties. Mater. Trans. 43, 681 (2002).Google Scholar
14. Yamashita, O. and Tomiyoshi, S.: Bismuth telluride compounds with high thermoelectric figures of merit. J. Appl. Phys. 93, 368 (2003).CrossRefGoogle Scholar
15. Segal, V.M., Reznikov, V.I., Drobyshevskiy, A.E. and Kopylov, V.I.: Plastic working of metals by simple shear. Russ. Metall. 1, 99 1981 (English translation).Google Scholar
16. Segal, V.M.: Material processing by simple shear. Mater. Sci. Eng. A 197, 157 (1995).CrossRefGoogle Scholar
17. Nishida, Y., Arima, H., Kim, J. and Ando, T.: Rotary-die equal-channel angular pressing of an Al–7 mass% Si–0.35 mass% Mg alloy. Scripta Mater. 45, 261 (2001).CrossRefGoogle Scholar
18. Sun, Z.M. and Hashimoto, H.: Fabrication of TiAl alloys by MA-PDS process and the mechanical properties. Intermetallics 11, 825 (2003).CrossRefGoogle Scholar
19. Iwahashi, Y., Wang, J., Horita, Z., Nemoto, M. and Langdon, T.: Principle of equal-channel angular pressing for the processing of ultra-fine grained materials. Scripta Mater. 35, 143 (1996).CrossRefGoogle Scholar
20. Perez, C.J. Luis: On the correct selection of the channel die in ECAP processes. Scripta Mater. 50, 387 (2004).CrossRefGoogle Scholar
21. Joraide, A.A.: Thermoelectric properties of fine-grained sintered (Bi2Te3)25–(Sb2Te3)75 p-type solid solution. J. Mater. Sci. 30, 744 (1995).CrossRefGoogle Scholar
22. Seo, J., Park, K., Lee, D. and Lee, C.: Microstructure and thermoelectric properties of p-type Bi0.5Sb1.5Te3 compounds fabricated by hot pressing and hot extrusion. Scripta Mater. 38, 477 (1998).CrossRefGoogle Scholar
23. Horak, J., Stary, Z., Lostak, P. and Pancis, J.: Anti-site defects in n-Bi2Se3 crystals. J. Phys. Chem. Solids 51, 1353 (1990).CrossRefGoogle Scholar