Hostname: page-component-8448b6f56d-t5pn6 Total loading time: 0 Render date: 2024-04-23T20:58:18.801Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of lead content on vibration fracture behavior of Pb–Sn eutectic solder

Published online by Cambridge University Press:  31 January 2011

C. M. Chuang ,
T. S. Lui  and
L. H. Chen
C. M. Chuang
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan 701, Taiwan, Republic of China
T. S. Lui*
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan 701, Taiwan, Republic of China
L. H. Chen
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan 701, Taiwan, Republic of China
*
a)Address all correspondence to this author.z7408020@email.ncku.edu.tw
Get access

Abstract

According to resonant vibration fatigue tests, near-eutectic and Pb-rich hypoeutectic Pb–Sn specimens have higher crack-propagation resistance. The tensile flow stress of Pb–Sn solders that are near eutectic composition increases with decreasing Pb content. The solders were tested after either stabilizing at 373 K or natural aging for 20 days, which gave similar results. The naturally aged specimens show that the crack-propagation resistance increases with increasing aging time. A striated deformation was found to occur in Sn grain of the lower Pb specimen. This phenomenon is correlated with a deterioration of crack-propagation resistance.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 9 , September 2001 , pp. 2644 - 2652
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1McGuire, S.M., Fine, M.E., Buck, O., and Achenbach, J.D., J. Mater. Res. 8, 2216 (1993).CrossRefGoogle Scholar
2McGuire, S.M., Fine, M.E., and Achenbach, J.D., Metal. Trans. 26A, 1123 (1995).CrossRefGoogle Scholar
3Vaynman, S., Fine, M.E., and Jeannotte, D.A., Metal. Trans. 19A, 1051 (1988).CrossRefGoogle Scholar
4Raman, V. and Reiley, T.C., Metal. Trans. 19A, 1533 (1988).CrossRefGoogle Scholar
5Kang, S.K. and Ference, T.G., J. Mater. Res. 8, 1033 (1993).CrossRefGoogle Scholar
6Sandström, R., Österberg, J-O., and Nylén, M., Mater. Sci. Technol. 9, 811 (1993).Google Scholar
7Lampe, B.T., Weld. Res. Oct., 330s (1976).Google Scholar
8Jiang, D.S., Lui, T.S., and Chen, L.H., Mater. Trans. JIM 40, 283 (1999).CrossRefGoogle Scholar
9Chuang, C.M., Lui, T.S., and Chen, L.H., Mater. Trans. JIM 41, 656 (2000).CrossRefGoogle Scholar
10Manko, H.H., Solders and Soldering, 2nd ed. (McGraw-Hill, New York, 1979), p. 81.Google Scholar
11Jiang, D.S., Lui, T.S., and Chen, L.H., Cast Metal 12, 9 (1999).Google Scholar
12Suresh, S., Metall. Trans. 14A, 2375 (1983).CrossRefGoogle Scholar
13Suresh, S., Fatigue of Materials (Cambridge University Press, New York, 1991), p. 292.Google Scholar
14Broek, D., Elementary Engineering Fracture Mechanics (Martinus Nijhoff Publishers, Boston, MA, 1984), pp. 158, 163.Google Scholar