Hostname: page-component-7bb8b95d7b-cx56b Total loading time: 0 Render date: 2024-09-19T15:54:17.705Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of Dislocation Core Spreading at Interfaces on Strength of Thin-films

Published online by Cambridge University Press:  31 January 2011

Shefford P. Baker ,
Lin Zhang  and
Huajian Gao
Shefford P. Baker
Affiliation:
Department of Materials Science and Engineering, Cornell University, Bard Hall, Ithaca, New York 14853
Lin Zhang
Affiliation:
Avant! Corporation, 46871 Bayside Parkway, Fremont, California 94538
Huajian Gao
Affiliation:
Max-Planck-Institut für Metallforschung, Heisenbergstrasse 1, D-70569 Stuttgart, Germany
Get access

Abstract

Critical strain arguments are often used to model the thickness dependence of the strength of thin films on substrates. In these arguments, plastic deformation occurs when the stress in a film is high enough that the strain energy relieved by the introduction of a misfit dislocation is sufficient to generate the line energy of that misfit. Such models typically assume compact dislocation cores. However, experimental evidence suggests that, under certain circumstances, dislocation cores may spread out into the interface between the film and the substrate. If this happens, the energy of the misfit dislocation, and the critical stress needed for its propagation, will be lowered. In this paper, the effect of dislocation core spreading on the critical stress has been modeled. The effects of interface strength, film thickness, and misfit dislocation spacing are considered.

Type
Articles
Information
Journal of Materials Research , Volume 17 , Issue 7 , July 2002 , pp. 1808 - 1813
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Frank, F.C. and Merwe, J.H. van der, Proc. R. Soc. A. 198, 216 (1949).Google Scholar
Nix, W.D., Met. Trans. A 20A, 2217 (1989).CrossRefGoogle Scholar
Freund, L.B., J. Appl. Mech. 54, 553 (1987).CrossRefGoogle Scholar
Baker, S.P., Keller, R-M., and Arzt, E., in Thin Films: Stresses and Mechanical Properties VII, edited by Cammarata, R.C., Busson, E.P., Nastasi, M., and Oliver, W.C. (Mater. Res. Soc. Symp. Proc. 505, Warrendale, PA, 1998), pp. 605–610.Google Scholar
Baker, S.P., Keller-Flaig, R-M. and Shu, J., in preparation (2002).Google Scholar
Kuan, T.S. and Murakami, M., Met. Trans. A 13A, 383 (1982).CrossRefGoogle Scholar
Müllner, P. and Arzt, E., in Thin Films: Stresses and Mechanical Properties VII, edited by Cammarata, R., Nastasi, M., Busso, E., and Oliver, W. (Mater. Res. Soc. Symp. Proc. 505, Warrendale, PA, 1998), pp. 149–154.Google Scholar
Orowan, E., Rep. Prog. Phys. 12, 185 (1949).CrossRefGoogle Scholar
Gao, H., Zhang, L., and Baker, S.P., J. Mech. Phys. Solids (2002, in press).Google Scholar
Nix, W.D., Scr. Mater. 39, 545 (1998).CrossRefGoogle Scholar
Agrawal, D.C. and Raj, R., Mater. Sci. Eng. A 126, 125 (1990).CrossRefGoogle Scholar
Shieu, F-S., Raj, R., and Sass, S.L., Acta Metall. Mater. 39, 2215 (1990).CrossRefGoogle Scholar
Hull, R., Bean, J.C., Noble, D., Hoyt, J., and Gibbons, J.F., Appl. Phys. Lett. 59, 1585 (1991).CrossRefGoogle Scholar
Keller, R-M., Baker, S.P., and Arzt, E., J. Mater. Res. 13, 1307 (1998).CrossRefGoogle Scholar
Freund, L.B., J. Appl. Phys. 68, 2073 (1990).CrossRefGoogle Scholar