Hostname: page-component-76fb5796d-25wd4 Total loading time: 0 Render date: 2024-04-25T21:17:04.798Z Has data issue: false hasContentIssue false

Characterization of GaN Grown on SiC on Si/SiO2/Si by Metalorganic Chemical Vapor Deposition

Published online by Cambridge University Press:  31 January 2011

W. L. Zhou
Affiliation:
Department of Materials Science and Engineering, Case Western Reserve University, Cleveland, Ohio 44106–7204
F. Namavar
Affiliation:
Optoelectronics Department, Spire Corporation, One Patriots Park, Bedford, Massachusetts 01730–2396
P. C. Colter
Affiliation:
Optoelectronics Department, Spire Corporation, One Patriots Park, Bedford, Massachusetts 01730–2396
M. Yoganathan
Affiliation:
Optoelectronics Department, Spire Corporation, One Patriots Park, Bedford, Massachusetts 01730–2396
M. W. Leksono
Affiliation:
Astralux, Inc., 2500 Central Avenue, Boulder, Colorado 80301–2814
J. I. Pankove
Affiliation:
Astralux, Inc., 2500 Central Avenue, Boulder, Colorado 80301–2814
Get access

Abstract

SiC (3C-SiC) was grown on the top Si layer of SIMOX (Si/SiO2/Si) by carbonization followed by chemical vapor deposition (CVD). Subsequently, GaN was deposited on the SiC by metalorganic (MO) CVD to produce a GaN/SiC/Si/SiO2/Si multilayer structure. This multilayer film was investigated by conventional transmission electron microscopy (TEM) and high-resolution (HR) TEM from cross-sectional view. The GaN layer was found to consist of predominately hexagonal gallium nitride (h-GaN), and a small fraction of cubic GaN (c-GaN) crystallites. The orientation relationship between most of the h-GaN grains and SiC (3C-SiC) was found to be (0001)Ga N||s(111)SiC; [1120]GaN||[110]SiC, while most of the c-GaN grains had an orientation relationship (001)GaN||(001)SiC; [110]GaN||[110]SiC with respect to 3C-SiC substrate. The hexagonal grains of GaN were found to grow as two variants. The defects in both h-GaN and c-GaN are also discussed.

Type
Articles
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Nakamura, S., Senoh, M., Nagahama, S., Iwasa, N., Yamada, T., Matsushita, T., Sugimoto, Y., and Kiyoku, H., Appl. Phys. Lett. 70, 868 (1997).CrossRefGoogle Scholar
2.Khan, M. A., Chen, Q., Sun, C. J., Yang, J. W., Blasingame, M., Shur, M. S., and Park, H., Appl. Phys. Lett. 68, 514 (1996).CrossRefGoogle Scholar
3.Nakamura, S., Jpn. J. Appl. Phys. 64, 1705 (1991).CrossRefGoogle Scholar
4.Sveldlov, B. N., Martin, G. A., Morkoc, H., and Smith, D. J., Appl. Phys. Lett. 67, 2063 (1995).CrossRefGoogle Scholar
5.Smith, D. J., Chandrasekhar, D., Serdlov, B., Bothechkare, A., Salvador, A., and Morko, H., Appl. Phys. Lett. 67, 1830 (1995).CrossRefGoogle Scholar
6.Ren, S. Y. and Dow, J. D., Appl. Phys. Lett. 69, 251 (1996).CrossRefGoogle Scholar
7.Kuramata, A., Hirino, K., Domen, K., Shinohara, K., and Tanahashi, T., Appl. Phys. Lett. 67, 2521 (1995).CrossRefGoogle Scholar
8.Watanabe, A., Takeuchi, T., Hirosawa, K., Amano, H., Hiramatsu, K., and Akasaki, I., J. Cryst. Growth 128, 391 (1993).CrossRefGoogle Scholar
9.Fujieda, S. and Matsumoto, Y., Jpn. J. Appl. Phys. 30, L1665 (1991).CrossRefGoogle Scholar
10.Hamdani, F., Botechkarev, A., Kim, W., Morkoc, H., Yeadon, M., Gibson, J. M., Tsen, S-C. Y., Smith, D., Reyonolds, D. C., Look, D. C., Evans, K., Litton, C. W., Mitchel, W. C., and Hemenger, P., Appl. Phys. Lett. 70, 467 (1997).CrossRefGoogle Scholar
11.Luo, J. S. and Lin, W. T., Appl. Phys. Lett. 69, 916 (1996).CrossRefGoogle Scholar
12.Namavar, F., Colter, P., Cremins-Costa, A., Wu, C. H., Gagnon, E., Perry, D., and Pirouz, P., in III-Nitride, SiC, and Diamond Materials for Electronic Devices, edited by Gaskill, D. K., Brandt, C. D., and Nemanich, R. J. (Mater. Res. Soc. Symp. Proc. 423, Pittsburgh, PA, 1996), p. 409.Google Scholar
13.Ning, X. J., Chien, F. R., Pirouz, P., Yang, J. W., and Asif Khan, M., J. Mater. Res. 11, 580 (1996).CrossRefGoogle Scholar
14.Chien, F. R., Ning, X. J., Stemmer, S., Pirouz, P., Bremser, M. D., and Davis, R. F., Appl. Phys. Lett. 68 (19), 2678 (1996).CrossRefGoogle Scholar
15.Trampert, A., Brandt, O., Yang, H., and Ploog, K. H., unpublished.Google Scholar
16.Paisley, M. J., Sitar, Z., Posthill, J. B., and Davis, R. F., J. Vac. Sci. Technol. A 3, 2643 (1989).Google Scholar