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Analysis of strength and ductility of bulk nanostructured Cu and Cu–Al alloys by means of computer modeling

Published online by Cambridge University Press:  13 December 2016

Igor V. Alexandrov*
Affiliation:
Department of Physics, Ufa State Aviation Technical University, Ufa 450008, Russia
Roza G. Chembarisova
Affiliation:
Department of Physics, Ufa State Aviation Technical University, Ufa 450008, Russia
Liliya I. Zainullina
Affiliation:
Department of Physics, Ufa State Aviation Technical University, Ufa 450008, Russia
Kun Xia Wei
Affiliation:
School of Materials Science and Engineering, Changzhou University, Changzhou 213164, People’s Republic of China; and Jiangsu Key Laboratory of Materials Surface Science and Technology, Changzhou University, Changzhou 213164, People’s Republic of China
Wei Wei*
Affiliation:
School of Materials Science and Engineering, Changzhou University, Changzhou 213164, People’s Republic of China; and Jiangsu Key Laboratory of Materials Surface Science and Technology, Changzhou University, Changzhou 213164, People’s Republic of China
Jing Hu
Affiliation:
School of Materials Science and Engineering, Changzhou University, Changzhou 213164, People’s Republic of China; and Jiangsu Key Laboratory of Materials Surface Science and Technology, Changzhou University, Changzhou 213164, People’s Republic of China
*
a) Address all correspondence to these authors. e-mail: IgorVAlexandrov@yandex.ru
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Abstract

The deformation mechanisms responsible for the strength and ductility of nanostructured Cu and Cu–Al alloys processed by high pressure torsion have been analyzed in frames of a model of elastic–plastic medium and using the available experimental data. The income of the Peierls strength, as well as solid solution hardening, dislocation hardening, twinning hardening, taking into account possible annihilation processes has been estimated. It was shown that in the Cu–5 at.% Al alloy annihilation processes contribute to the maintenance of deformation. The material is hardened by the accumulation of dislocations at the twin boundaries, postponing the moment of reaching the ultimate strength. In the Cu–16 at.% Al alloy processes of the annihilation are limited. As a result, the possibility of further deformation is limited and the degree of homogeneous deformation decreases in comparison with the case of the Cu–5 at.% Al alloy. Significantly increased concentration of deformation vacancies contributes to the destruction of the former alloy as well.

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Articles
Copyright
Copyright © Materials Research Society 2016 

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References

REFERENCES

Valiev, R.Z. and Alexandrov, I.V.: Nanostructured Materials, Obtained by the Severe Plastic Deformation (Publishing Corporation Logos, Moscow, 2000); p. 19.Google Scholar
Zehetbauer, M.J., Stüwe, H.P., Vorhauer, A., Schafler, E., and Kohout, J.: The role of hydrostatic pressure in severe plastic deformation. Adv. Eng. Mater. 5, 330 (2003).Google Scholar
Valiev, R.Z. and Alexandrov, I.V.: The Bulk Nanostructured Metallic Materials (Academkniga, Moscow, 2007); p. 93.Google Scholar
Valiev, R.Z., Islamgaliev, R.K., and Alexandrov, I.V.: Bulk nanostructured materials from severe plastic deformation. Prog. Mater. Sci. 45, 103 (2000).Google Scholar
Alexandrov, I.V. and Chembarisova, R.G.: The analysis of SPD paradox by computer modeling technique. Mater. Sci. Forum 633–634, 231 (2010).Google Scholar
Rohatgi, A.R., Vecchio, K.S., and Cray, G.T. III: The influence of stacking fault energy on the mechanical behavior of Cu, Cu–Al alloys: Deformation twinning, work hardening, and dynamic recovery. Metall. Mater. Trans. A 32A, 135 (2001).Google Scholar
Varma, S.K., Caballero, V., Ponce, J., De La Cruz, A., and Salas, D.: The effect of stacking fault energy on the microstructural development during room temperature wire drawing in Cu, Al and their dilute alloys. J. Mater. Sci. 31, 5623 (1996).Google Scholar
Tian, Y.Z., Zhao, L.J., Chen, S., Shibata, A., Zhang, Z.F., and Tsuji, N.: Significant contribution of stacking faults to the strain hardening behavior of Cu–15% Al alloy with different grain sizes. Sci. Rep. 5, 16707 (2015).Google Scholar
Velasco, L., Polyakov, M.N., and Hodge, A.M.: Influence of stacking fault energy on twin spacing of Cu and Cu–Al alloys. Scr. Mater. 83, 33 (2014).CrossRefGoogle Scholar
Zhang, Y., Tao, N.R., and Lu, K.: Effect of stacking fault energy on deformation twin thickness in Cu–Al alloys. Scr. Mater. 60, 211 (2009).Google Scholar
Xue, P., Xiao, B.L., and Ma, Z.Y.: Enhanced strength and ductility of friction stir processed Cu–Al alloys with abundant twin boundaries. Scr. Mater. 68, 751 (2013).CrossRefGoogle Scholar
An, X.H., Lin, Q.Y., Wu, S.D., Zhang, Z.F., Figueiredo, R.B., Gao, N., and Langdon, T.G.: The influence of stacking fault energy on the mechanical properties of nanostructured Cu and Cu–Al alloys processed by high-pressure torsion. Scr. Mater. 64, 954 (2011).Google Scholar
An, X.N., Wu, S.D., Zhang, Z.F., Figueiredo, R.B., Gao, N., and Langdon, T.G.: Enhanced strength-ductility synergy in nanostructured Cu and Cu–Al alloys processed by high-pressure torsion and subsequent annealing. Scr. Mater. 66, 227 (2012).CrossRefGoogle Scholar
Wei, W., Wang, S.L., Wei, K.X., Alexandrov, I.V., Du, Q.B., and Hu, J.: Microstructure and tensile properties of Cu–Al alloys processed by ECAP and rolling at cryogenic temperature. J. Alloys Compd. 678, 506 (2016).CrossRefGoogle Scholar
An, X., Lin, Q., Qu, S., Yang, G., Wu, S., and Zhang, Z-F.: Influence of stacking-fault energy on the accommodation of severe shear strain in Cu–Al alloys during equal-channel angular pressing. J. Mater. Res. 24, 3636 (2009).Google Scholar
An, X.H., Lin, Q.Y., Wu, S.D., Zhang, Z.F., Figueiredo, R.B., Gao, N., and Langdon, T.G.: Significance of stacking fault energy on microstructural evolution in Cu and Cu–Al alloys processed by high-pressure torsion. Philos. Mag. 91, 3307 (2011).Google Scholar
An, X.H., Qu, S., Wu, S.D., and Zhang, Z.F.: Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu–Al alloys during thermal annealing. J. Mater. Res. 26, 407 (2011).CrossRefGoogle Scholar
An, X.H., Wu, S.D., Wang, Z.G., and Zhang, Z.F.: Enhanced cyclic deformation responses of ultrafine-grained Cu and nanocrystalline Cu–Al alloys. Act. Mater. 74, 200 (2014).Google Scholar
An, X., Lin, Q., Wu, S., and Zhang, Z.: Improved fatigue strengths of nanocrystalline Cu and Cu–Al alloys. Mater. Res. Lett. 3, 135 (2015).Google Scholar
Stremel, M.A.: Strength of the Alloys. Part II. Deformation, Textbook for Universities (MISIS, Moscow, 1997); p. 527.Google Scholar
An, X.H., Han, W.Z., Huang, C.X., Zhang, P., Yang, G., Wu, S.D., and Zhang, Z.F.: High strength and utilizable ductility of bulk ultrafine-grained Cu–Al alloys. Appl. Phys. Lett. 92, 201915 (2008).Google Scholar
Qu, S., An, X.H., Yang, H.J., Huang, C.X., Yang, G., Zang, Q.S., Wang, Z.G., Wu, S.D., and Zhang, Z.F.: Microstructural evolution and mechanical properties of Cu–Al alloys subjected to equal channel angular pressing. Acta Mater. 57, 1586 (2009).CrossRefGoogle Scholar
Zhao, Y.H., Liao, X.Z., Horita, Z., Langdon, T.G., and Zhu, Y.T.: Determining the optimal stacking fault energy for achieving high ductility in ultrafine-grained Cu–Zn alloys. Mater. Sci. Eng., A 493, 123 (2008).Google Scholar
Estrin, Y., Tóth, L.S., Molinari, A., and Bréchet, Y.: A dislocation-based model for all hardening stages in large strain deformation. Acta Mater. 46, 5509 (1998).Google Scholar
Zehetbauer, M.: Cold work hardening in stages IV and V of fcc metals II: Model fits and physical results. Acta Mater. 41, 589 (1993).Google Scholar
Malygin, G.A.: Plasticity and strength of micro- and nanocrystalline materials (Review). Phys. Solid State 49, 1013 (2007).Google Scholar
Chembarisova, R.G. and Alexandrov, I.V.: Modelling of elastic-plastic behavior of Ti Grade—4 in the process of ECAP—K. Phys. Metall. Heat Treat. Met. 4, 50 (2016).Google Scholar
Chembarisova, R.G.: Elastic-plastic behavior of Cu during high-speed deformation. Phys. Met. Metall. 116, 627 (2015).Google Scholar
Chembarisova, R.G. and Alexandrov, I.V.: Influence of grain boundary segregation, deformation temperature on strength in ultrafine-grained Al and Ti alloys. Rev. Adv. Mater. Sci. 43, 1 (2015).Google Scholar
Alexeyev, V.A., ed.: Structure and Mechanical Properties of Metals (Metallurgy, Moscow, 1967); p. 384.Google Scholar
Remy, L.: Kinetics of F.C.C. deformation twinning and its relationship to stress-strain behaviour. Acta Metall. 26, 443 (1978).Google Scholar
Ahn, D.H., Kim, H.S., and Estrin, Y.: A semi-phenomenological constitutive model for hcp materials as exemplified by alpha titanium. Scr. Mater. 67, 121 (2012).Google Scholar
Gilman, J.: Dislocation dynamics and the response of materials. J. Appl. Mech. Rev. 21, 767 (1968).Google Scholar
Friedel, J.: Dislocations , trans. A.L. Roitburd (Mir Publishers, Moscow, 1967); p. 643.Google Scholar
Krasnikov, V.S., Kuksin, A. Yu., Mayer, A.E., and Yanilkin, A.: Plastic deformation during high-speed loading of aluminium: Multi-scale approach. Phys. Solid State 52, 1295 (2010).CrossRefGoogle Scholar
Holt, D.L.: Dislocation cell formation in metals. J. Appl. Phys. 41, 3197 (1970).Google Scholar
Schafler, E., Dubravina, A., and Kovacs, Z.: Defect characterization of equal channel angular pressed Cu by selective annealing treatment. In Ultrafine Grained Materials II, Zhu, Y.T., Langdon, T.G., Mishra, R.S., Semiatin, S.L., Saran, M.J., and Lowe, T.C., eds. (The Minerals & Materials Society, Warrendale, 2002); p. 605.Google Scholar
Han, S., Zhao, L., Jiang, Q., and Lian, J.S.: Deformation-induced localized solid-state amorphization in nanocrystalline nickel. Sci. Rep. 2, 493 (2012).Google Scholar
Szlufarska, I., Nakano, A., and Vashishta, P.: A cross over in mechanical response of nanocrystalline ceramics. Science 309, 911 (2005).Google Scholar