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Suppression of vigorous liquid Sn/Te reactions by Sn–Cu solder alloys

Published online by Cambridge University Press:  31 January 2011

Chien-Neng Liao*
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan, Republic of China
Ching-Hua Lee
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan, Republic of China
*
a)Address all correspondence to this author. e-mail: cnliao@mx.nthu.edu.tw
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Abstract

Reactions of molten Sn–xCu (x = 0.05 to 1.0) alloys with Te substrate at 250 °C were investigated. A dosage of 0.1 wt% Cu in Sn is found to be effective in suppressing the vigorous Sn/Te reaction by forming a thin CuTe at the solder/Te interface. The CuTe morphology changes from irregular clusters into a layered structure with increasing Cu content in Sn. With the same reaction time, the CuTe thickness increases proportionally to the square root of Cu content in Sn–Cu alloys, suggesting a diffusion-controlled growth for CuTe.

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Copyright
Copyright © Materials Research Society 2008

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