Skip to main content Accessibility help
×
Home
Hostname: page-component-684bc48f8b-n95np Total loading time: 1.006 Render date: 2021-04-13T18:08:36.376Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": false, "newCiteModal": false, "newCitedByModal": true }

Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections

Published online by Cambridge University Press:  31 January 2011

Jong-Hyun Lee
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121-791, Korea
Jong-Hwan Park
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121-791, Korea
Yong-Ho Lee
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121-791, Korea
Yong-Seog Kim
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121-791, Korea
Dong Hyuk Shin
Affiliation:
Department of Metallurgy and Materials Science, Hanyang University, Ansan 425-791, Kyungki-Do, Korea
Get access

Abstract

The thermodynamic stability of the solder channels at a scalloplike Cu6Sn5 layer formed between Sn-containing solders and Cu substrate was evaluated by studying the penetration behavior of the liquid solders into the grain boundaries of a Cu6Sn5 substrate. The orientational relationship between the grains of the Cu6Sn5 layer formed during reflow soldering was also analyzed using the electron backscattered diffraction technique. The results showed that liquid solders penetrate into the grain boundaries at an order of faster speed than the growth rate of the layer, which provided a direct evidence of thermodynamic stability of the channel.

Type
Rapid Communications
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below.

References

1.Quan, L., Frear, D., Grivas, D., and Morris, J.W. Jr., J. Electron. Mater. 15, 355 (1987).Google Scholar
2.Dirnfeld, S.F. and Ramon, J.J., Welding J. (Res. Suppl.) Oct., 373s (1990).Google Scholar
3.Frear, D.R., Hosking, F.M., and Vianco, P.T., Proc. Mater. Develop. Microelectron. Packag. Conf. 229 (1991).Google Scholar
4.Lau, J.H., Solder Joint Reliability (Van Nostrand Reinhold, New York, 1994), p. 93.Google Scholar
5.Klein Wassink, R.J., Soldering in Electronics, 2nd ed. (Electrochemical Publications Ltd., Ayr, Scotland, 1989).Google Scholar
6.Onishi, M. and Fujibuchi, H., Trnas. JIM 16, 539 (1975).CrossRefGoogle Scholar
7.Tu, K.N. and Thompson, R.D., Acta Metall. 30, 947 (1982).CrossRefGoogle Scholar
8.Romig, A.D. Jr., Chang, Y.A., Stephens, J.J., Frear, D.R., Marcotte, V., and Lea, C., Solder Mechanics: A State of the Art Assessment, edited by Frear, D.R., Jones, W.D., and Kinsman, K.R. (TMS, Warrendale, PA 1991), p. 29.Google Scholar
9.Mei, Z., Sunwoo, A.J., and Morris, J.W. Jr., Metall. Trans. 23A, 857 (1992).CrossRefGoogle Scholar
10.Bader, S., Gust, W., and Hieber, H., Acta Metall. Mater. 43, 329 (1995).Google Scholar
11.Kim, H.K. and Tu, K.N., Phys. Res. B 53, 16027 (1996).CrossRefGoogle Scholar
12.Schaefer, M., Laub, W., Sabee, J.M., and Fournelle, R.A., J. Electron. Mater. 25, 992 (1996).CrossRefGoogle Scholar
13.Su, L-H., Yen, Y-W., Lin, C-C., and Chen, S-W., Metall. Mater. Trans. 28B, 927 (1997).CrossRefGoogle Scholar
14.Vianco, P.T., Hopkins, P.L., Erickson, K.L., Frear, D.R., and Davidson, R., Design & Reliability of Solders and Solder Interconnections, edited by Mahidhara, R.K., Frear, D.R., Sastry, S.M.L., Murty, K.L., Liaw, P.K., and Winterbottom, W.L., Proceedings of a Symposium held during the TMS Annual Meeting, Orlando, FL, 1997, p. 161.Google Scholar
15.Schaefer, M., Laub, W., Fournelle, R.A., and Liang, J., Design & Reliability of Solders and Solder Interconnections, edited by Mahidhara, R.K., Frear, R.D., Sastry, S.M.L., Murty, K.L., Liaw, P.K., and Winterbottom, W.L., Proceedings of a Symposium held during the TMS Annual Meeting, Orlando, FL, 1997, p. 247.Google Scholar
16.Scaefer, M., Fournelle, R.A., and Liang, J., J. Electron. Mater. 27, 1167 (1998).CrossRefGoogle Scholar
17.Chada, S., Laub, W., Fournelle, R.A., and Shangguan, D., J. Electron. Mater. 28, 1194 (1999).CrossRefGoogle Scholar
18.Bartels, F., Morris, J.W. Jr., Dalke, G., and Gust, W., J. Electron Mater. 23, 787 (1994).CrossRefGoogle Scholar
19.Kim, H.K., Liou, H.K., and Tu, K.N., Appl. Phys. Lett. 66, 2337 (1995).CrossRefGoogle Scholar
20.Zuruzi, A.S., Chiu, C-H., Lahiri, S.K., and Tu, K.N., J. Appl. Phys. 86, 4916 (1999).CrossRefGoogle Scholar
21.Kim, H.K. and Tu, K.N., Appl. Phys. Lett. 67, 2002 (1995).CrossRefGoogle Scholar
22.Romig, A.D. Jr., Chang, Y.A., Stephens, J.J., Frear, D.R., Marcotte, V., and Lea, C., Solder Mechanics: A State of the Art Assessment, edited by Frear, D.R., Jones, W.D., and Kinsman, K.R. (TMS, Warrendale, PA, 1991), p. 191.Google Scholar
23.London, J. and Ashall, D.W., Brazing Soldering 11, 49 (1986).Google Scholar

Full text views

Full text views reflects PDF downloads, PDFs sent to Google Drive, Dropbox and Kindle and HTML full text views.

Total number of HTML views: 0
Total number of PDF views: 57 *
View data table for this chart

* Views captured on Cambridge Core between September 2016 - 13th April 2021. This data will be updated every 24 hours.

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections
Available formats
×
×

Reply to: Submit a response


Your details


Conflicting interests

Do you have any conflicting interests? *