Hostname: page-component-78c5997874-s2hrs Total loading time: 0 Render date: 2024-11-17T14:56:08.606Z Has data issue: false hasContentIssue false
  • English
  • Français

The microstructure evolution and properties of a Cu–Cr–Ag alloy during thermal-mechanical treatment

Published online by Cambridge University Press:  07 February 2017

Yue Liu ,
Zhou Li ,
Yexin Jiang ,
Yang Zhang ,
Zheyuan Zhou  and
Qian Lei
Yue Liu
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha 410083, China
Zhou Li*
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha 410083, China
Yexin Jiang
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha 410083, China
Yang Zhang
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha 410083, China
Zheyuan Zhou
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha 410083, China
Qian Lei*
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha 410083, China; and Department of Materials Science and Engineering, College of Engineering, University of Michigan, Ann Arbor 48109-2136, USA
*
a) Address all correspondence to these authors. e-mail: lizhou6931@csu.edu.cn
b) e-mail: qianlei@umich.edu
Get access

Abstract

A Cu–0.13Cr–0.074Ag (wt%) alloy has been synthesized by the nonvacuum melting and casting followed by thermal-mechanical treatment, and microstructure and mechanical properties have been tailored to make a trade-off between the strength and the electrical conductivity. Results illuminated that the designed alloy has a tensile strength of 473 MPa, a hardness of 140 HV, a yield strength of 446 MPa, an elongation of 10.5%, and an electrical conductivity of 94.5% IACS. Microstructure observations of the samples aged at 480 °C showed that: an fcc structure Cr-phase with a cube-on-cube orientation relationship with the Cu matrix was formed as aged for 15 min, while an ordered bcc structure Cr phase with B2 structure formed as aged for 2 h. The 3DAP results revealed that the Cr was formed to be precipitates and the Ag was formed as solutes distributing evenly in matrix. The high electrical conductivity was ascribed to the Cr element precipitated from the Cu matrix, Ag dissolved in the Cu matrix had little effect on the scattering of Cu electron.

Keywords

Cu–Cr–Ag alloythermal-mechanical treatmentCr phasemicrostructurestrength
Type
Articles
Information
Journal of Materials Research , Volume 32 , Issue 7 , 14 April 2017 , pp. 1324 - 1332
Check for updates
Copyright
Copyright © Materials Research Society 2017 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

Contributing Editor: Jürgen Eckert

References

REFERENCES

Gong, Y.L., Kim, H.S., Ren, S.Y., Zeng, S.D., and Zhu, X.K.: Strain induced hardening and softening behaviors of deformed Cu and Cu–Ge alloys. J. Mater. Res. 31, 599 (2016).Google Scholar
Zhang, Y., Tian, B.H., Volinsky, A.A., Chen, X.H., Sun, H.L., Chai, Z., Liu, P., and Liu, Y.: Dynamic recrystallization model of the Cu–Cr–Zr–Ag alloy under hot deformation. J. Mater. Res. 31, 1275 (2016).Google Scholar
Shen, L.N., Zhou, L., Dong, Q.Y., Zhu, X., and Chen, C.: Microstructure and texture evolution of novel Cu–10Ni–3Al–0.8Si alloy during hot deformation. J. Mater. Res. 31, 1113 (2016).Google Scholar
Chen, P.G., Shen, Q., Luo, G.Q., Wang, C.B., Li, M.J., and Zhang, L.M.: Role of interface tailoring by Cu coating carbon nanotubes to optimize Cu–W composites. J. Mater. Res. 30, 3757 (2015).CrossRefGoogle Scholar
Li, Z., Pan, Z.Y., Zhao, Y.Y., Xiao, Z., and Wang, M.P.: Microstructure and properties of high-conductivity, super-high-strength Cu–8.0Ni–1.8Si–0.6Sn–0.15Mg alloy. J. Mater. Res. 24, 2123 (2009).Google Scholar
Tenwick, M.J. and Davies, H.A.: Enhanced strength in high conductivity copper alloys. Mater. Sci. Eng., A 98, 543 (1988).Google Scholar
Lee, J., Jung, J.Y., and Lee, E.S.: Microstructure and properties of titanium boride dispersed Cu alloys fabricated by spray forming. Mater. Sci. Eng., A 277, 274 (2000).Google Scholar
Kim, S.H. and Lee, D.N.: Annealing behavior of alumina dispersion-strengthened copper strips under different conditions. Metall. Mater. Trans. A 33, 1605 (2002).Google Scholar
Kim, H.G., Han, S.Z., Euh, K., and Lim, S.H.: Effects of C addition and thermo-mechanical treatments on microstructures and properties of Cu–Fe–P alloys. Mater. Sci. Eng., A 530, 652 (2011).Google Scholar
Lee, K.H. and Hong, S.I.: Interfacial and twin boundary structures of nanostructured Cu–Ag filamentary composites. J. Mater. Res. 18, 2194 (2003).Google Scholar
Sun, I.H.: Effect of Nb content on the strength of Cu–Nb filamentary microcomposites. J. Mater. Res. 15, 1889 (2000).Google Scholar
Zhang, Y., Volinsky, A.A., Tran, H.T., and Chai, Z.: Aging behavior and precipitates analysis of the Cu–Cr–Zr–Ce alloy. Mater. Sci. Eng., A 650, 248 (2016).Google Scholar
Peng, L.M., Mao, X.M., Xu, K.D., and Ding, W.J.: Property and thermal stability of in situ composite Cu–Cr alloy contact cable. J. Mater. Process. Technol. 166, 193 (2005).Google Scholar
Chatterjee, A., Mitra, R., Chakraborty, A.K., Rotti, C., and Ray, K.K.: Comparative study of approaches to assess damage in thermally fatigued Cu–Cr–Zr alloy. J. Nucl. Mater. 474, 120 (2016).Google Scholar
Zhou, Z.M., Gao, J.R., Li, F., Zhang, Y.K., and Wang, Y.P.: On the metastable miscibility gap in liquid Cu–Cr alloys. J. Mater. Sci. 44, 3793 (2009).Google Scholar
Mu, S.G., Guo, F.A., and Tang, Y.Q.: Study on microstructure and properties of aged Cu–Cr–Zr–Mg–RE alloy. Mater. Sci. Eng., A 475, 235 (2008).Google Scholar
Pang, Y., Xia, C.D., Wang, M.P., and Li, Z.: Effects of Zr and (Ni, Si) additions on properties and microstructure of Cu–Cr alloy. J. Alloys Compd. 582, 786 (2014).Google Scholar
Chbihi, A., Sauvage, X., and Blavette, D.: Atomic scale investigation of Cr precipitation in copper. Acta Mater. 60, 4575 (2012).Google Scholar
Liu, Q., Zhang, X., Ge, Y., Wang, J., and Cui, J.Z.: Effect of processing and heat treatment on behavior of Cu–Cr–Zr alloys to railway contract wire. Metall. Mater. Trans. A 37, 3233 (2006).Google Scholar
Su, J.H., Dong, Q.M., Liu, P., Li, H.J., and Kang, B.X.: Research on aging precipitation in a Cu–Cr–Zr–Mg alloy. Mater. Sci. Eng., A 392, 422 (2005).Google Scholar
Mu, S.G., Tang, Y.Q., Guo, F.A., Tang, M.T., and Peng, C.H.: Thermodynamic analysis for non-vacuum melting of Cu–Cr–Zr alloy. Nonferrous Met. 1004, (2007).Google Scholar
Islamgaliev, R.K., Sitdikov, V.D., Nesterov, K.M., and Pankaratov, D.L.: Strucutre and crystallographic tecture in the Cu–Cr–Ag alloy subjected to severe plastic deformation. Rev. Adv. Mater. Sci. 39, 61 (2014).Google Scholar
Sakai, Y. and Scheneider-Muntau, H.J.: Ultra-high strength, high conductivity Cu–Ag alloy wires. Acta Mater. 45, 1017 (1997).Google Scholar
Batra, I.S., Day, G.K., Kulkarni, U.D., and Banerjee, S.: Microstructure and properties of a Cu–Cr–Zr alloy. J. Nucl. Mater. 299, 91 (2001).Google Scholar
Cheng, J.Y., Shen, B., and Yu, F.X.: Precipitation in a Cu–Cr–Zr–Mg alloy during aging. Mater. Charact. 81, 68 (2013).Google Scholar
Freudenberger, J., Lyubimova, J., and Gaganov, A.: Non-destructive pulsed field CuAg–solenoids. Mater. Sci. Eng., A 527, 2004 (2010).Google Scholar
Jia, S.G., Zheng, M.S., Liu, P., Ren, F.Z., Tian, B.H., Zhou, G.S., and Lou, H.F.: Aging properties studies in a Cu–Ag–Cr alloy. Mater. Sci. Eng., A 419, 8 (2006).Google Scholar
Lei, Q., Li, Z., Zhu, A., Qiu, W.T., and Liang, S.Q.: The transformation behavior of Cu–8.0Ni–1.8Si–0.6Sn–0.15Mg alloy during isothermal heat treatment. Mater. Charact. 62, 904 (2011).Google Scholar
Mabuchi, M. and Higashi, K.: Strengthening mechanism of Mg–Si alloy. Acta Mater. 44, 4611 (1996).Google Scholar
Hansen, N.: Hall–Petch relation and boundary strengthening. Scr. Mater. 51, 801 (2004).Google Scholar
Wang, S.C., Zhu, Z., and Starink, M.J.: Estimation of dislocation densities in cold rolled Al–Mg–Cu–Mn alloys by combination of yield strength data, EBSD and strength models. J. Microsc. 217, 174 (2005).Google Scholar
Xia, C.D., Zhang, W., and Kang, Z.Y.: High strength and high electrical conductivity Cu–Cr system alloys manufactured by hot rolling–quenching process and thermomechanical treatments. Mater. Sci. Eng., A 538, 295 (2012).Google Scholar
Liu, Y., Shao, S., Liu, K.M., Yang, X.J., and Lu, D.P.: Microstructure refinement mechanism of Cu–7Cr in situ composites with trace Ag. Mater. Sci. Eng., A 53, 141 (2012).CrossRefGoogle Scholar
Wang, Q.F., Zhang, Y.M., Guo, X.H., and Song, K.X.: Microstructure and properties of MgO/Cu composite internal oxidation layer prepared on Cu–Mg alloy surface. Mater. Mech. Eng. 58, (2015).Google Scholar
Chen, L., Zhou, B.W., Han, J.N., Xue, Y.Y., Jia, F., and Zhang, X.G.: Effects of alloying and deformation on microstructures and properties of Cu–Mg–Te–Y alloys. Trans. Nonferrous Met. Soc. China 23, 3697 (2013).Google Scholar
Zhi, H.J., Xu, Y.S., Lu, M.S., and Zheng, L.F.: Forming technology of Cu–Sn alloy contact wire for high-speed electric railway. Foundry Technol. 1591 (2009).Google Scholar
Dong, Q.Y., Shen, L.N., Cao, F., Jia, Y.L., Liao, K.L., and Wang, M.P.: Effect of thermomechanical processing on the microstructure and properties of a Cu–Fe–P alloy. J. Mater. Eng. Perform. 1531 (2015).Google Scholar
Shangina, D., Maksimenkova, Y., Bochvar, N., and Serebryany, V.: Influence of alloying with hafnium on the microstructure, texture, and properties of Cu–Cr alloy after equal channel angular pressing. J. Mater. Sci. 51, 5493 (2016).Google Scholar