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Irradiation damage of single crystal, coarse-grained, and nanograined copper under helium bombardment at 450 °C

Published online by Cambridge University Press:  22 October 2013

Weizhong Han*
Affiliation:
Center for Integrated Nanotechnologies, Los Alamos National Laboratory, Los Alamos, New Mexico 87545
E.G. Fu
Affiliation:
Center for Integrated Nanotechnologies, Los Alamos National Laboratory, Los Alamos, New Mexico 87545
Michael J. Demkowicz
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Yongqiang Wang
Affiliation:
Center for Integrated Nanotechnologies, Los Alamos National Laboratory, Los Alamos, New Mexico 87545
Amit Misra
Affiliation:
Center for Integrated Nanotechnologies, Los Alamos National Laboratory, Los Alamos, New Mexico 87545
*
a)Address all correspondence to this author. e-mail: weizhong@lanl.gov
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Abstract

The irradiation damage behaviors of single crystal (SC), coarse-grained (CG), and nanograined (NG) copper (Cu) films were investigated under Helium (He) ion implantation at 450 °C with different ion fluences. In irradiated SC films, plenty of cavities are nucleated, and some of them preferentially formed on growth defects or dislocation lines. In the irradiated CG Cu, cavities formed both in grain interior and along grain boundaries; obvious void-denuded zones can be identified near grain boundaries. In contrast, irradiation-induced cavities in NG Cu were observed mainly gathering along grain boundaries with much less cavities in the grain interiors. The grains in irradiated NG Cu are significantly coarsened. The number density and average radius of cavities in NG Cu was smaller than that in irradiated SC Cu and CG Cu. These experiments indicate that grain boundaries are efficient sinks for irradiation-induced vacancies and highlight the important role of reducing grain size in suppressing radiation-induced void swelling.

Type
Invited Feature Papers
Copyright
Copyright © Materials Research Society 2013 

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