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Enhanced tensile ductility in an electrodeposited nanocrystalline copper

Published online by Cambridge University Press:  31 January 2011

Guoyong Wang ,
Zhonghao Jiang ,
Hanzhuo Zhang  and
Jianshe Lian
Guoyong Wang
Affiliation:
Key Laboratory of Automobile Materials, College of Materials Science and Engineering, Jilin University, Changchun 130025, People’s Republic of China
Zhonghao Jiang
Affiliation:
Key Laboratory of Automobile Materials, College of Materials Science and Engineering, Jilin University, Changchun 130025, People’s Republic of China
Hanzhuo Zhang
Affiliation:
Key Laboratory of Automobile Materials, College of Materials Science and Engineering, Jilin University, Changchun 130025, People’s Republic of China
Jianshe Lian*
Affiliation:
Key Laboratory of Automobile Materials, College of Materials Science and Engineering, Jilin University, Changchun 130025, People’s Republic of China
*
a)Address all correspondence to this author. e-mail: lianjs@jlu.edu.cn
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Abstract

A fully dense nanocrystalline (nc) Cu with mean grain size of 72 nm and a broad grain size distribution was synthesized by electrodeposition. Uniaxial tensile tests were done at different strain rates and room temperature. A very high strength of 1.04 G was obtained at strain rate of 0.1 s−1. The nearly perfect plasticity with a large strain of close to 20% was displayed at specific low strain rates of 4 × 10−5 to 10−4 s−1. With increasing strain rate, the nearly perfect plasticity disappeared. Strain rate sensitivity and activation volume of the nc Cu were estimated from the flow stress at a fixed strain of 1% and a strain rate change (jump) test. It was deduced from the high strain rate sensitivity exponent of 0.08 and small activation volume of 12b3 that both dislocation and grain boundary activities would take place in this nc Cu, which explained the nearly perfect plasticity observed in the tensile test.

Keywords

ElectrodepositionCuNanostructure
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 8 , August 2008 , pp. 2238 - 2244
Copyright
Copyright © Materials Research Society 2008

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