Skip to main content Accessibility help
×
Home
Hostname: page-component-684bc48f8b-ttgcf Total loading time: 19.043 Render date: 2021-04-13T10:07:57.503Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": false, "newCiteModal": false, "newCitedByModal": true }

Effects of Cu and Ni additions to eutectic Pb–Sn solders on Au embrittlement of solder interconnections

Published online by Cambridge University Press:  31 January 2011

Jong-Hyun Lee
Affiliation:
Department of Materials Science and Engineering, Hong Ik University, 72-1, Sangsu-Dong, Mapo-Gu, Seoul 121-791, Korea
Jong-Hwan Park
Affiliation:
Department of Materials Science and Engineering, Hong Ik University, 72-1, Sangsu-Dong, Mapo-Gu, Seoul 121-791, Korea
Yong-Ho Lee
Affiliation:
Department of Materials Science and Engineering, Hong Ik University, 72-1, Sangsu-Dong, Mapo-Gu, Seoul 121-791, Korea
Yong-Seog Kim
Affiliation:
Department of Materials Science and Engineering, Hong Ik University, 72-1, Sangsu-Dong, Mapo-Gu, Seoul 121-791, Korea
Get access

Abstract

Effects Cu and Ni additions on Au embrittlement of eutectic Sn–Pb solder interconnections during a solid-state aging treatment were evaluated using a ball shear testing method. The addition resulted in a formation of Au-containing ternary intermetallic compounds, either Au–Sn–Cu or Au–Sn–Ni phase, inside the solder matrix during aging treatment. The fracture energy of the solder interconnection containing 2.9 wt% Cu remained almost the same up to 200 h of aging treatment at 150 °C, demonstrating the possibility of suppressing the Au embrittlement by forming ternary intermetallic phases inside the solder matrix.

Type
Rapid Communications
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below.

References

1.Mei, Z., Kaufmaan, M., Eslambolchi, A., and Johnson, P., in Brittle Interfacial Fracture of PBGA Packages Soldered on Electroless Nickel/Immersion Gold (48th IEEE ECTC Proc., Piscataway, NJ, 1998), p. 952.Google Scholar
2.Hung, S.C., Zheng, P.J., Lee, S.C., Lee, J.J., in The Effect of Au Plating Thickness of BGA Substrates on Ball Shear Strength under Reliability Tests (IEEE/CPMT Int. Electron. Manufact. Technol. Symp. Proc., Piscataway, NJ, 1999), p. 7.Google Scholar
3.Erich, R., Coyle, R.J., Wenger, G.M., and Primavera, A., in Shear Testing and Failure Mode Analysis for Evaluation of BGA Ball Attachment (IEEE/CPMT Int. Electron. Manufact. Technol. Symp. Proc., Piscataway, NJ, 1999), p. 16.Google Scholar
4.Zribi, A., Chromik, R.R., Presthus, R., Clum, J., Teed, K., Zavalij, L., DeVita, J., Tova, J., and Cotts, E.J., in Solder Metalization Interdiffusion in Microelectronic Interconnects (48th IEEE ECTC Proc., Piscataway, NJ, 1999), p. 451.Google Scholar
5.Minor, A.M. and Morris, J.W. Jr., Metall. Mater. Trans. A 31A, 798 (2000).CrossRefGoogle Scholar
6.Zribi, A., Chromik, R.R., Presthus, R., Teed, K., Zavalij, L., DeVita, J., Tova, J., Cotts, E.J., Clum, J.A., Erich, R., Primavera, A., Westby, G., Coyle, R.J. and Wenger, G.M., IEEE Trans. Comp. Packaging Technol. 23, 383 (2000).CrossRefGoogle Scholar
7.Minor, A.M. and Morris, J.W. Jr., J. Electron. Mater. 29, 1170 (2000).CrossRefGoogle Scholar
8.Lee, J.H., Park, D.J., Heo, J.N., Lee, Y.H., Shin, D.H., and Kim, Y.S., Scipta Mater. 42, 827 (2000).CrossRefGoogle Scholar
9.Lee, J.H., Park, D.J., Lee, Y.H., Shin, D.H., and Kim, Y.S., J. Kor. Inst. Met. Mater. 29, 1233 (2000).Google Scholar
10.Ho, C.E., Zheng, R., Luo, G.L., Lin, A.H., and Kao, C.R., J. Electron. Mater. 29, 1175 (2000).CrossRefGoogle Scholar

Full text views

Full text views reflects PDF downloads, PDFs sent to Google Drive, Dropbox and Kindle and HTML full text views.

Total number of HTML views: 0
Total number of PDF views: 25 *
View data table for this chart

* Views captured on Cambridge Core between September 2016 - 13th April 2021. This data will be updated every 24 hours.

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Effects of Cu and Ni additions to eutectic Pb–Sn solders on Au embrittlement of solder interconnections
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

Effects of Cu and Ni additions to eutectic Pb–Sn solders on Au embrittlement of solder interconnections
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

Effects of Cu and Ni additions to eutectic Pb–Sn solders on Au embrittlement of solder interconnections
Available formats
×
×

Reply to: Submit a response


Your details


Conflicting interests

Do you have any conflicting interests? *