Skip to main content Accessibility help
×
Home

A comparative study of a new microscale technique and conventional bending techniques for evaluating the interface adhesion strength in IC metallization systems

Published online by Cambridge University Press:  31 January 2011

Shoji Kamiya
Affiliation:
Nagoya Institute of Technology, Department of Mechanical Engineering, Aichi 466-8555, Nagoya, Japan; and JST CREST, Chiyoda-ku, Tokyo 102-0075, Japan
Hiroshi Shimomura
Affiliation:
Nagoya Institute of Technology, Department of Mechanical Engineering, Aichi 466-8555, Nagoya, Japan
Masaki Omiya
Affiliation:
Keio University, Department of Mechanical Engineering, Kohoku-ku Yokohama, Kanagawa 223-8522, Japan; and JST CREST, Chiyoda-ku, Tokyo 102-0075, Japan
Takashi Suzuki
Affiliation:
Fujitsu Laboratories Ltd., Kanagawa 243-0197, Japan
Corresponding
E-mail address:
Get access

Abstract

We developed a new microscale technique for evaluating the local interface adhesion in a thin film stack and we compared it with a conventional four-point bending technique. Using the microscale technique, the interface adhesion was estimated to be 3.0 J/m2 by comparing experimental results with numerical simulation results for interface crack propagation behavior. The four-point bending technique was applied to the same interface and the interface adhesion was estimated to be 4.4 J/m2 by experiment. However, this value is an overestimate because it includes the plastic deformation of epoxy resin used to fabricate the specimens. By eliminating the additional energy dissipated through plastic deformation of the epoxy resin close to the interface crack tip, the interface adhesion was evaluated to be 3.3 J/m2. This value agrees well with that obtained using the microscale technique.

Type
Articles
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below.

References

1.Kim, K.S., Aravas, N.Elasto-plastic analysis of the peel test. Int. J. Solids Struct. 24, 417 (1998)CrossRefGoogle Scholar
2.Kim, Y.H., Chaug, N.J., Chou, N.J., Kim, J.Adhesion of titanium thin film to oxide substrates. J. Vac. Sci. Technol., A 5, 2890 (1987)CrossRefGoogle Scholar
3.Venkataraman, S., Kohlstedt, D.L., Gerberich, W.W.Continuous microscrach measurements of the practical and true works of adhesion for metal/ceramic systems. J. Mater. Res. 11, 3133 (1996)CrossRefGoogle Scholar
4.Lee, G.H., Cailler, M., Kwon, S.C.Adhesion studies of magnetron-sputtered copper films on nickel substrates: Effects of substrate surface pretreatments. Thin Solid Films 185, 21 (1990)CrossRefGoogle Scholar
5.Marshall, D.B., Evans, A.G.Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interface delamination. J. Appl. Phys. 56, 2632 (1984)CrossRefGoogle Scholar
6.Rossington, C., Evans, A.G., Marshall, D.B., Khuri-Yakub, B.T.Measurement of adherence of residually stressed thin films by indentation. II. Experiments with ZnO/Si. J. Appl. Phys. 56, 2639 (1984)CrossRefGoogle Scholar
7.Charalambides, P.G., Lund, J., Evans, A.G., McMeeking, R.M.A test specimen for determining the fracture resistance of bimaterial interfaces. J. Appl. Mech. 56, 77 (1989)CrossRefGoogle Scholar
8.Lane, M.W., Dauskardt, R.H.Plasticity contributions to interface adhesion in thin-film interconnect structures. J. Mater. Res. 15, 2758 (2000)CrossRefGoogle Scholar
9.Dauskardt, R.H., Lane, M., Ma, Q., Krishna, N.Adhesion and debonding of multi-layer thin film structures. Eng. Fract. Mech. 61, 141 (1998)CrossRefGoogle Scholar
10.Lane, M.W., Liniger, E.G., Lloyd, J.R.Relationship between interfacial adhesion and electromigration in Cu metallization. J. Appl. Phys. 93, 1417 (2003)CrossRefGoogle Scholar
11.Cui, Z., Dixit, G., Xia, L-Q., Demos, A., Kim, B.H., Witty, D., M'saad, H., Dauskardt, R.H.Benchmarking four point bend adhesion testing: The effect of test parameters on adhesion energyProc. AIP Conf., Characterization and Metrology for ULSI Technology 2005 (American Institute of Physics, Melville, NY 2005) 507Google Scholar
12.Kamiya, S., Nagasawa, H., Yamanobe, K., Hanyu, H., Saka, M.A comparative study of the mechanical properties of PVD coatings evaluated by new techniques and conventional methods. Thin Solid Films 469/470, 248 (2004)CrossRefGoogle Scholar
13.Kamiya, S., Nagasawa, H., Yamanobe, K., Saka, M.A comparative study of the mechanical strength of chemical vapor-deposited diamond and physical vapor-deposited hard coatings. Thin Solid Films 473, 123 (2005)CrossRefGoogle Scholar
14.Kamiya, S., Suzuki, S., Yamanobe, K., Saka, M.Quantitative evaluation of bonding energy for the interfaces in Cu metallization systems. J. Appl. Phys. 99, 034503 (2006)CrossRefGoogle Scholar
15.Kamiya, S., Furuta, H., Omiya, M.Adhesion energy of Cu/polyimide interface in flexible printed circuits. Surf. Coat. Technol. 202, 1084 (2007)CrossRefGoogle Scholar
16.Metals Handbook 9th ed. vol. 2 (American Society for Metals, Metals Park, OH 1979)Google Scholar
17.Kramer, D., Huang, H., Kriese, M., Robach, J., Nelson, J., Wright, A., Bahr, D., Gerberich, W.W.Yield strength predictions from the plastic zone around nanocontacts. Acta Mater. 47, 333 (1999)CrossRefGoogle Scholar
18.Wei, Y., Hutchinson, J.W.Nonlinear delamination mechanics for thin films. J. Mech. Phys. Solids 45, (7)1137 (1997)CrossRefGoogle Scholar
19.Volinsky, A.A., Moody, N.R., Gerberich, W.W.Interfacial toughness measurements for thin films on substrates. Acta Mater. 50, 441 (2002)CrossRefGoogle Scholar
20.Smith, R.S.The effect of ultra-violet light curing on the molecular structure and fracture properties of an ultra low-k material. Doctoral thesis The University of Texas, Austin 2007Google Scholar
21.Irwin, G.R.Analysis of stresses and strains near the end of a crack traversing a plate. J. Appl. Phys. 24, 361 (1957)Google Scholar
22.Sun, C.T., Manoharan, M.G.Strain energy release rates of an interfacial crack between two orthotropic solids. J. Compos. Mater. 23, 460 (1989)CrossRefGoogle Scholar
23.Yuuki, R., Cho, S.B.Efficient boundary element analysis of stress intensity factors for interface cracks in dissimilar materials. Eng. Fract. Mech. 34, 179 (1989)Google Scholar
24.Ikeda, T., Sun, C.T.Stress intensity factor analysis for an interface crack between dissimilar isotropic materials under thermal stress. Int. J. Fract. 111, 229 (2001)CrossRefGoogle Scholar
25.Fernlund, G., Spelt, J.K.Failure loading prediction of structural adhesive joints: II. Experimental results. Int. J. Adhes. Adhes. 11, (4)221 (1991)CrossRefGoogle Scholar
26.Fernlund, G., Spelt, J.K.Mixed-mode fracture characterization of adhesive joints. Compos. Sci. Technol. 50, (4)441 (1994)CrossRefGoogle Scholar
27.Merrill, C.C., Ho, P.S.Effect of mode-mixity and porosity on interfacial fracture of low-k dielectricsMaterials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics—2004 edited by R.J. Carter, C.S. Hau-Riege, G.M. Kloster, T-M. Lu, and S.E. Schulz (Mater. Res Soc. Symp. Proc. 812, Warrendale, PA 2004)F5.7Google Scholar
28.Cao, H.C., Evans, A.G.An experimental study of the fracture resistance of biomaterial interfaces. Mech. Mater. 7, 295 (1989)CrossRefGoogle Scholar
29.Suo, Z.Failure of brittle adhesive joints. Appl. Mech. Rev. 5, 276 (1990)CrossRefGoogle Scholar
30.Thouless, M.D.Fracture of a model interface under mixed-mode loading. Acta Metall. Mater. 38, 1135 (1990)CrossRefGoogle Scholar
31.Suo, Z.Debond mechanics of brittle materials. Scr. Metall. Mater. 38, 1011 (1991)CrossRefGoogle Scholar
32.Wang, J.S., Suo, Z.Experimental determination of interfacial fracture toughness curves using brazil-nut-sandwiches. Acta Metall. Mater. 38, 1279 (1991)CrossRefGoogle Scholar

Full text views

Full text views reflects PDF downloads, PDFs sent to Google Drive, Dropbox and Kindle and HTML full text views.

Total number of HTML views: 0
Total number of PDF views: 23 *
View data table for this chart

* Views captured on Cambridge Core between September 2016 - 24th January 2021. This data will be updated every 24 hours.

Hostname: page-component-76cb886bbf-fv2z2 Total loading time: 0.291 Render date: 2021-01-24T12:41:25.664Z Query parameters: { "hasAccess": "0", "openAccess": "0", "isLogged": "0", "lang": "en" } Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": false, "newCiteModal": false }

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

A comparative study of a new microscale technique and conventional bending techniques for evaluating the interface adhesion strength in IC metallization systems
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

A comparative study of a new microscale technique and conventional bending techniques for evaluating the interface adhesion strength in IC metallization systems
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

A comparative study of a new microscale technique and conventional bending techniques for evaluating the interface adhesion strength in IC metallization systems
Available formats
×
×

Reply to: Submit a response


Your details


Conflicting interests

Do you have any conflicting interests? *