This article has been cited by the following publications. This list is generated based on data provided by
Achievement of high planarization efficiency in CMP of copper at a reduced down pressure.
Effect of slurry components on chemical mechanical polishing of copper at low down pressure and a chemical kinetics model.
Thin Solid Films,
Kannan, M. P.
Ganga Devi, T.
Thermal decomposition kinetics of potassium iodate.
Journal of Thermal Analysis and Calorimetry,
A new weakly alkaline slurry for copper planarization at a reduced down pressure.
Journal of Semiconductors,
Frankel, G. S.
Corrosion Inhibition of Aluminum Alloy 2024-T3 by Sodium Molybdate.
Journal of The Electrochemical Society,
Inhibition effect of glycine on molybdenum corrosion during CMP in alkaline H2O2 based abrasive free slurry.
Applied Surface Science,
Chemical Mechanical Polishing of Molybdenum in Potassium Iodate-Based Acidic Slurries.
ECS Journal of Solid State Science and Technology,
A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization.
Journal of Materials Research,